Patents by Inventor Long-Lin Ke
Long-Lin Ke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20200194617Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: ApplicationFiled: February 24, 2020Publication date: June 18, 2020Applicant: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Patent number: 10573779Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: GrantFiled: December 24, 2018Date of Patent: February 25, 2020Assignee: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Publication number: 20190131490Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: ApplicationFiled: December 24, 2018Publication date: May 2, 2019Applicant: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Patent number: 10164145Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: GrantFiled: January 1, 2018Date of Patent: December 25, 2018Assignee: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Publication number: 20180122984Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting clement, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: ApplicationFiled: January 1, 2018Publication date: May 3, 2018Applicant: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Patent number: 9859459Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: GrantFiled: December 3, 2015Date of Patent: January 2, 2018Assignee: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Publication number: 20160093766Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: ApplicationFiled: December 3, 2015Publication date: March 31, 2016Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Publication number: 20160086929Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: ApplicationFiled: December 3, 2015Publication date: March 24, 2016Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Publication number: 20160013358Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: ApplicationFiled: September 1, 2014Publication date: January 14, 2016Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Publication number: 20160013384Abstract: A light emitting unit includes multiple light emitting dice, a molding compound, a substrate and a patterned metal layer. Each of the light emitting dice includes a light emitting component, a first electrode and a second electrode. The molding compound encapsulates the light emitting dice and exposes a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice. The molding compound is located between the substrate and the light emitting dice. The patterned metal layer is disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice. The light emitting dice are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection by the patterned metal layer.Type: ApplicationFiled: September 1, 2014Publication date: January 14, 2016Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
-
Patent number: 9219211Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: GrantFiled: September 1, 2014Date of Patent: December 22, 2015Assignee: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke