Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: The embodiments of the present disclosure disclose an acoustic apparatus. The acoustic apparatus may include a support assembly. The support assembly may include a first portion and a second portion. When a user is wearing the acoustic apparatus, the first portion may be hung between a first side of an ear and a head of the user, the second portion may contact a second side of the ear. The first portion may cause the second portion to provide a compressive force on the second side of the ear.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: A light-emitting diode is provided, at least including a semiconductor stack layer. The semiconductor stack layer has a first surface and a second surface opposite to each other, and includes a first semiconductor layer, an active layer and a second semiconductor layer sequentially stacked in that order from the first surface to the second surface. The active layer includes a multiple quantum well structure with multiple periods, and each period of the multiple quantum well structure includes a well layer and a barrier layer sequentially stacked in that order. An emission wavelength of the light-emitting diode is in a range of 605 nm to 730 nm. A number of the multiple periods of the multiple quantum well structure in the active layer is in a range of 5 to 25, and a thickness of the barrier layer is less than or equal to 100 Å.

Abstract: An integrated circuit (IC) device includes a first IC die, a second IC die, an interposer die, and a third carrier substrate. The first IC die includes a first carrier substrate, first transistors, and a first power delivery network. The second IC die includes a second carrier substrate, second transistors, and a second power delivery network. A first surface of the first IC die and a first surface of the second IC die are disposed on the IC interposer die. The first power delivery network is between the IC interposer die and the first transistors and the second power delivery network is between the IC interposer die and the second transistors. The third carrier substrate is attached to a second surface of the first IC die and a second surface of the second IC die.

Abstract: Disclosed methods for lateral stacking of die can include positioning a first silicon chip of a semiconductor device horizontally with respect to a second silicon chip of the semiconductor device. The methods can additionally include positioning a third silicon chip of the semiconductor device vertically with respect to both the first silicon chip and the second silicon chip. The disclosed methods can also include electrically connecting the first silicon chip and the second silicon chip by the third silicon chip. Various other methods and systems are also disclosed.

Abstract: The present disclosure provides an acoustic device. The acoustic device may include a housing, a transducer, and a diaphragm. The housing may be configured to form a cavity. The transducer may be arranged in the cavity and connected to the housing. The housing may produce a bone-conduction sound under an action of the transducer. The diaphragm may be connected between the transducer and the housing to divide the cavity into a first cavity and a second cavity. The housing may be provided with at least one pressure relief hole communicating with the first cavity and at least one sound modulation hole communicating with the second cavity. At least a portion of the at least one pressure relief hole and at least a portion of the at least one sound modulation hole may be arranged adjacently. The housing may be further provided with a sound outlet hole communicating with the second cavity.

Abstract: The present disclosure provides an acoustic output apparatus. The acoustic output apparatus may include a bone-conduction acoustic assembly, an air-conduction acoustic assembly, and a housing. The bone-conduction acoustic assembly may be configured to generate bone-conduction sound waves. The air-conduction acoustic assembly may be configured to generate air-conduction sound waves. The housing may include an accommodating chamber configured to accommodate the bone-conduction acoustic assembly and the air-conduction acoustic assembly. At least a portion of the housing may be in contact with a user's skin to transmit the bone-conduction sound waves under an action of the bone-conduction acoustic assembly. The air-conduction sound waves may be generated based on vibrations of at least one of the housing or the bone-conduction acoustic assembly when the bone-conduction sound waves are generated.

Abstract: The present disclosure provides an acoustic output device including a speaker assembly. The speaker assembly may include a transducer, a diaphragm, and a housing. A vibration of the diaphragm driven by the transducer may generate an air conduction sound wave. The housing may form an accommodating chamber for accommodating the transducer and the diaphragm. The diaphragm may separate the accommodating chamber to form a first chamber and a second chamber. A sound outlet communicating with the second chamber is arranged on the housing. The air conduction sound wave is transmitted to the outside of the acoustic output device through the sound outlet. A sound guiding channel communicating with the sound outlet is provided on the housing for guiding the air conduction sound wave to a target direction outside the acoustic output device. The length of the sound guiding channel may be less than or equal to 7 mm.

Abstract: A semiconductor light-emitting component includes a semiconductor epitaxial structure that includes a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The first conductivity type semiconductor layer includes a first current spread layer having a first and second parts which are stacked on one another. The first part has an average band gap greater than that of the second part. The second part is formed by alternately stacking first sub layers and second sub layers one on another. Each of the first sub layers has a band gap different from that of each of the second sub layers. A light-emitting device including the semiconductor light-emitting component is also disclosed.

Abstract: The embodiment of the present disclosure discloses a wearable device, including: a wearing part including: a connection section and a concave section, the concave section being connected to the connection section. The concave section causes an upper edge of the wearing part to have a downward depression on the wearing part; the concave section is provided with an acoustic output end inside.

Abstract: This application discloses a model training method and apparatus, and a device, and relates to the field of machine learning technologies. Because different computing devices have different data organization forms, a training device obtains correction data determined by each computing device based on a same training direction (a first gradient), so that the training device does not need to consider different data organization forms when training a model based on the correction data. This avoids a problem of poor stability of model training. In addition, all different computing devices run the model and output the correction data based on the same training direction. This helps the training device obtain a more accurate model training direction, thereby reducing a quantity of rounds of model training, and also reducing a quantity of times of communication between the training device and the computing devices.

Abstract: The present disclosure provides an acoustic apparatus. The acoustic apparatus may include a hook-shaped part, a connecting part, and a holding part. When a user is wearing the acoustic apparatus, the hook-shaped part may be hung between a first side of an ear and a head of the user, the holding part may be in contact with a second side of the ear, and the connecting part may be connected with the hook-shaped part and the holding part. The hook-shaped part may include a first portion and a second portion, the first portion may be connected with the connecting part, and the second portion may be connected with the first portion. A projection of the first portion on a sagittal plane of the user may include a first curve. A projection of the second portion on the sagittal plane of the user may include a second curve.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: An image processing method and a related device are disclosed. The method may be applied to a three-dimensional scene in the artificial intelligence field. The method includes: inputting a training sample to a first model to obtain feature information of each image in the training sample, and training the first model. The training sample includes images of a first scene at a plurality of angles of view, including a first image and a second image. An objective of training includes increasing a similarity between first feature information and second feature information, where the first feature information includes feature information of a first point in the first image, the second feature information includes feature information of a second point in the second image, and the first point and the second point correspond to a same point in the first scene.

Abstract: The present disclosure provides an acoustic device. The acoustic device may include a housing, a transducer, and a diaphragm. The housing may be configured to form a cavity. The transducer may be arranged in the cavity and connected to the housing. The housing may produce a bone-conduction sound under an action of the transducer. The diaphragm may be connected between the transducer and the housing to divide the cavity into a first cavity and a second cavity. The housing may be provided with at least one pressure relief hole communicating with the first cavity and at least one sound modulation hole communicating with the second cavity. At least a portion of the at least one pressure relief hole and at least a portion of the at least one sound modulation hole may be arranged adjacently. The housing may be further provided with a sound outlet hole communicating with the second cavity.

Abstract: The present disclosure provides an acoustic output device including a speaker assembly. The speaker assembly may include a transducer, a diaphragm, and a housing. A vibration of the diaphragm driven by the transducer may generate an air conduction sound wave. The housing may form an accommodating chamber for accommodating the transducer and the diaphragm. The diaphragm may separate the accommodating chamber to form a first chamber and a second chamber. A sound outlet communicating with the second chamber is arranged on the housing. The air conduction sound wave is transmitted to the outside of the acoustic output device through the sound outlet. A sound guiding channel communicating with the sound outlet is provided on the housing for guiding the air conduction sound wave to a target direction outside the acoustic output device. The length of the sound guiding channel may be less than or equal to 7 mm.

Abstract: The disclosed device includes a bottom die layer having a bottom die and a bridge die adjacent to the bottom die. The device also includes a top die layer positioned on the bottom die layer and having a top die overlying at least a portion of the bottom die and overlying at least a portion of the bridge die. Various other methods, systems, and computer-readable media are also disclosed.