Patents by Inventor Liwei Wang
Liwei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12039440Abstract: An image classification method and apparatus, and an image classification model training method and apparatus are provided, which are related to an image recognition technology in the artificial intelligence field and more specifically, to the computer vision field. The method includes: obtaining a to-be-processed image; and classifying the to-be-processed image based on a preset global class feature, to obtain a classification result of the to-be-processed image. The preset global class feature includes a plurality of class features obtained through training based on a plurality of training images in a training set. The plurality of class features in the preset global class feature are used to indicate visual features of all classes in the training set.Type: GrantFiled: January 24, 2022Date of Patent: July 16, 2024Assignees: Huawei Technologies Co., Ltd., Peking UniversityInventors: Weiran Huang, Aoxue Li, Zhenguo Li, Tiange Luo, Liwei Wang
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Patent number: 12022251Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a speaker assembly, configured to convert audio signals into vibration signals; a functional assembly electrically connected to the speaker assembly; and a supporting structure, configured to be connected to the speaker assembly and the functional assembly, wherein the supporting structure includes a metal body therein, and the metal body may be electrically connected to the functional assembly.Type: GrantFiled: July 29, 2022Date of Patent: June 25, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhang, Zhen Wang, Liwei Wang, Peigeng Tong, Fengyun Liao, Xin Qi, Xianwei Shi, Shuailin Xie, Yunbin Chen
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Patent number: 11985473Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: GrantFiled: December 29, 2021Date of Patent: May 14, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying Zheng, Jiang Xu, Yonggen Wang, Haofeng Zhang, Gan Lai, Chong Wang, Liwei Wang, Ruixin Han, Lei Zhang, Junjiang Fu
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Publication number: 20240148943Abstract: A drug coated balloon includes a balloon body and a drug loaded coating layer. The drug loaded coating layer includes a first drug loaded coating component having at least two controllable sustained release drugs with different drug release kinetics, and a second drug loaded coating component including an active drug. The second drug loaded coating component is dispersed among the controllable sustained release drugs and couples the controllable sustained release drugs on the balloon body. The first and second drug loaded coating components are both non-hydrophilic compositions. The drug coated balloon provides sufficient initial drug loading dosage to the lesion site, and has adjustable drug release rate, thereby allowing the drug coated balloon to provide bioactive drugs to the treatment site at different stages of the cascade reaction of vascular restenosis, providing the controllable long-acting therapeutic drugs, and improving the overall vascular drug release efficacy.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Inventors: Liwei Wang, Junyi Huang, Zhijun Zhang, Bin Li
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Publication number: 20240147105Abstract: An open earphone includes an acoustic driver for generating two sounds with opposite phases; a housing for accommodating the acoustic driver; and a suspension structure for fixing the housing in a position near an ear of a user without blocking an ear canal of the user. The housing is provided with two sound holes for outputting each of the two sounds with opposite phases. The housing includes a body and a baffle. The body defines a first cavity for housing the acoustic driver. The baffle is connected to the body and extended in a direction toward the ear canal of the user, and defines a second cavity with the auricle of the user. The two sound holes are disposed respectively inside and outside the second cavity.Type: ApplicationFiled: November 23, 2023Publication date: May 2, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Lei ZHANG, Liwei WANG, Zhen WANG
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Publication number: 20240073583Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU
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Publication number: 20240040301Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 27, 2023Publication date: February 1, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Yongjian LI, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI
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Publication number: 20240031726Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 28, 2023Publication date: January 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Yongjian LI, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI
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Publication number: 20240031724Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 27, 2023Publication date: January 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI, Yongjian LI
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Publication number: 20240031723Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 27, 2023Publication date: January 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Yongjian LI, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI
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Publication number: 20240031725Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: ApplicationFiled: September 27, 2023Publication date: January 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying ZHENG, Jiang XU, Yonggen WANG, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU, Tao ZHAO, Peigeng TONG, Guolin XIE, Duoduo WU, Ao JI, Xin QI, Yongjian LI
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Patent number: 11838705Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.Type: GrantFiled: December 2, 2021Date of Patent: December 5, 2023Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeying Zheng, Jiang Xu, Yonggen Wang, Haofeng Zhang, Gan Lai, Chong Wang, Liwei Wang, Ruixin Han, Lei Zhang, Junjiang Fu
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Publication number: 20230379639Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.Type: ApplicationFiled: July 29, 2023Publication date: November 23, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Xin QI, Fengyun LIAO, Jinbo ZHENG, Qian CHEN, Hao CHEN, Zeying ZHENG, Jiang XU, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU
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Publication number: 20230362556Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.Type: ApplicationFiled: July 20, 2023Publication date: November 9, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Xin QI, Fengyun LIAO, Zeying ZHENG, Jiang XU, Haofeng ZHANG, Gan LAI, Chong WANG, Liwei WANG, Ruixin HAN, Lei ZHANG, Junjiang FU
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Patent number: 11804470Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a plurality of first dies on a substrate, an encapsulation layer over the first dies and the substrate, an interface layer over the first dies and the encapsulation layer, and a passive heat spreader on the interface layer, wherein the interface layer thermally couples the first dies to the passive heat spreader. The passive heat spreader includes a silicon (Si) or a silicon carbide (SiC). The interface layer includes a silicon nitride (SiN) material, a silicon monoxide (SiO) material, a silicon carbon nitride (SiCN) material, or a thermal adhesive material. The semiconductor package may include a plurality of second dies and the substrate on a package substrate, a thermal interface material (TIM) over the second dies, the passive heat spreader, and the package substrate, and a heat spreader over the TIM and the package substrate.Type: GrantFiled: August 22, 2019Date of Patent: October 31, 2023Assignee: Intel CorporationInventors: Xavier F. Brun, Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Yawei Liang, Jigneshkumar P. Patel, Sairam Agraharam, Liwei Wang
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Publication number: 20230319460Abstract: The present disclosure provides an acoustic output device including a speaker assembly. The speaker assembly may include a transducer, a diaphragm, and a housing. A vibration of the diaphragm driven by the transducer may generate an air conduction sound wave. The housing may form an accommodating chamber for accommodating the transducer and the diaphragm. The diaphragm may separate the accommodating chamber to form a first chamber and a second chamber. A sound outlet communicating with the second chamber is arranged on the housing. The air conduction sound wave is transmitted to the outside of the acoustic output device through the sound outlet. A sound guiding channel communicating with the sound outlet is provided on the housing for guiding the air conduction sound wave to a target direction outside the acoustic output device. The length of the sound guiding channel may be less than or equal to 7 mm.Type: ApplicationFiled: May 5, 2023Publication date: October 5, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Lei ZHANG, Zhen WANG, Liwei WANG, Peigeng TONG, Fengyun LIAO, Xin QI
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Patent number: 11773327Abstract: A PSA-type liquid crystal composition includes a host liquid crystal A and a polymerizable component B, where the host liquid crystal A includes one or more liquid crystal compounds, and the polymerizable component B includes at least one compound selected from compounds of general formula I-1, general formula I-2 and general formula I-3. A liquid crystal display device includes the PSA-type liquid crystal composition above. The PSA-type liquid crystal composition has better intersolubility, cannot be crystallized at a low-temperature environment, can form a relatively stable pretilt angle after the polymerization of the polymerizable component, avoids the image sticking, and inhibits the occurrence of a display defect, such as Zara Particle, during the polymerization.Type: GrantFiled: March 27, 2020Date of Patent: October 3, 2023Assignee: Jiangsu Hecheng Display Technology Co., Ltd.Inventors: Wenyang Ma, Liwei Wang, Weigang Yan, Wenming Han, Haibin Xu
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Publication number: 20230276166Abstract: The present disclosure provides an acoustic output device comprising a bone conduction acoustic assembly used to generate a bone conduction acoustic wave; an air conduction acoustic assembly used to generate an air conduction acoustic wave; and a housing used to accommodate at least a portion of elements of the bone conduction acoustic assembly and the air conduction acoustic assembly. The housing includes a first chamber used to accommodate at least a portion of the bone conduction acoustic assembly; and a second chamber. The housing is provided with a sound outlet communicated with the second chamber. The air conduction acoustic wave is transmitted to an outside of the acoustic output device via the sound outlet. A frequency response curve of the air conduction acoustic wave has at least one resonance peak. A peak resonance frequency of the at least one resonance peak is greater than or equal to 1 kHz.Type: ApplicationFiled: May 7, 2023Publication date: August 31, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Lei ZHANG, Zhen WANG, Liwei WANG, Peigeng TONG, Fengyun LIAO, Xin QI
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Publication number: 20230276178Abstract: The present disclosure provides an acoustic output apparatus. The acoustic output apparatus may include a bone-conduction acoustic assembly, an air-conduction acoustic assembly, and a housing. The bone-conduction acoustic assembly may be configured to generate bone-conduction sound waves. The air-conduction acoustic assembly may be configured to generate air-conduction sound waves. The housing may include an accommodating chamber configured to accommodate the bone-conduction acoustic assembly and the air-conduction acoustic assembly. At least a portion of the housing may be in contact with a user's skin to transmit the bone-conduction sound waves under an action of the bone-conduction acoustic assembly. The air-conduction sound waves may be generated based on vibrations of at least one of the housing or the bone-conduction acoustic assembly when the bone-conduction sound waves are generated.Type: ApplicationFiled: May 9, 2023Publication date: August 31, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Lei ZHANG, Zhen WANG, Liwei WANG, Peigeng TONG, Fengyun LIAO, Xin QI
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Publication number: 20230254634Abstract: The present disclosure provides an acoustic device. The acoustic device may include a housing, a transducer, and a diaphragm. The housing may be configured to form a cavity. The transducer may be arranged in the cavity and connected to the housing. The housing may produce a bone-conduction sound under an action of the transducer. The diaphragm may be connected between the transducer and the housing to divide the cavity into a first cavity and a second cavity. The housing may be provided with at least one pressure relief hole communicating with the first cavity and at least one sound modulation hole communicating with the second cavity. At least a portion of the at least one pressure relief hole and at least a portion of the at least one sound modulation hole may be arranged adjacently. The housing may be further provided with a sound outlet hole communicating with the second cavity.Type: ApplicationFiled: April 17, 2023Publication date: August 10, 2023Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Yongjian LI, Shuailin XIE, Hao KE, Lei ZHANG, Zhen WANG, Liwei WANG, Peigeng TONG, Fengyun LIAO, Xin QI