Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.

Abstract: A method for dividing a signal having a first frequency by a divide ratio includes selecting, based on the divide ratio, a first pulse width of at least one signal having a second frequency and being generated by at least a corresponding one of a plurality of pulse-width control circuits responsive to at least one signal having a second pulse width. The method includes selecting at least one of the plurality of pulse-width control circuits to be powered-on to generate the at least one signal. The at least one of the plurality of pulse-width control circuits includes a first pulse-width control circuit to generate a first signal having the first pulse-width, second frequency, and first phase. The first signal corresponds to a select circuit output signal having a first phase. The method includes selecting at least one other of the plurality of pulse-width control circuits to be powered-off.

Abstract: In at least one embodiment of the invention, a method for dividing a first signal having a first frequency by a divide ratio to generate a lower frequency signal includes generating a first plurality of signals having a common frequency, a first pulse width, and different phases. The first plurality of signals is based, at least in part, on at least one signal having a second pulse width. The first pulse width is selected from a plurality of pulse widths based, at least in part, on the divide ratio. The method includes sequentially selecting individual pulses of the first plurality of signals as an output signal of a select circuit to generate an output signal having a frequency lower than the first frequency.

Abstract: Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, two or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, one or more pH adjusting agents, and one or more electrically resistive additives.

Abstract: Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

Abstract: Compositions and methods for removal of barrier layer materials by a chemical mechanical polishing technique are provided. In one aspect, the invention provides a composition adapted for removing a barrier layer material in a chemical mechanical polishing technique including at least one reducing agent selected from the group of bicarboxylic acids, tricarboxylic acids, and combinations thereof, at least one reducing agent selected from the group of glucose, hydroxylamine, and combinations thereof, and deionized water, wherein the composition has a pH of about 7 or less. The composition may be used in a method for removing the barrier layer material including applying the composition to a polishing pad and polishing the substrate in the presence of the composition to remove the barrier layer.

Abstract: Methods and apparatus are provided for an improved ink composition for inkjet printing of color filters for flat panel displays. The ink composition includes an ink including at least one pigment and having a surface tension, and an additive adapted to disperse the pigment in the ink and to reduce the surface tension of the ink so that when the ink composition is deposited in a pixel well, a fill profile of the ink composition in the pixel well is flattened or otherwise improved. Numerous other aspects are provided.

Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.

Abstract: The invention provides an inkjet printing apparatus that includes at least one inkjet print head adapted to dispense fluids onto a substrate and at least one delivery aperture adapted to direct a gas toward the substrate. The apparatus may also include at least one recovery aperture adapted to draw materials away from the substrate and evaporate liquids from the surface of the substrate.

Abstract: An ink composition is provided for display device manufacturing via ink jetting. The ink includes (1) a first solvent having a first evaporation rate of about 0 to about 0.353; and (2) a second solvent having a second, different evaporation rate of about 0 to about 0.353 combined with the first solvent. Numerous other aspects are provided.

Abstract: The invention provides a print head parking structure that includes a solvent and/or surface treatment bath for inkjet print heads. Print heads may be returned to the print head parking structure after a substrate has been printed, after one or more printing passes, and/or frequently enough to prevent ink from drying on or clogging the print heads. Once sealed within the print head parking structure, the print heads (or a portion thereof) may be dipped in a solvent bath or pool to dissolve or wash away any ink that has been deposited on the print heads.

Abstract: The invention provides a method of operating a inkjet printing system that may include a print head parking structure and a print head cleaning station. A print head parking structure may include a solvent and/or nozzle surface treatment bath for inkjet print heads. Print heads may be returned to the print head parking structure after a substrate has been printed, after one or more printing passes, and/or frequently enough to prevent ink from drying on or clogging the print heads. Once sealed within the print head parking structure, the print heads (or a portion thereof) may be dipped in a solvent bath to dissolve or wash away any ink that has been deposited on the print heads. The print heads may be coated with a surface treatment that improves jetting reliability. The print heads may be dried and moved to the print head cleaning station where they may be wiped and pre-jetting may be performed.

Abstract: The invention provides a print head parking structure that provides solvent and/or surface treatments for inkjet print heads. Print heads may be returned to the print head parking structure after a substrate has been printed, after one or more printing passes, and/or frequently enough to prevent ink from drying on or clogging the print heads. Once sealed within the print head parking structure, the print heads (or a portion thereof) may be sprayed with a solvent to dissolve or wash away any ink that has been deposited on the print heads.

Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.

Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having a rotational carrier head and a rotatable platen, wherein the substrate is disposed in the rotational carrier head and the platen has a polishing article disposed thereon, rotating the first carrier head at a first carrier head rotational rate and rotating a platen at a first platen rotational rate, contacting the substrate and the polishing article, accelerating the first carrier head rotational rate to a second carrier head rotational rate and accelerating the first platen rotational rate to a second platen rotational rate, and polishing the substrate at the second carrier head rotational rate and at the second platen rotational rate.

Abstract: In at least one embodiment of the invention, a method for dividing a first signal having a first frequency by a divide ratio to generate a lower frequency signal includes generating a first plurality of signals having a common frequency, a first pulse width, and different phases. The first plurality of signals is based, at least in part, on at least one signal having a second pulse width. The first pulse width is selected from a plurality of pulse widths based, at least in part, on the divide ratio. The method includes sequentially selecting individual pulses of the first plurality of signals as an output signal of a select circuit to generate an output signal having a frequency lower than the first frequency.

Abstract: A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or amide groups, an acid or a base in an amount sufficient to adjust the pH of the composition to about 5.0 to about 12.0, the remainder water. Embodiments comprise ex situ cleaning of a rotating polishing pad by applying a solution having a pH of about 5.0 to about 12.0 at a flow rate of about 100 to about 600 ml/min. for about 3 to about 20 seconds after polishing a wafer having a Cu-containing surface and then removing the cleaning solution from the polishing pad by high pressure rinsing with water.

Abstract: For use in a color filter inkjet printing system that may be part of a flat panel display manufacturing system, methods and apparatus for adjusting a pixel fill profile are provided. The methods include application of, and the apparatus are adapted to apply, pressurized gas to at least one ink-filled pixel well on a substrate having a plurality of pixel wells. Numerous other aspects are provided.

Abstract: An method for installing a vascular graft to replace an extensive diseased portion of the aorta in single surgical procedure.

Abstract: A phase selectable divider circuit includes a select circuit receiving a plurality of signals having a common frequency and a different phase. One of the plurality of signals, having a first phase, is selected as a selector circuit output signal. A first value corresponding to the first phase is summed with a second value corresponding to a phase offset from the first phase to generate a sum indicative thereof. That sum is used to select a second one of the signals having a second phase as the next selector circuit output signal. As successive sums are generated, a pulse train is supplied by selector circuit having a desired frequency.