Abstract: In one embodiment, a shape-reconfigurable structure includes a rigid base having first and second ends, a rigid first beam having a lateral end and a central end, the lateral end being connected to the first end of the base, and a rigid second beam having a lateral end and a central end, the lateral end of the second beam being connected to the second end of the base and the central end of the second beam being connected to the central end of the first beam, wherein the structure can be placed in an expanded orientation in which the first and second beams extend outward away from the base and a contracted orientation in which the first and second beams extend inward toward the base.

Abstract: Seismic protection materials are derived from assemblages of unit cells, where each of the cells has a core, one or more shells disposed about the core, and rigid plates bounding the shells. The cores limit relative vertical movement between the plates, and the shell(s) limit relative lateral motion between the plates. Uncompressed cores are preferably substantially spherical or cylindrical, and can be solid or hollow. Unit cells can be aligned in same or different directions, both within a given layer of cells, and in different layers of cells. Assemblages can have any suitable overall shape and size, depending upon application, and for example can support objects ranging from table top equipment to large buildings and bridges.

Abstract: In one embodiment, a shape-reconfigurable structure includes a rigid base having first and second ends, a rigid first beam having a lateral end and a central end, the lateral end being connected to the first end of the base, and a rigid second beam having a lateral end and a central end, the lateral end of the second beam being connected to the second end of the base and the central end of the second beam being connected to the central end of the first beam, wherein the structure can be placed in an expanded orientation in which the first and second beams extend outward away from the base and a contracted orientation in which the first and second beams extend inward toward the base.

Abstract: Seismic protection materials are derived from assemblages of unit cells, where each of the cells has a core, one or more shells disposed about the core, and rigid plates bounding the shells. The cores limit relative vertical movement between the plates, and the shell(s) limit relative lateral motion between the plates. Uncompressed cores are preferably substantially spherical or cylindrical, and can be solid or hollow. Unit cells can be aligned in same or different directions, both within a given layer of cells, and in different layers of cells. Assemblages can have any suitable overall shape and size, depending upon application, and for example can support objects ranging from table top equipment to large buildings and bridges.

Abstract: An electronic module includes a substrate including at least one structure that reduces stress flow through the substrate, wherein the structure includes at least one trench in a surface of the substrate, and a plurality of capacitor legs disposed on an upper surface of the substrate.

Abstract: Self calibrating micro-fabricated load cells are disclosed. According to one embodiment, a self calibrating load cell comprises a resonant double ended tuning fork force sensor and a phase locked loop circuit for detection of frequency changes upon external load application to the resonant double ended tuning fork force sensor.

Abstract: An electronic module includes a substrate including at least one structure that reduces stress flow through the substrate, wherein the structure includes at least one trench in a surface of the substrate, and a plurality of capacitor legs disposed on an upper surface of the substrate.

Abstract: An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.

Abstract: Self calibrating micro-fabricated load cells are disclosed. According to one embodiment, a self calibrating load cell comprises a resonant double ended tuning fork force sensor and a phase locked loop circuit for detection of frequency changes upon external load application to the resonant double ended tuning fork force sensor.

Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.

Abstract: An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.

Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: A method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.

Abstract: An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.

Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.