Abstract: The present disclosure provides a board edge connector. The board edge connector includes an insulating housing and a plurality of terminal groups. The insulating housing includes a supporting portion. Each of the terminal groups includes a plurality of terminals. Each terminal includes a holding portion, a resilient contact portion, a tail portion and a connecting portion. The terminal of at least one of the terminal groups has a longer connecting portion than the rest of the terminal groups. The longer connecting portion includes a supported portion extending in a front and back direction. The supporting portion includes a plurality of supporting grooves disposed thereon. The supported portion of the terminal is disposed on and supported by the supporting grooves.

Abstract: Sending, receiving and transmitting apparatuses of a dual-power system and a fingerprint recognition system are provided. The dual-power system includes a first power system for providing a first high voltage signal and a first low voltage signal and a second power system for providing a second high voltage signal and a second low voltage signal, and a voltage difference between the first high voltage signal and the first low voltage signal is equal to that between the second high voltage signal and the second low voltage signal. The sending apparatus includes a first detection circuit for outputting a detection signal indicating whether voltages of the first and second low voltage signals are equal; and a first transmission circuit for transmitting an output signal of the dual-power system or provide a first voltage to an output terminal of the sending apparatus, based on the detection signal.

Abstract: In a general aspect, an apparatus can include a metal layer, a first semiconductor die, a second semiconductor die, a molding compound, a first electrical contact and a second electrical contact. The first semiconductor die can have a first side disposed on the metal layer. The second semiconductor die can have a first side disposed on the metal layer. The metal layer can electrically couple the first side of the first semiconductor die with the first side of the second semiconductor die. The molding compound can at least partially encapsulate the metal layer, the first semiconductor die and the second semiconductor die. The first electrical contact can be to a second side of the first semiconductor die and disposed on a surface of the apparatus. The second electrical contact can be to a second side of the second semiconductor die and disposed on the surface of the apparatus.

Abstract: In a general aspect, a chip-on-lead semiconductor device package can include a leadframe having a plurality of signal leads. The plurality of signal leads can include at least two signal leads each having a first face with a first surface area and, opposite the first face, a second face with a second surface area, the second faces of the at least two signal leads being exposed on a surface of the chip-on-lead device package. The plurality of signal lead can also include at least one signal lead having a first face with a third surface area and, opposite the first face of the at least one signal lead, a second face with the second surface area, the second face of the at least one signal lead being exposed on the surface of the chip-on-lead semiconductor device package.

Abstract: A technique for interconnecting PV cells using partial overlapping method is disclosed with at least one part of the PV cell is applied with a non-conductive bonding material. Another PV cell is then placed above this PV cell in a partial overlapping manner and depending on the type of bonding material used, the necessary curing step is performed. The disclosed method can be used to interconnect 1) PV cells; 2) shingled PV strings; 3) PV cell and other components to external circuitry, within a shingled PV module. The interconnecting method also improves the aestheticism, reliability, and manufacturability of shingled PV modules that are constructed with shingled PV cells.

Abstract: A submicron structure having a silica body defining a plurality of pores is described. The submicron body may be spherical or non-spherical, and may include a cationic polymer or co-polymer on the surface of said silica body. The submicron structure may further include an oligonucleotide and be used to deliver the oligonucleotide to a cell. The submicron structure may further include a therapeutic agent and be used to deliver the therapeutic agent to a cell. An oligonucleotide and therapeutic agent may be used together. For example, when the oligonucleotide is an siRNA, the composition may be used to decrease cellular resistance to the therapeutic agent by decreasing translation of a resistance gene.

Abstract: Provided for example is a method of forming texture comprising: (I) providing a polymeric layer with first and second sides, wherein the polymeric layer is made from a polymeric material that gels on contact with a gelling agent, and wherein the first side is gelled, with gelling extending into the polymeric layer but not to the second side; (II) contacting the second side of the polymeric layer with a foamy aqueous solution of surfactant (one or more), the aqueous foam being in the process of collapsing during the contacting, wherein the aqueous solution of surfactant is effective to gel the polymeric material; (III) applying a aqueous medium to the second surface with sufficient force or agitation so as to remove a portion of the polymeric material; and (IV) curing the remaining polymeric material without, following the contacting step, further contacting the polymer layer with a gelling component.

Abstract: The invention provides a two phase heat transfer device comprising an inlet for receiving a heat transfer fluid, and; an array of heat transfer fins in spaced relation; primary spaces between said heat transfer fins defining primary channels parallel to a path from the inlet to outlet, and; oblique spaces between said heat transfer fins defining oblique channels arranged at an angle to said primary channels. It is preferable that walls defining the primary and oblique spaces provide nucleate boiling regions and the interruption of fully developed convective boiling regions when a heat transfer fluid is passed through the inlet to the outlet.

Abstract: A glove that includes a polymeric, elastomeric, or latex composition including a blend of a polyurethane material, an acrylonitrile-butadiene material and an ethylene vinyl acetate material; at least one of a carnauba or a modified polyethylene wax; and hard filler particles having a hardness greater than 4 Mohs or more, thereby increasing the abrasion-resistance and/or cut-resistance of the glove, is disclosed.

Abstract: A submicron structure having a silica body defining a plurality of pores is described. The submicron body may be spherical or non-spherical, and may include a cationic polymer or co-polymer on the surface of said silica body. The submicron structure may further include an oligonucleotide and be used to deliver the oligonucleotide to a cell. The submicron structure may further include a therapeutic agent and be used to deliver the therapeutic agent to a cell. An oligonucleotide and therapeutic agent may be used together. For example, when the oligonucleotide is an siRNA, the composition may be used to decrease cellular resistance to the therapeutic agent by decreasing translation of a resistance gene.

Abstract: The present disclosure provides a board edge connector. The board edge connector includes an insulating housing and a plurality of terminal groups. The insulating housing includes a supporting portion. Each of the terminal groups includes a plurality of terminals. Each terminal includes a holding portion, a resilient contact portion, a tail portion and a connecting portion. The terminal of at least one of the terminal groups has a longer connecting portion than the rest of the terminal groups. The longer connecting portion includes a supported portion extending in a front and back direction. The supporting portion includes a plurality of supporting grooves disposed thereon. The supported portion of the terminal is disposed on and supported by the supporting grooves.

Abstract: A method for controlled delivery of a substance into a body includes administering a plurality of containment vessels into the body, in which each of the plurality of containment vessels includes a quantity of the substance loaded therein prior to the administering; and providing a time-varying magnetic field such that the plurality of containment vessels are exposed thereto to cause a release of at least a portion of the substance from the plurality of containment vessels. Each of the plurality of containment vessels has an average outer diameter less than about 1 ?m.

Abstract: In a general aspect, an apparatus can include a metal layer, a first semiconductor die, a second semiconductor die, a molding compound, a first electrical contact and a second electrical contact. The first semiconductor die can have a first side disposed on the metal layer. The second semiconductor die can have a first side disposed on the metal layer. The metal layer can electrically couple the first side of the first semiconductor die with the first side of the second semiconductor die. The molding compound can at least partially encapsulate the metal layer, the first semiconductor die and the second semiconductor die. The first electrical contact can be to a second side of the first semiconductor die and disposed on a surface of the apparatus. The second electrical contact can be to a second side of the second semiconductor die and disposed on the surface of the apparatus.

Abstract: A methodology and apparatus for layered licensing is described. A licensable item is detected on a device. A legacy license associated with the licensable item is accessed, wherein the legacy license corresponds to a legacy licensing policy. A layered license associated with the licensable item is accessed, wherein the layered license corresponds to a layered licensing policy. The legacy licensing policy and the layered licensing policy are integrated into an integrated license, and the integrated license is enforced.

Abstract: A submicron structure includes a silica body defining a plurality of pores that are suitable to receive molecules therein, the silica body further defining an outer surface between pore openings of said plurality of pores; and a plurality of anionic molecules attached to the outer surface of the silica body. The anionic molecules provide hydrophilicity to the submicron structure and are suitable to provide repulsion between other similar submicron structures, and the submicron structure has a maximum dimension less than one micron.

Abstract: A light apparatus includes a first carrier with an optoelectronic component for generating electromagnetic radiation, a second carrier with at least one electronic component for controlling the optoelectronic component, and a thermally insulating layer arranged between, and attached to, the first and second carriers.

Abstract: A navigation method in a first communication device including determining a meeting place for the first communication device and at least one second communication device, according to present location and user preference of respective communication device, and setting a navigation route from the present location of the first communication device to the determined meeting place.

Abstract: A submicron structure includes a silica body defining a plurality of pores that are suitable to receive molecules therein, the silica body further defining an outer surface between pore openings of the plurality of pores; and a plurality of anionic molecules attached to the outer surface of the silica body. The anionic molecules provide hydrophilicity to the submicron structure and are suitable to provide repulsion between other similar submicron structures, and the submicron structure has a maximum dimension less than one micron.