Patents by Inventor Lorenzo Baldo

Lorenzo Baldo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10527511
    Abstract: Microelectromechanical transducer comprising a semiconductor body, four cavities buried within the semiconductor body and four membranes, each membrane being suspended over a respective cavity and being capable of being deflected by the action of a pressure external to the microelectromechanical transducer; the microelectromechanical transducer further comprising four transducer elements housed by a respective membrane and electrically coupled to one another in a Wheatstone bridge configuration to convert said external pressure into an electrical signal.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: January 7, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Enri Duqi, Lorenzo Baldo
  • Publication number: 20190375629
    Abstract: A process for manufacturing a microelectromechanical device envisages: providing a wafer of semiconductor material; forming a buried cavity, completely contained within the wafer, and a structural layer formed by a surface portion of the wafer and suspended over the buried cavity; forming first trenches through the structural layer as far as the buried cavity, which define the suspended structure in the structural layer; filling the first trenches and the buried cavity with sacrificial material; forming a closing structure above the structural layer; removing the sacrificial material from the first trenches and from the buried cavity to release the suspended structure, the suspended structure being isolated and buried within the wafer in a buried environment formed by the first trenches and by the buried cavity.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 12, 2019
    Inventors: Enri DUQI, Lorenzo BALDO, Flavio Francesco VILLA, Gabriele BARLOCCHI
  • Patent number: 10488020
    Abstract: An end cap for elongate lighting modules having an exposed end surface and a front light emitting surface may include a body wall which may be brought into abutment against said end surface, and a peripheral wall extending sidewise of and around the body wall, the peripheral wall having a discontinuity therein positionable at the front light emitting surface. The body wall may include at least one sealing mass reception cavity facing towards the peripheral wall.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: November 26, 2019
    Assignee: OSRAM GMBH
    Inventors: Alberto Zanotto, Simon Bobbo, Aleksandar Nastov, Roberto Didone′, Lorenzo Baldo
  • Publication number: 20190345028
    Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.
    Type: Application
    Filed: July 25, 2019
    Publication date: November 14, 2019
    Inventors: Enri DUQI, Lorenzo BALDO, Roberto CARMINATI
  • Publication number: 20190330056
    Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
    Type: Application
    Filed: July 11, 2019
    Publication date: October 31, 2019
    Inventors: Enri DUQI, Lorenzo BALDO, Domenico GIUSTI
  • Patent number: 10458629
    Abstract: A lighting module includes a base, at least one electrically powered light radiation source carried by said base, a plurality of lamina electrical contacts connected to said light radiation source, and having respective proximal ends fixed to said base and respective distal ends elastically pressed against one face of said base, wherein the distal ends of said lamina electrical contacts have respective mutually offset contact areas.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 29, 2019
    Assignee: OSRAM GMBH
    Inventors: Alberto Zanotto, Simon Bobbo, Lorenzo Baldo, Roberto Didone′, Valerio Michielan, Matteo Caldon
  • Patent number: 10455662
    Abstract: Various embodiments may relate to a lighting system including a string of light sources connected in series between a first terminal and a second terminal, wherein at least one electrical contact of the string of light sources is accessible. The system further includes a protection circuit that protects the light sources from an electrostatic discharge applied to the electrical contact that is accessible. In particular, the protection circuit includes at least one TVS diode or set of antiparallel diodes connected to the second terminal, and for each electrical contact a respective capacitor connected between the respective electrical contact and a TVS diode or set of antiparallel diodes, in such a way that an electrostatic event applied to an electrical contact is discharged through the respective capacitor and the respective TVS diode or set of antiparallel diodes towards the second terminal.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: October 22, 2019
    Assignee: OSRAM GMBH
    Inventors: Alessio Griffoni, Lorenzo Baldo
  • Patent number: 10407301
    Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: September 10, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Enri Duqi, Lorenzo Baldo, Roberto Carminati
  • Patent number: 10392245
    Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: August 27, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Enri Duqi, Lorenzo Baldo, Domenico Giusti
  • Publication number: 20190242772
    Abstract: A MEMS pressure sensor includes a monolithic body of semiconductor material having a first face and a second face and housing a first buried cavity and a second buried cavity, arranged under the first buried cavity and projecting laterally therefrom. A first sensitive region is formed between the first buried cavity and the first face at a first depth, and a second sensitive region is formed between the second buried cavity and the first face at a second depth greater than the first depth. The monolithic body also houses a first piezoresistive sensing element and a second piezoresistive sensing element, integrated in the first and second sensitive regions, respectively.
    Type: Application
    Filed: January 29, 2019
    Publication date: August 8, 2019
    Inventors: Enri DUQI, Lorenzo BALDO
  • Patent number: 10371352
    Abstract: A lighting device, such as a LED module, comprising an elongated support structure having a longitudinal direction and electrically-powered light radiation sources distributed along the support structure, the support structure including at least one light-permeable layer, one or more optical signal sources coupled with the light-permeable layer, for injecting therein an optical signal propagating in the longitudinal direction, and one or more optical signal detectors coupled with the light-permeable layer, for detecting the optical signal injected by the optical signal source(s).
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: August 6, 2019
    Assignee: OSRAM GmbH
    Inventors: Antonio Stocco, Alessio Griffoni, Lorenzo Baldo, Valerio Michielan, Luca Volpato
  • Publication number: 20190219468
    Abstract: A microelectromechanical pressure sensor includes a monolithic body of semiconductor material having a front surface. A sensing structure is integrated in the monolithic body and has a buried cavity completely contained within the monolithic body at the front surface. A sensing membrane is suspended above the buried cavity and is formed by a surface portion of the monolithic body. Sensing elements of a piezoresistive type are arranged in the sensing membrane to detect a deformation of the sensing membrane as a result of a pressure. The pressure sensor is further provided with a self-test structure integrated within the monolithic body to cause application of a testing deformation of the sensing membrane in order to verify proper operation of the sensing structure.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Enri Duqi, Lorenzo Baldo
  • Patent number: 10352536
    Abstract: According to the present disclosure, a support structure for lighting devices, e.g. LED lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: July 16, 2019
    Assignee: OSRAM GMBH
    Inventors: Lorenzo Baldo, Federico Poggi, Luigi Pezzato, Aleksandar Nastov
  • Publication number: 20190210868
    Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.
    Type: Application
    Filed: January 9, 2018
    Publication date: July 11, 2019
    Inventors: Enri DUQI, Lorenzo BALDO, Marco DEL SARTO, Mikel AZPEITIA URQUIA
  • Patent number: 10281090
    Abstract: A lighting device comprising: an elongated laminar substrate having opposed front and back surfaces, one or more electrically-powered light radiation sources, e.g. LED sources, at the front surface of the substrate, a protective encapsulation sealingly encapsulating the substrate and the light radiation source(s), the encapsulation being light-permeable to facilitate propagation of light radiation from the device. The encapsulation includes thermally-conductive material at the back surface of the substrate.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: May 7, 2019
    Assignee: OSRAM GMBH
    Inventors: Martin Reiss, Roberto Didone', Luigi Pezzato, Lorenzo Baldo
  • Publication number: 20190064020
    Abstract: Microelectromechanical transducer comprising a semiconductor body, four cavities buried within the semiconductor body and four membranes, each membrane being suspended over a respective cavity and being capable of being deflected by the action of a pressure external to the microelectromechanical transducer; the microelectromechanical transducer further comprising four transducer elements housed by a respective membrane and electrically coupled to one another in a Wheatstone bridge configuration to convert said external pressure into an electrical signal.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 28, 2019
    Inventors: Enri DUQI, Lorenzo Baldo
  • Publication number: 20190021169
    Abstract: A method for forming support structures for electrically-powered lighting devices, the method comprising: providing an electrically insulating ribbon-like substrate, forming electrically-conductive lines on a surface of the substrate by screen printing of electrically-conductive ink, the screen printing comprising printing a plurality of repeated printed images, which follow one another along a longitudinal direction and are separated from each other by separation gaps, and forming electrically-conductive ink jumpers that extend through the separation gaps and which provide electrical continuity between electrically-conductive lines of adjacent printed images, wherein forming ink jumpers comprises delivering electrically-conductive ink by inkjet printing.
    Type: Application
    Filed: July 11, 2018
    Publication date: January 17, 2019
    Inventors: Lorenzo Baldo, Alessio Griffoni, Thomas Rieger
  • Patent number: 10150666
    Abstract: A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: December 11, 2018
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Lorenzo Baldo, Enri Duqi, Flavio Francesco Villa
  • Patent number: 10125009
    Abstract: Method of manufacturing a transducer module, comprising the steps of: forming, on a substrate, a first MEMS transducer, in particular a gyroscope, and a second MEMS transducer, in particular an accelerometer, having a suspended membrane; forming, on the substrate, a conductive layer and defining the conductive layer in order to provide, simultaneously, at least one conductive strip electrically coupled to the first MEMS transducer and the membrane of the second MEMS transducer.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: November 13, 2018
    Assignee: STMicroelectronics S.r.l.
    Inventors: Enri Duqi, Mikel Azpeitia Urquia, Lorenzo Baldo
  • Patent number: 10125968
    Abstract: A lighting device may be produced by providing a protected elongate light emitting module, including a substrate with at least one electrically-powered light radiation source, and at least one sealing mass protecting light radiation source(s), and by coupling to said light emitting module a channel-shaped cover member with a body portion including light permeable material and side portions, with the side portions of the cover member embracing and locking therebetween the light emitting module and with light radiation source(s) facing towards body portion of cover member, whereby the light permeable material provides a propagation path for the light radiation from light radiation source(s).
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: November 13, 2018
    Assignee: OSRAM GmbH
    Inventors: Alberto Zanotto, Simone Massaro, Thomas Rieger, Roberto Didone′, Simon Bobbo, Lorenzo Baldo