Patents by Inventor Louis Chow

Louis Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080099187
    Abstract: The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber.
    Type: Application
    Filed: January 7, 2008
    Publication date: May 1, 2008
    Inventors: Daniel Rini, Louis Chow
  • Patent number: 7318325
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: January 15, 2008
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7316262
    Abstract: The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: January 8, 2008
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow
  • Publication number: 20070269323
    Abstract: A high speed centrifugal compressor for compressing fluids includes a permanent magnet synchronous motor (PMSM) having a hollow shaft, the being supported on its ends by ball bearing comprising supports. A permanent magnet core is embedded inside the shaft. A stator with a winding is located radially outward of the shaft. The PMSM includes a rotor including at least one impeller secured to the shaft or integrated with the shaft as a single piece. The rotor is a high rigidity rotor providing a bending mode speed of at least 100,000 RPM which advantageously permits implementation of relatively low-cost ball bearing comprising supports.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 22, 2007
    Inventors: Lei Zhou, Liping Zheng, Louis Chow, Jayanta S. Kapat, Thomas X. Wu, Krishna M. Kota, Xiaoyi Li, Dipjyoti Acharya
  • Publication number: 20060150666
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: January 31, 2006
    Publication date: July 13, 2006
    Inventors: Daniel Rini, Louis Chow, H. Anderson, Jayanta Kapat, Bradley Carman, Brian Gulliver, Jose Recio
  • Publication number: 20060117782
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Application
    Filed: December 16, 2005
    Publication date: June 8, 2006
    Inventors: Daniel Rini, H. Anderson, Jayanta Kapat, Louis Chow, Bradley Carman, Benjamin Saarloos
  • Publication number: 20060057716
    Abstract: A new mouse cell line, MCP-5, derived from human malignant cystosarcoma phyllodes was established. This invention provides methods for establishing MCP-5. MCP-5 may serve as both in vitro and in vivo models for studying pathogenesis and experimental therapy of human malignant cystosarcoma.
    Type: Application
    Filed: September 15, 2004
    Publication date: March 16, 2006
    Inventors: Louis Chow, Tjing Loo
  • Patent number: 7010936
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: March 14, 2006
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 6993926
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: February 7, 2006
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow
  • Patent number: 6975465
    Abstract: The subject invention relates to beam control prisms and the use of a beam control prism to modify the beam properties of light emitted from an edge emitting diode laser. The subject invention can utilize a beam control prism placed next to a diode laser bar. The subject beam control prism can have, for example, a curved surface and/or a high reflective coated surface for a diode laser wavelength. The curved surface can collimate the fast axis divergence and the mirror surface can change the beam direction. The subject curved surface beam control prisms can incorporate one or more features, such as parabolic reflecting surface, elliptical exit surface with flat reflecting surface, and a hyperbolic entrance surface with flat reflecting surface.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: December 13, 2005
    Assignee: University of Central Florida Research Foundation, Inc.
    Inventors: Te-Yuan Chung, Michael Bass, Daniel P. Rini, H. Randolph Anderson, Louis Chow
  • Publication number: 20040129018
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: July 22, 2003
    Publication date: July 8, 2004
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 6571569
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: June 3, 2003
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow