Patents by Inventor Lorenzo Valdevit

Lorenzo Valdevit has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME
    Publication number: 20080218990
    Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
    Type: Application
    Filed: April 8, 2008
    Publication date: September 11, 2008
    Applicant: International Business Machines Corporation
    Inventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
  • ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME
    Publication number: 20080205024
    Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
    Type: Application
    Filed: February 13, 2008
    Publication date: August 28, 2008
    Applicant: International Business Machines Corporation
    Inventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
  • ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME
    Publication number: 20080205023
    Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
    Type: Application
    Filed: February 27, 2007
    Publication date: August 28, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit, David Questad