Patents by Inventor Louis Chow

Louis Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170353062
    Abstract: The present invention is a high efficiency permanent magnet machine capable of maintaining high power density. The machine is operable over a wide range of power output. The improved efficiency is due in part to copper wires with a current density lower than traditional designs and larger permanent magnets coupled with a large air gap. In a certain embodiment, wide stator teeth are used to provide additional improved efficiency through significantly reducing magnetic saturation resulting in lower current. The machine also has a much smaller torque angle than that in traditional design at rated load and thus has a higher overload handling capability and improved efficiency. In addition, when the machine is used as a motor, an adaptive phase lag compensation scheme helps the sensorless field oriented control (FOC) scheme to perform more accurately.
    Type: Application
    Filed: August 23, 2017
    Publication date: December 7, 2017
    Inventors: Xinzhang Wu, Hanzhou Liu, Yang Hu, Louis Chow, Jon Harms, Martin Epstein, Wei Wu
  • Patent number: 9780608
    Abstract: The present invention is a high efficiency permanent magnet machine capable of maintaining high power density. The machine is operable over a wide range of power output. The improved efficiency is due in part to copper wires with a current density lower than traditional designs and larger permanent magnets coupled with a large air gap. In a certain embodiment wide stator teeth are used to provide additional improved efficiency through significantly reducing magnetic saturation resulting in lower current. The machine also has a much smaller torque angle than that in traditional design at rated load and thus has a higher overload handling capability and improved efficiency. In addition, when the machine is used as a motor, an adaptive phase lag compensation scheme helps the sensorless field oriented control (FOC) scheme to perform more accurately.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: October 3, 2017
    Inventors: Xinzhang Wu, Hanzhou Liu, Yang Hu, Louis Chow, Jon Harms, Martin Epstein, Wei Wu
  • Publication number: 20170268829
    Abstract: The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber.
    Type: Application
    Filed: April 4, 2017
    Publication date: September 21, 2017
    Inventors: Daniel P. RINI, Louis CHOW
  • Patent number: 9612061
    Abstract: The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: April 4, 2017
    Assignee: RINI TECHNOLOGIES, INC.
    Inventors: Daniel P. Rini, Louis Chow
  • Publication number: 20140340011
    Abstract: The present invention is a high efficiency permanent magnet machine capable of maintaining high power density. The machine is operable over a wide range of power output. The improved efficiency is due in part to copper wires with a current density lower than traditional designs and larger permanent magnets coupled with a large air gap. In a certain embodiment wide stator teeth are used to provide additional improved efficiency through significantly reducing magnetic saturation resulting in lower current. The machine also has a much smaller torque angle than that in traditional design at rated load and thus has a higher overload handling capability and improved efficiency. In addition, when the machine is used as a motor, an adaptive phase lag compensation scheme helps the sensorless field oriented control (FOC) scheme to perform more accurately.
    Type: Application
    Filed: August 1, 2014
    Publication date: November 20, 2014
    Inventors: Xinzhang Wu, Hanzhou Liu, Yang Hu, Louis Chow, Jon Harms, Martin Epstein, Wei Wu
  • Patent number: 8829742
    Abstract: The present invention is a high efficiency permanent magnet machine capable of maintaining high power density. The machine is operable over a wide range of power output. The improved efficiency is due in part to copper wires with a current density lower than traditional designs and larger permanent magnets coupled with a large air gap. In a certain embodiment wide stator teeth are used to provide additional improved efficiency through significantly reducing magnetic saturation resulting in lower current. The machine also has a much smaller torque angle than that in traditional design at rated load and thus has a higher overload handling capability and improved efficiency. In addition, when the machine is used as a motor, an adaptive phase lag compensation scheme helps the sensorless field oriented control (FOC) scheme to perform more accurately.
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: September 9, 2014
    Inventors: Xinzhang Wu, Hanzhou Liu, Yang Hu, Louis Chow, Jon Harms, Martin Epstein, Wei Wu
  • Publication number: 20140191596
    Abstract: The present invention is a high efficiency permanent magnet machine capable of maintaining high power density. The machine is operable over a wide range of power output. The improved efficiency is due in part to copper wires with a current density lower than traditional designs and larger permanent magnets coupled with a large air gap. In a certain embodiment wide stator teeth are used to provide additional improved efficiency through significantly reducing magnetic saturation resulting in lower current. The machine also has a much smaller torque angle than that in traditional design at rated load and thus has a higher overload handling capability and improved efficiency. In addition, when the machine is used as a motor, an adaptive phase lag compensation scheme helps the sensorless field oriented control (FOC) scheme to perform more accurately.
    Type: Application
    Filed: January 2, 2014
    Publication date: July 10, 2014
    Inventors: Xinzhang Wu, Hanzhou Liu, Yang Hu, Louis Chow, Jon Harms, Martin Epstein, Wei Wu
  • Patent number: 8434225
    Abstract: A method for manufacturing a heat pipe. Activated particles or particle clusters are formed. The activated particles or particle clusters are contacted with a working fluid in a non-oxidizing environment to form a chemisorbed layer of the working fluid thereon to generate chemisorbed working fluid surfaced activated hydrophilic particles or activated hydrophilic particle clusters which provide a solid-liquid contact angle to working fluid when subsequently added of <30 degrees. The chemisorbed working fluid surfaced activated hydrophilic particles or hydrophilic particle clusters are vacuum transferred and filled inside the heat pipe along with an additional volume of working fluid. The heat pipe is then sealed.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: May 7, 2013
    Assignee: University of Central Florida Research Foundation, Inc.
    Inventors: Edward T. Mahefkey, Louis Chow, Ming Su
  • Patent number: 8371134
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: February 12, 2013
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20120279068
    Abstract: A method for manufacturing a heat pipe. Activated particles or particle clusters are formed. The activated particles or particle clusters are contacted with a working fluid in a non-oxidizing environment to form a chemisorbed layer of the working fluid thereon to generate chemisorbed working fluid surfaced activated hydrophilic particles or activated hydrophilic particle clusters which provide a solid-liquid contact angle to working fluid when subsequently added of <30 degrees. The chemisorbed working fluid surfaced activated hydrophilic particles or hydrophilic particle clusters are vacuum transferred and filled inside the heat pipe along with an additional volume of working fluid. The heat pipe is then sealed.
    Type: Application
    Filed: July 9, 2012
    Publication date: November 8, 2012
    Applicant: University of Central Florida Research Foundation, Inc.
    Inventors: EDWARD T. MAHEFKEY, LOUIS CHOW, MING SU
  • Patent number: 8235096
    Abstract: A heat pipe includes a sealed thermally conductive casing having a length that has a first end for coupling to a heat source to be cooled and a second end for coupling to a heat sink opposite the first end. The casing has an inside surface that defines a thermal control volume above. The thermal control volume includes (i) a plurality of hydrophilic particles or clusters of hydrophilic particles in a size range from nano size to micron size attached as a hydrophilic film to the inside surface or to a wick on the inside surface, wherein the plurality of hydrophilic particles occupy only a portion of an area of the inside surface or an internal pore space of the wick or a surface area of the wick, (ii) a vapor cavity above the hydrophilic film or the wick, and (iii) a heat transfer working fluid contained as a liquid on the hydrophilic film or the wick, and as a vapor in the vapor cavity.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: August 7, 2012
    Assignee: University of Central Florida Research Foundation, Inc.
    Inventors: Edward T. Mahefkey, Louis Chow, Ming Su
  • Patent number: 8024942
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: September 27, 2011
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7942646
    Abstract: A high speed centrifugal compressor for compressing fluids includes a permanent magnet synchronous motor (PMSM) having a hollow shaft, the being supported on its ends by ball bearing supports. A permanent magnet core is embedded inside the shaft. A stator with a winding is located radially outward of the shaft. The PMSM includes a rotor including at least one impeller secured to the shaft or integrated with the shaft as a single piece. The rotor is a high rigidity rotor providing a bending mode speed of at least 100,000 RPM which advantageously permits implementation of relatively low-cost ball bearing supports.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: May 17, 2011
    Assignee: University of Central Florida Foundation, Inc
    Inventors: Lei Zhou, Liping Zheng, Louis Chow, Jayanta S. Kapat, Thomas X. Wu, Krishna M. Kota, Xiaoyi Li, Dipjyoti Acharya
  • Patent number: 7942642
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: May 17, 2011
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7921664
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: April 12, 2011
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow, Bradley G. Carman, Benjamin A. Saarloos
  • Publication number: 20100293993
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: December 21, 2007
    Publication date: November 25, 2010
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20100071390
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: June 30, 2009
    Publication date: March 25, 2010
    Applicant: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20100071389
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: June 30, 2009
    Publication date: March 25, 2010
    Applicant: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7654100
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: February 2, 2010
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow, Bradley G. Carman, Benjamin A. Saarloos
  • Publication number: 20080210406
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Application
    Filed: March 11, 2008
    Publication date: September 4, 2008
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow, Bradley G. Carman, Benjamin A. Saarloos