Patents by Inventor Liping Guo

Liping Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200050385
    Abstract: The present disclosure describes apparatuses and methods for virtualizing isolation areas of solid-state storage media. In some aspects, a storage media accelerator determines, via a storage media interface, a geometry of solid-state storage media. The accelerator selects, based on the geometry, an area of the solid-state storage media as an isolated unit of storage. A physical address of the isolated unit of storage is then mapped to a virtual address. The accelerator exposes, via the virtual address, the isolated unit of storage through a host interface to enable host access of the isolated unit of storage. The accelerator may also remap the isolated unit of storage to other areas of the solid-state storage media without host interaction. By so doing, the accelerator may provide virtualized isolation and partitioning functionalities to a host, while efficiently handling lower-level storage media functions, such as wear leveling and load balancing, without host involvement.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Applicant: Marvell World Trade Ltd.
    Inventors: Scott Furey, Liping Guo, Salil Suri, Yingdong Li
  • Publication number: 20200050402
    Abstract: A non-volatile memory express (NVMe) switch is located in between a host and storage. A first storage access command is received from a host via a peripheral computer interface express (PCIe) interface to access the storage. The first storage access command conforms to NVMe and the storage comprises two or more solid-state drives (SSDs). A respective second storage access command is sent to the two or more SSDs based on the first storage access command. A respective completion is received from each of the two or more SSDs based on the respective second storage access command. A completion is sent to the host via the PCIe interface based on the received completions from each of the two or more SSDs.
    Type: Application
    Filed: August 5, 2019
    Publication date: February 13, 2020
    Inventors: Scott Furey, Salil Suri, Liping Guo, Chih-Lung Liu, Yingdong Li
  • Publication number: 20200050470
    Abstract: The present disclosure describes apparatuses and methods for automatically mapping virtual functions to storage media to enable single root input output virtualization. A storage media switch manages access to virtual functions that execute behind a storage media interface managed by the switch. The switch includes a host interface through which the switch receives host commands. The switch determines virtual function identifiers associated with the host commands and automatically selects the virtual functions of the storage media based on the virtual function identifiers. The switch executes the host commands over the storage media interface using the virtual functions, and after execution, responds via the host interface to each of the host commands. By automatically mapping virtual functions in this way, the switch automatically enables single root input output virtualization of storage media, including storage media that is without native support for input output virtualization.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Applicant: Marvell World Trade Ltd.
    Inventors: Liping Guo, Yingdong Li, Scott Furey, Salil Suri
  • Publication number: 20200050505
    Abstract: A NVM switch has been designed that allows multiple hosts to simultaneously and independently access a single port NVM device. While this active-active multi-host usage configuration allows for a variety of uses of lower cost single port NVM device, an issue with one of the hosts can delay or block transactions between the other host and the NVM device. The NVM switch includes logic that isolates activity of the multiple hosts despite logic of the switch being shared across the hosts. When the switch detects an issue with one host (“error host”), the switch clears the in-flight commands of the error host and flushes data of the error host. Likewise, the NVM switch ensure proper communication of error reporting from attached NVM devices to the multiple hosts.
    Type: Application
    Filed: August 5, 2019
    Publication date: February 13, 2020
    Applicant: Marvell World Trade Ltd.
    Inventors: Liping Guo, Yingdong Li, Scott Furey, Salil Suri
  • Patent number: 9958884
    Abstract: A method includes, in at least one aspect, determining a relative delay of a signal path with respect to a timing budget; determining that the signal path is active; determining a value of a voltage being supplied to the signal path; and causing an adjustment in the voltage being supplied to the signal path based on the relative delay, the signal path being active, and the value of the voltage being supplied to the signal path.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: May 1, 2018
    Assignee: Marvell International Ltd.
    Inventors: Jun Zhu, Liping Guo, Joseph Jun Cao
  • Patent number: 9515961
    Abstract: A method includes receiving flits forwarded from an upstream router into a first input virtual channel (VC) associated with an input port. The flits are associated with packets originated from a first Intellectual Property (IP) core and forwarded to a second IP core. The flits are stored in a VC storage associated with the first input VC. The method further includes performing link width conversion based on a width of the flits being different from a width of an output port. Link width conversion includes accumulation of the flits when the width of the output port is wider and unpacking of the flits when the width of the output port is narrower. Credits are generated based on the flits being forwarded from the first input VC to the output port. The credits are sent to the upstream router to enable receiving more flits from the upstream router.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: December 6, 2016
    Assignee: Sonics, Inc.
    Inventors: Liping Guo, Doddaballapur N. Jayasimha, Jeremy Chan
  • Patent number: 9299645
    Abstract: A semiconductor device is assembled from a lead frame. The device has a semiconductor die mounted on a flag of the lead frame. A mold compound forms a housing that covers the die. Lead fingers surround the die. Each lead finger has an inner lead length that is covered by the housing and an outer lead length that protrudes from the housing. The inner lead length extends from an edge of the housing towards the die. The inner lead length has an intermediate region that has been bent to form a notch. Bond wires electrically connect electrodes of the die to respective inner lead lengths.
    Type: Grant
    Filed: November 23, 2014
    Date of Patent: March 29, 2016
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Lei Wang, Liping Guo, Jinsheng Wang
  • Patent number: 9223327
    Abstract: In some implementations, a system includes a universal adaptive voltage scaling monitor (UAVSM) and an adaptive voltage scaling (AVS) controller. The UAVSM is configured to delay a first signal generated by a signal path by an adjustable time period, compare the delayed first signal and a second signal associated with the signal path, and provide an error signal indicating a result of the comparison, where the error signal is asserted when the result of the comparison indicates that the delayed first signal is different from the second signal. The AVS controller is configured to provide a first control signal indicating that the voltage is to be increased when the received error signal is an asserted error signal, and provide a second control signal indicating that the voltage is to be decreased when the received error signal is an unasserted error signal and the signal path is active.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: December 29, 2015
    Assignee: Marvell International Ltd.
    Inventors: Jun Zhu, Liping Guo, Joseph Jun Cao
  • Patent number: 9196557
    Abstract: A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: November 24, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jianshe Bi, Lanping Bai, Quan Chen, Liping Guo, Yanbo Xu
  • Publication number: 20150332985
    Abstract: A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
    Type: Application
    Filed: November 26, 2014
    Publication date: November 19, 2015
    Inventors: Jianshe Bi, Lanping Bai, Quan Chen, Liping Guo, Yanbo Xu
  • Publication number: 20150279765
    Abstract: A semiconductor device is assembled from a lead frame. The device has a semiconductor die mounted on a flag of the lead frame. A mold compound forms a housing that covers the die. Lead fingers surround the die. Each lead finger has an inner lead length that is covered by the housing and an outer lead length that protrudes from the housing. The inner lead length extends from an edge of the housing towards the die. The inner lead length has an intermediate region that has been bent to form a notch. Bond wires electrically connect electrodes of the die to respective inner lead lengths.
    Type: Application
    Filed: November 23, 2014
    Publication date: October 1, 2015
    Inventors: Lei Wang, Liping Guo, Jinsheng Wang
  • Publication number: 20150069011
    Abstract: A method comprising etching a film comprising electrically conductive structures according to a pattern using an aqueous etching solution to provide an etched region having a first conductivity and an unetched region having a second conductivity, the second conductivity being greater than the first conductivity, wherein the aqueous etching solution either comprises 25 to 65% by weight of phosphoric acid and 1 to 18% by weight of nitric acid, or the aqueous etching solution comprises 65 to 75% by weight of nitric acid.
    Type: Application
    Filed: August 7, 2014
    Publication date: March 12, 2015
    Inventors: Liping Guo, Erin R. Bell, Chaofeng Zou, Lawrence S. Dahedl
  • Publication number: 20140314076
    Abstract: A method includes receiving flits forwarded from an upstream router into a first input virtual channel (VC) associated with an input port. The flits are associated with packets originated from a first Intellectual Property (IP) core and forwarded to a second IP core. The flits are stored in a VC storage associated with the first input VC. The method further includes performing link width conversion based on a width of the flits being different from a width of an output port. Link width conversion includes accumulation of the flits when the width of the output port is wider and unpacking of the flits when the width of the output port is narrower. Credits are generated based on the flits being forwarded from the first input VC to the output port. The credits are sent to the upstream router to enable receiving more flits from the upstream router.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 23, 2014
    Applicant: Sonics, Inc.
    Inventors: Liping Guo, Doddaballapur N. Jayasimha, Jeremy Chan
  • Patent number: 8798038
    Abstract: A method for generating headers in packetized protocols for a flexible routing network for a Network on a Chip (NoC) architecture includes generating packets based on transmission traffic received from an initiator or a target connected to a routing network that connects disparate initiators and targets. Logic to generate the packets is in an interface located between the initiator or the target and the routing network. A header portion of a packet is variable in length and includes a header payload and header control information. Each of the header portion and the body portion includes one or more standard sized transmission units. The size of the transmission units and width of the header payload are determined by logic included in the interface. The width of the header payload is determined based on orthogonal groups with each of the orthogonal groups being associated with targets sharing an initiator thread.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: August 5, 2014
    Assignee: Sonics, Inc.
    Inventors: Doddaballapur N. Jayasimha, Jeremy Chan, Liping Guo
  • Patent number: 8711867
    Abstract: A method includes receiving flits forwarded from an upstream router into a first input virtual channel (VC) associated with an input port. The flits are associated with packets originated from a first Intellectual Property (IP) core and forwarded to a second IP core. The flits are stored in a VC storage associated with the first input VC. The method further includes performing link width conversion based on a width of the flits being different from a width of an output port. Link width conversion includes accumulation of the flits when the width of the output port is wider and unpacking of the flits when the width of the output port is narrower. Credits are generated based on the flits being forwarded from the first input VC to the output port. The credits are sent to the upstream router to enable receiving more flits from the upstream router.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: April 29, 2014
    Assignee: Sonics, Inc.
    Inventors: Liping Guo, Doddaballapur N. Jayasimha, Jeremy Chan
  • Publication number: 20130051397
    Abstract: A method includes receiving flits forwarded from an upstream router into a first input virtual channel (VC) associated with an input port. The flits are associated with packets originated from a first Intellectual Property (IP) core and forwarded to a second IP core. The flits are stored in a VC storage associated with the first input VC. The method further includes performing link width conversion based on a width of the flits being different from a width of an output port. Link width conversion includes accumulation of the flits when the width of the output port is wider and unpacking of the flits when the width of the output port is narrower. Credits are generated based on the flits being forwarded from the first input VC to the output port. The credits are sent to the upstream router to enable receiving more flits from the upstream router.
    Type: Application
    Filed: August 26, 2011
    Publication date: February 28, 2013
    Applicant: SONICS, INC.
    Inventors: LIPING GUO, DODDABALLAPUR N. JAYASIMHA, JEREMY CHAN
  • Publication number: 20130051385
    Abstract: A method for generating headers in packetized protocols for a flexible routing network for a Network on a Chip (NoC) architecture includes generating packets based on transmission traffic received from an initiator or a target connected to a routing network that connects disparate initiators and targets. Logic to generate the packets is in an interface located between the initiator or the target and the routing network. A header portion of a packet is variable in length and includes a header payload and header control information. Each of the header portion and the body portion includes one or more standard sized transmission units. The size of the transmission units and width of the header payload are determined by logic included in the interface. The width of the header payload is determined based on orthogonal groups with each of the orthogonal groups being associated with targets sharing an initiator thread.
    Type: Application
    Filed: August 26, 2011
    Publication date: February 28, 2013
    Applicant: SONICS,INC.
    Inventors: Doddaballapur N. Jayasimha, Jeremy Chan, Liping Guo
  • Patent number: D861959
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: October 1, 2019
    Assignee: Shenzhen Ouyixin Technology Co., Ltd
    Inventor: Liping Guo
  • Patent number: D885638
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: May 26, 2020
    Assignee: Shenzhen Ouyixin Technology Co., Ltd.
    Inventor: Liping Guo
  • Patent number: D897022
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: September 22, 2020
    Assignee: SHENZHEN OUYIXIN TECHNOLOGY CO., LTD.
    Inventor: Liping Guo