Abstract: A server (10), a server rack (50) and a data centre (100, 150) are provided. The server (10) includes a housing (12) defining a gaseous flow passage. A plurality of active components (14) and a plurality of passive components (16) are provided in the housing (12). A plurality of liquid cooling devices (18) is attached to respective ones of the active components (14).

Abstract: Embodiments relate to implantable-lead devices that include one or more materials with altered morphology and methods for making and using the same. Specifically, the morphology of electrodes and/or one or more other implant-device materials can be textured to include micro- and/or nanoscale topographical features, which can reduce in vivo fibrotic response and thereby improve signal-to-noise ratios and short-term extractability of the devices.

Abstract: Embodiments are disclosed for ground plane estimation (GPE) using a LiDAR semantic network. In an embodiment, a method comprises: obtaining a point cloud from a depth sensor of a vehicle operating in an environment; encoding the point cloud; estimating, using a deep learning network with the encoded point cloud as input, a ground plane in the environment; planning a path through the environment based on a drivable area of the estimated ground plane; and operating the vehicle, the vehicle along the path. The deep learning network includes a two-dimensional (2D) convolutional backbone, a detection head for detecting objects and a GPE head for estimating the ground plane. In an embodiment, point pillars are used to encode the point cloud.

Abstract: Disclosed herein is a reinforced polymeric material, where a polymeric matrix material is filled with a 2-dimensional material that has an average aspect ratio of from 100 to 2000 and a fibrous reinforcing material. The composition may optionally also include a curing agent when needed. The material may be useful in providing a moulded material with improved deformation properties.

Abstract: In a general aspect, an apparatus can include a metal layer, a first semiconductor die, a second semiconductor die, a molding compound, a first electrical contact and a second electrical contact. The first semiconductor die can have a first side disposed on the metal layer. The second semiconductor die can have a first side disposed on the metal layer. The metal layer can electrically couple the first side of the first semiconductor die with the first side of the second semiconductor die. The molding compound can at least partially encapsulate the metal layer, the first semiconductor die and the second semiconductor die. The first electrical contact can be to a second side of the first semiconductor die and disposed on a surface of the apparatus. The second electrical contact can be to a second side of the second semiconductor die and disposed on the surface of the apparatus.

Abstract: Systems and methods for overriding ad hoc talkgroup auto-dropping. One example method includes determining whether a contextual condition for a portable communications device meets a talkgroup formation criterion associated with an ad hoc talkgroup, and, in response to determining that the contextual condition meets the talkgroup formation criterion, sending a talkgroup identifier identifying the ad hoc talkgroup to the device. The method includes receiving a contextual condition update for the device and determining whether the update meets the talkgroup formation criterion. The method includes, in response to determining that the update does not meet the talkgroup formation criterion, sending an audio mute command based on the talkgroup identifier and a notification requesting an override action to the device. The method includes, when an override action indication is received from the device during a standby period, sending an audio unmute command based on the talkgroup identifier to the device.

Abstract: The present disclosure provides an electrical connector. The electrical connector comprises a tongue, a plurality of terminals comprising a plurality of first terminals and a plurality of second terminals and at least one common grounding member. Each terminal has a plate-shape contact portion. The terminals comprise ground terminals. The plate-shape contact portion of each first terminal is provided on a first face of the tongue. The plate-shape contact portion of each the second terminal is provided on a second face of the tongue. The common grounding member comprises a plurality of connection portions. The connection portion extends in a thickness direction and is connected to the plate-shape contact portion of the corresponding ground terminal. Therefore, it can shorten the loop inductance of the signal and shorten the return path to improve signal integrity (SI).

Abstract: A submicron structure includes a silica body defining a plurality of pores that are suitable to receive molecules therein, the silica body further defining an outer surface between pore openings of said plurality of pores; and a plurality of anionic molecules attached to the outer surface of the silica body. The anionic molecules provide hydrophilicity to the submicron structure and are suitable to provide repulsion between other similar submicron structures, and the submicron structure has a maximum dimension less than one micron.

Abstract: In a general aspect, an apparatus can include a metal layer, a first semiconductor die, a second semiconductor die, a molding compound, a first electrical contact and a second electrical contact. The first semiconductor die can have a first side disposed on the metal layer. The second semiconductor die can have a first side disposed on the metal layer. The metal layer can electrically couple the first side of the first semiconductor die with the first side of the second semiconductor die. The molding compound can at least partially encapsulate the metal layer, the first semiconductor die and the second semiconductor die. The first electrical contact can be to a second side of the first semiconductor die and disposed on a surface of the apparatus. The second electrical contact can be to a second side of the second semiconductor die and disposed on the surface of the apparatus.

Abstract: The invention relates to a new lactic acid bacteria (LAB), Lactobacillus fermentum PS150, and a bioactive protein produced by the LAB has advantageous effect in improving mood disorder, enhancing cognitive functions in brain and treating or preventing a neurodegenerative disease.