Patents by Inventor Loo Li Eng

Loo Li Eng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing microphone chip
    Patent number: 9681244
    Abstract: A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: June 13, 2017
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventors: Goh Wan Ling Serene, Loo Li Eng, Tan Qiu Yu Veronica, Xiaohui Zhong, Lin Yih Shung, Lai Kah Keen
  • Method for manufacturing microphone chip
    Publication number: 20170164128
    Abstract: A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.
    Type: Application
    Filed: October 19, 2016
    Publication date: June 8, 2017
    Applicant: AAC Technologies Pte. Ltd.
    Inventors: Goh Wan Ling Serene, Loo Li Eng, Tan Qiu Yu Veronica, Xiaohui Zhong, Lin Yih Shung, Lai Kah Keen