Abstract: The present disclosure provides an acoustic output device comprising a bone conduction acoustic assembly used to generate a bone conduction acoustic wave; an air conduction acoustic assembly used to generate an air conduction acoustic wave; and a housing used to accommodate at least a portion of elements of the bone conduction acoustic assembly and the air conduction acoustic assembly. The housing includes a first chamber used to accommodate at least a portion of the bone conduction acoustic assembly; and a second chamber. The housing is provided with a sound outlet communicated with the second chamber. The air conduction acoustic wave is transmitted to an outside of the acoustic output device via the sound outlet. A frequency response curve of the air conduction acoustic wave has at least one resonance peak. A peak resonance frequency of the at least one resonance peak is greater than or equal to 1 kHz.

Abstract: The present disclosure provides an acoustic output device comprising a bone conduction acoustic assembly used to generate a bone conduction acoustic wave; an air conduction acoustic assembly used to generate an air conduction acoustic wave; and a housing used to accommodate at least a portion of elements of the bone conduction acoustic assembly and the air conduction acoustic assembly. The housing includes a first chamber used to accommodate at least a portion of the bone conduction acoustic assembly; and a second chamber. The housing is provided with a sound outlet communicated with the second chamber. The air conduction acoustic wave is transmitted to an outside of the acoustic output device via the sound outlet. A frequency response curve of the air conduction acoustic wave has at least one resonance peak. A peak resonance frequency of the at least one resonance peak is greater than or equal to 1 kHz.

Abstract: Disclosed herein are integrated circuit (IC) dies, and electronic devices including the same, that include flexible routing arrangements at a hybrid bonding layer featuring an etch stop layer. The etch stop layer enables vias connected with the hybrid bonding layer to terminate at both contact pads formed on the surface of the IC die and buried conductive pads formed on a top metal layer of the IC die.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: The present disclosure provides an acoustic output device comprising a bone conduction acoustic assembly used to generate a bone conduction acoustic wave; an air conduction acoustic assembly used to generate an air conduction acoustic wave; and a housing used to accommodate at least a portion of elements of the bone conduction acoustic assembly and the air conduction acoustic assembly. The housing includes a first chamber used to accommodate at least a portion of the bone conduction acoustic assembly; and a second chamber. The housing is provided with a sound outlet communicated with the second chamber. The air conduction acoustic wave is transmitted to an outside of the acoustic output device via the sound outlet. A frequency response curve of the air conduction acoustic wave has at least one resonance peak. A peak resonance frequency of the at least one resonance peak is greater than or equal to 1 kHz.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: A process of making a stacked semiconductor die can include a step of forming a conformal film of insulating material on one or more surfaces of a singulated semiconductor die. In some examples, the presence of the film tends to reduce the formation of cracks during the die stacking process.

Abstract: A hybrid bonding method includes fabricating plural semiconductor devices in a region of a bottom wafer adjacent to a front surface thereof, fusion bonding the front surface to a carrier substrate, thinning the bottom wafer opposite to the front surface to expose conductive regions of the semiconductor devices, forming a dielectric layer over a backside of the semiconductor devices, forming openings in the dielectric layer to expose the conductive regions, forming metal pads within the openings, dicing the bottom wafer and the carrier substrate to singulate the plural semiconductor devices, bonding the dielectric layer overlying the backside of the semiconductor devices to a dielectric layer overlying a front surface of a top wafer, bonding the metal pads within the openings in the dielectric layer to metal pads overlying the front surface of the top wafer, and removing the carrier substrate from the front surface of the bottom wafer.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: The embodiments of the present disclosure disclose an acoustic apparatus. The acoustic apparatus may include a support assembly. The support assembly may include a first portion and a second portion. When a user is wearing the acoustic apparatus, the first portion may be hung between a first side of an ear and a head of the user, the second portion may contact a second side of the ear. The first portion may cause the second portion to provide a compressive force on the second side of the ear.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: A light-emitting diode is provided, at least including a semiconductor stack layer. The semiconductor stack layer has a first surface and a second surface opposite to each other, and includes a first semiconductor layer, an active layer and a second semiconductor layer sequentially stacked in that order from the first surface to the second surface. The active layer includes a multiple quantum well structure with multiple periods, and each period of the multiple quantum well structure includes a well layer and a barrier layer sequentially stacked in that order. An emission wavelength of the light-emitting diode is in a range of 605 nm to 730 nm. A number of the multiple periods of the multiple quantum well structure in the active layer is in a range of 5 to 25, and a thickness of the barrier layer is less than or equal to 100 Å.

Abstract: An integrated circuit (IC) device includes a first IC die, a second IC die, an interposer die, and a third carrier substrate. The first IC die includes a first carrier substrate, first transistors, and a first power delivery network. The second IC die includes a second carrier substrate, second transistors, and a second power delivery network. A first surface of the first IC die and a first surface of the second IC die are disposed on the IC interposer die. The first power delivery network is between the IC interposer die and the first transistors and the second power delivery network is between the IC interposer die and the second transistors. The third carrier substrate is attached to a second surface of the first IC die and a second surface of the second IC die.

Abstract: Disclosed methods for lateral stacking of die can include positioning a first silicon chip of a semiconductor device horizontally with respect to a second silicon chip of the semiconductor device. The methods can additionally include positioning a third silicon chip of the semiconductor device vertically with respect to both the first silicon chip and the second silicon chip. The disclosed methods can also include electrically connecting the first silicon chip and the second silicon chip by the third silicon chip. Various other methods and systems are also disclosed.

Abstract: The present disclosure provides an acoustic device. The acoustic device may include a housing, a transducer, and a diaphragm. The housing may be configured to form a cavity. The transducer may be arranged in the cavity and connected to the housing. The housing may produce a bone-conduction sound under an action of the transducer. The diaphragm may be connected between the transducer and the housing to divide the cavity into a first cavity and a second cavity. The housing may be provided with at least one pressure relief hole communicating with the first cavity and at least one sound modulation hole communicating with the second cavity. At least a portion of the at least one pressure relief hole and at least a portion of the at least one sound modulation hole may be arranged adjacently. The housing may be further provided with a sound outlet hole communicating with the second cavity.

Abstract: The present disclosure provides an acoustic output apparatus. The acoustic output apparatus may include a bone-conduction acoustic assembly, an air-conduction acoustic assembly, and a housing. The bone-conduction acoustic assembly may be configured to generate bone-conduction sound waves. The air-conduction acoustic assembly may be configured to generate air-conduction sound waves. The housing may include an accommodating chamber configured to accommodate the bone-conduction acoustic assembly and the air-conduction acoustic assembly. At least a portion of the housing may be in contact with a user's skin to transmit the bone-conduction sound waves under an action of the bone-conduction acoustic assembly. The air-conduction sound waves may be generated based on vibrations of at least one of the housing or the bone-conduction acoustic assembly when the bone-conduction sound waves are generated.

Abstract: The present disclosure provides an acoustic output device including a speaker assembly. The speaker assembly may include a transducer, a diaphragm, and a housing. A vibration of the diaphragm driven by the transducer may generate an air conduction sound wave. The housing may form an accommodating chamber for accommodating the transducer and the diaphragm. The diaphragm may separate the accommodating chamber to form a first chamber and a second chamber. A sound outlet communicating with the second chamber is arranged on the housing. The air conduction sound wave is transmitted to the outside of the acoustic output device through the sound outlet. A sound guiding channel communicating with the sound outlet is provided on the housing for guiding the air conduction sound wave to a target direction outside the acoustic output device. The length of the sound guiding channel may be less than or equal to 7 mm.