Abstract: The present disclosure relates to acoustic devices. The acoustic device may include a vibration speaker, a delivery mechanism mechanically connected to the vibration speaker, and a support component mechanically connected to the vibration speaker via the delivery mechanism. The vibration speaker may be configured to produce a vibration signal representing a sound according to an electrical signal. The delivery mechanism may be configured to contact a user via a contact portion on the delivery mechanism, and deliver the vibration signal to the user via the contact portion. The contact portion on the delivery mechanism may be at a distance from the vibration speaker and have a less vibration intensity than that of the vibration speaker. The support component may be configured to support the delivery mechanism.

Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a speaker assembly, configured to convert audio signals into vibration signals; a functional assembly electrically connected to the speaker assembly; and a supporting structure, configured to be connected to the speaker assembly and the functional assembly, wherein the supporting structure includes a metal body therein, and the metal body may be electrically connected to the functional assembly.

Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a speaker assembly, configured to convert audio signals into vibration signals; a functional assembly electrically connected to the speaker assembly; and a supporting structure, configured to be connected to the speaker assembly and the functional assembly, wherein the supporting structure includes a metal body therein, and the metal body may be electrically connected to the functional assembly.

Abstract: The present disclosure provides an acoustic device. The acoustic device may include a shell including a first accommodation cavity, a speaker configured in the first accommodation cavity. The speaker may include one or more magnetic circuit assemblies, a voice coil, a vibration assembly, and a vibration transmission plate. The one or more magnetic circuit assemblies may form a magnetic gap. One end of the voice coil may be arranged in a magnetic gap, and another end of the voice coil may be connected with the vibration assembly. The vibration assembly may be connected with the vibration transmission plate, and the vibration transmission plate may be connected with the shell.

Abstract: Disclosed is preparation of a cocktail as a therapeutic agent for cow mastitis and use thereof. A compatibility of phages against the main pathogenic bacteria of cow mastitis is utilized in combination with a specific preparation method to prepare and obtain a therapeutic cocktail preparation. The therapeutic phage cocktail preparation for cow mastitis provided in the disclosure is easy to prepare, short in course of treatment and quick in effect. It has better therapeutic effect on both clinical cow mastitis and recessive mastitis than that of antibiotics and antimicrobial peptide and is expected to solve the problem of bacterial resistance in the treatment of cow mastitis, thereby reducing or getting rid of the troubles of diseases such as mastitis in cows, which is of potential development value in cow farming.

Abstract: The present disclosure provides an apparatus for audio signal output. The apparatus may include a bone conduction assembly configured to generate a bone conduction acoustic wave. The apparatus may include an air conduction assembly configured to generate an air conduction acoustic wave, the bone conduction acoustic wave and the air conduction acoustic wave may represent a same audio signal. The apparatus may include a phase difference between bone conduction acoustic wave and the air conduction acoustic wave may be smaller than a threshold. The apparatus may include a housing configured to accommodate at least a portion of the bone conduction assembly and the air conduction assembly.

Abstract: A state detection device for a LIDAR is provided. The state detection device includes: a fault diagnostic unit, configured to perform a fault diagnosis on a component of the LIDAR, and when a fault is diagnosed, output a fault diagnosis signal; and a diagnostic management unit, communicating with the fault diagnostic unit to receive the fault diagnosis signal, and configured to determine a state of the LIDAR according to the fault diagnosis signal. The present disclosure also provides a LIDAR and a state detection method for a LIDAR.

Abstract: Disclosed are a liquid crystal composition and a liquid crystal display device. The liquid crystal composition comprises at least one compound of general formula I, at least one compound of general formula II, at least one compound of general formula III, and at least one compound of general formula IV. By compounding the four compounds, the composition can have advantages of a wide temperature range of nematic phase, a low viscosity and a low threshold voltage, and the liquid crystal display element can have a short response time and great power saving performance.

Abstract: This application relates to an image recognition technology in the artificial intelligence field, and provides an image classification method and apparatus, and an image classification model training method and apparatus. This application relates to the artificial intelligence field, and more specifically, to the computer vision field. The method includes: obtaining a to-be-processed image; and classifying the to-be-processed image based on a preset global class feature, to obtain a classification result of the to-be-processed image. The global class feature includes a plurality of class features obtained through training based on a plurality of training images in a training set. The plurality of class features in the global class feature are used to indicate visual features of all classes in the training set.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: An image classification method, a neural network training method, and an apparatus are provided, and relate to the field of artificial intelligence, and specifically, to the field of computer vision. The image classification method includes: obtaining a to-be-processed image; and obtaining a classification result of the to-be-processed image based on a pre-trained neural network model, where the classification result includes a class or a superclass to which the to-be-processed image belongs. When the neural network model is trained, not only labels of a plurality of training images but also class hierarchy information of the plurality of training images is used. That is, more abundant information of the training images is used. Therefore, images can be better classified.

Abstract: Disclosed are a method and apparatus for smoothing a link-line power of an electrothermal microgrid using a thermal storage heat pump cluster.

Abstract: Training data identifying a plurality of pairs is received. Each pair identifies one or more separate code snippets known to resolve a respective issue of a plurality of issues. For each pair of the plurality of pairs, a respective issue representation of core content of the respective issue and a linear expression of the one or more separate code snippets in a respective code representation is constructed and a model to correlate the respective code representation as resolving the respective issue representation is trained. The model is queried with a new issue and a selected one of the one or more separate code snippets. The model returns a classification indicating whether the selected one of the one or more separate code snippets is likely to resolve the new issue.

Abstract: A computer-implemented method, system and computer program product for identifying implicit dependencies between code artifacts. Co-defect association rules between code artifacts are generated, where such co-defect association rules include a prediction of how likely there will be a defect in a code artifact when there is a defect in an associated code artifact. After detecting a defect in a first code artifact, the co-defect association rules are reviewed to identify any code artifacts associated with the first code artifact. If there is a code artifact associated with the first code artifact, and if the probability of the associated code artifact being defected when the first code artifact is defected exceeds a threshold value, then a recommendation is made to the user to review not only the first code artifact that was defected but also its associated code artifact for a potential defect.

Abstract: A service receives training data identifying multiple pairs, each pair identifying one or more separate code snippets known to resolve a respective issue of multiple issues. For each pair, the service constructs a respective issue representation of core content of the respective issue, constructs a linear expression of the one or more separate code snippets in a respective code representation, and trains a model to correlate the respective code representation as resolving the respective issue representation. The service queries the model with a new issue and a selected one of the one or more separate code snippets, wherein the model returns a classification indicating whether the selected one of the one or more separate code snippets is likely to resolve the new issue.

Abstract: Embodiments include semiconductor packages and a method to form such packages. A semiconductor package includes first, second, and third microelectronic devices on a package substrate. The first microelectronic device has a top surface substantially coplanar to a top surface of the second microelectronic device. The third microelectronic device has a top surface above the top surfaces of the first and second microelectronic devices. The semiconductor package includes a first conductive layer on the first and second microelectronic devices, and a second conductive layer on the third microelectronic device. The second conductive layer has a thickness less than a thickness of the first conductive layer, and a top surface substantially coplanar to a top surface of the first conductive layer. The semiconductor includes thermal interface materials on the first and second conductive layers. The first and second conductive layers are comprised of copper, silver, boron nitride, or graphene.

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a plurality of first dies on a substrate, an encapsulation layer over the first dies and the substrate, an interface layer over the first dies and the encapsulation layer, and a passive heat spreader on the interface layer, wherein the interface layer thermally couples the first dies to the passive heat spreader. The passive heat spreader includes a silicon (Si) or a silicon carbide (SiC). The interface layer includes a silicon nitride (SiN) material, a silicon monoxide (SiO) material, a silicon carbon nitride (SiCN) material, or a thermal adhesive material. The semiconductor package may include a plurality of second dies and the substrate on a package substrate, a thermal interface material (TIM) over the second dies, the passive heat spreader, and the package substrate, and a heat spreader over the TIM and the package substrate.