Abstract: A drug coated balloon includes a balloon body and a drug loaded coating layer. The drug loaded coating layer includes a first drug loaded coating component having at least two controllable sustained release drugs with different drug release kinetics, and a second drug loaded coating component including an active drug. The second drug loaded coating component is dispersed among the controllable sustained release drugs and couples the controllable sustained release drugs on the balloon body. The first and second drug loaded coating components are both non-hydrophilic compositions. The drug coated balloon provides sufficient initial drug loading dosage to the lesion site, and has adjustable drug release rate, thereby allowing the drug coated balloon to provide bioactive drugs to the treatment site at different stages of the cascade reaction of vascular restenosis, providing the controllable long-acting therapeutic drugs, and improving the overall vascular drug release efficacy.

Abstract: A light-emitting device includes a semiconductor epitaxial unit having a first surface and a second surface that are opposite to each other, and including a first semiconductor layer, an active layer, and a second semiconductor layer that are disposed sequentially in such order in a direction from the first surface to the second surface. The active layer includes a quantum well structure that has n periodic units, each of which includes a well layer and a barrier layer that are sequentially disposed. The second semiconductor layer includes a cladding layer and a current spreading layer. A ratio of a thickness of the current spreading layer to a current density of the light-emitting device ranges from 0.6 to 4. A light-emitting apparatus is also provided in the disclosure.

Abstract: A light-emitting diode includes a semiconductor epitaxial structure which includes a first semiconductor layer, an active layer, and a second semiconductor layer that are stacked in sequence. The second semiconductor layer includes a current spreading layer, which includes a first doped layer doped with a first p-type impurity, a second doped layer doped with the first p-type impurity and a second p-type impurity, and a third doped layer doped with the second p-type impurity. A concentration of the first p-type impurity in the first doped layer is less than or equal to a concentration of the first p-type impurity in the second doped layer. A concentration of the second p-type impurity in the third doped layer is greater than a concentration of the second p-type impurity in the second doped layer. A light-emitting device including the aforesaid light-emitting diode is also provided.

Abstract: The present disclosure discloses an acoustic output apparatus. The acoustic output apparatus may include at least one acoustic driver, a housing structure, and at least two sound guide holes. The at least one acoustic driver may output sounds having opposite phases from the at least two sound guide holes. The housing structure may be configured to carry the at least one acoustic driver. The housing structure may include a user contact surface to be in contact with a user. When the user wears the acoustic output apparatus, the user contact surface may be in contact with a body of the user. An included angle between a connection line between the at least two sound guide holes and the user contact surface may be in a range of 75°-105°.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: The embodiments of the present disclosure disclose an acoustic apparatus. The acoustic apparatus may include a support assembly. The support assembly may include a first portion and a second portion. When a user is wearing the acoustic apparatus, the first portion may be hung between a first side of an ear and a head of the user, the second portion may contact a second side of the ear. The first portion may cause the second portion to provide a compressive force on the second side of the ear.

Abstract: The present disclosure provides an acoustic output device. The acoustic output device may comprise a bone conduction speaker configured to generate bone conduction acoustic waves. The acoustic output device may also comprise an air conduction speaker configured to generate air conduction acoustic waves, the air conduction speaker being independent of the bone conduction speaker. The acoustic output device may further comprise at least one housing configured to accommodate the bone conduction speaker and the air conduction speaker.

Abstract: The present disclosure provides an acoustic device. The acoustic device may include a shell including a first accommodation cavity, a speaker configured in the first accommodation cavity. The speaker may include one or more magnetic circuit assemblies, a voice coil, a vibration assembly, and a vibration transmission plate. The one or more magnetic circuit assemblies may form a magnetic gap. One end of the voice coil may be arranged in a magnetic gap, and another end of the voice coil may be connected with the vibration assembly. The vibration assembly may be connected with the vibration transmission plate, and the vibration transmission plate may be connected with the shell.

Abstract: A hybrid bonding method includes fabricating plural semiconductor devices in a region of a bottom wafer adjacent to a front surface thereof, fusion bonding the front surface to a carrier substrate, thinning the bottom wafer opposite to the front surface to expose conductive regions of the semiconductor devices, forming a dielectric layer over a backside of the semiconductor devices, forming openings in the dielectric layer to expose the conductive regions, forming metal pads within the openings, dicing the bottom wafer and the carrier substrate to singulate the plural semiconductor devices, bonding the dielectric layer overlying the backside of the semiconductor devices to a dielectric layer overlying a front surface of a top wafer, bonding the metal pads within the openings in the dielectric layer to metal pads overlying the front surface of the top wafer, and removing the carrier substrate from the front surface of the bottom wafer.

Abstract: The present application discloses a voice authentication method, a voice authentication apparatus, an electronic device and a storage medium. The method includes: determining security level information of a scene where a target device is located; generating corresponding voice authentication condition based on the security level information; and obtaining a target voice, determining that the target voice meets the voice authentication condition, and passing the authentication.

Abstract: A method for increasing capacitance density within an integrated passive device can include forming a first trench capacitor within a substrate, forming a second trench capacitor within an insulating layer overlying the substrate, and connecting the first and second trench capacitors through connection vias that extend through the insulating layer to form an integrated passive device (IPD) capacitor. A high capacitance density device can include a stacked and co-integrated architecture of two or more tiers of trench capacitors.

Abstract: A method for increasing capacitance density within an integrated passive device can include forming a first trench capacitor within a first insulating layer overlying a substrate, forming a second trench capacitor within a second insulating layer overlying the first insulating layer, and connecting the first and second trench capacitors through connection vias that extend through the second insulating layer to form an integrated passive device (IPD) capacitor. A high capacitance density device can include a stacked and co-integrated architecture of two or more such layers.

Abstract: The present disclosure is directed to a sound amplification device. The sound amplification device comprises a vibrating body, the vibrating body including at least one first vibration surface and at least one contact region for contacting with a vibration source. The vibration source detachably contacts with a contact region, an area of a first vibration surface is larger than an area of the contact region, the vibration source is configured to generate vibration, and the vibration is transmitted to the first vibration surface through the contact region, and further transmitted outwards through the first vibration surface.

Abstract: Embodiments of the present disclosure provide an acoustic output device including: a transducer configured to generate a mechanical vibration based on an electrical signal, the transducer including a magnetic circuit assembly and a vibration transmission sheet; a housing configured to accommodate the transducer, the housing including a panel and a shell, the magnetic circuit assembly being elastically connected to the housing through the vibration transmission sheet, and the transducer transmitting the mechanical vibration to a user through the panel; and an additional element connected to the magnetic circuit assembly. The additional element is elastically connected to the panel through the magnetic circuit assembly.

Abstract: Embodiments of the present disclosure provide an acoustic output device including: a transducer configured to generate a mechanical vibration based on an electrical signal; a housing configured to accommodate the transducer, the housing including a panel and a shell, the transducer being connected to the panel, and the transducer transmitting the mechanical vibration to a user through the panel; and an additional element elastically connected to the panel through a vibration path at least including one elastic element.

Abstract: Embodiments of the present disclosure provide an acoustic output device comprising a transducer device configured to generate a mechanical vibration based on an electrical signal, the transducer device including a magnetic circuit assembly and an elastic support component; a housing configured to accommodate the transducer device, wherein the housing includes a panel and a shell, the transducer device transmitting the mechanical vibration to a user through the panel; and an additional element connected to the panel through a vibration path, the vibration path at least including an elastic element, the additional element being located at a sidewall of the shell adjacent to the panel, and the elastic support component connecting the magnetic circuit assembly and the sidewall disposed with the additional element.

Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a speaker assembly, configured to convert audio signals into vibration signals; a functional assembly electrically connected to the speaker assembly; and a supporting structure, configured to be connected to the speaker assembly and the functional assembly, wherein the supporting structure includes a metal body therein, and the metal body may be electrically connected to the functional assembly.

Abstract: The present disclosure provides a headphone including a sound production component and an ear hook. The ear hook and the sound production component form a first projection on a user's sagittal plane. In a non-wearing state, an inner contour, a first end contour, a second end contour of the first projection, and a tangent segment connecting the first end contour and the second end contour jointly define a first closed curve. A first area of the first closed curve ranges 300 mm2-500 mm2. A portion of the inner contour corresponding to the ear hook includes a first curve. The first curve has an extremum point in a first direction perpendicular to a long axis direction of a projection of the sound production component, the extremum point is located behind a projection point of an upper vertex of the ear hook on the sagittal plane.

Abstract: The present disclosure provides an acoustic output device. The acoustic output device may comprise a bone conduction speaker configured to generate bone conduction acoustic waves. The acoustic output device may also comprise an air conduction speaker configured to generate air conduction acoustic waves, the air conduction speaker being independent of the bone conduction speaker. The acoustic output device may further comprise at least one housing configured to accommodate the bone conduction speaker and the air conduction speaker.

Abstract: The present disclosure relates to acoustic devices. The acoustic device may include a vibration speaker, a delivery mechanism mechanically connected to the vibration speaker, and a support component mechanically connected to the vibration speaker via the delivery mechanism. The vibration speaker may be configured to produce a vibration signal representing a sound according to an electrical signal. The delivery mechanism may be configured to contact a user via a contact portion on the delivery mechanism, and deliver the vibration signal to the user via the contact portion. The contact portion on the delivery mechanism may be at a distance from the vibration speaker and have a less vibration intensity than that of the vibration speaker. The support component may be configured to support the delivery mechanism.