Patents by Inventor Lu An

Lu An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12009021
    Abstract: A system for processing a data array, such as transposing a matrix, includes a two-dimensional array of memory cells, such as FeFETs, each having an input end, an output end and a control end. The system also includes an input interface is adapted to supply signals indicative of a subset of the data array, such as a row of a matrix, and output control signals to the input ends of a selected column of the memory cells. The system further includes an output interface adapted to receive the data stored in the memory array from the output ends of a selected row of the memory cells. A method of processing a data array, such as transposing a matrix, include writing subsets of the data array to the memory array column-by-column, and reading from the memory cells, row-by-row.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Shih-Lien Linus Lu
  • Patent number: 12009695
    Abstract: A power conversion system is coupled between a power grid and a load. The power conversion system includes a battery, a first converter, a second converter and a DC/DC converter. The first converter is configured to selectively convert an input power from the power grid into a first charging power when the power grid is operated normally. The second converter is configured to convert the input power from the power grid into an output power when the power grid is operated normally. The DC/DC converter is electrically connected between the battery and the second converter. The DC/DC converter is configured to convert a storage power in the battery into a backup power when the power grid is not operated normally.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: June 11, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Jun Chen, Tsu-Hua Ai, Changyong Wang, Yansong Lu, Jun Liu
  • Patent number: 12008834
    Abstract: An ultrasonic sensor device includes a plurality of pixels each including an ultrasonic transducer, and a control circuit configured to control the plurality of pixels. Each of the plurality of pixels is configured to hold a signal received by the ultrasonic transducer therein and send the signal to the control circuit as a response signal. The control circuit is configured to acquire an excitation response signal, which is a response signal sent from a pixel after the ultrasonic transducer therein is excited, acquire a non-excitation response signal, which is a response signal sent from a pixel when the ultrasonic transducer therein is not excited, and correct the excitation response signal based on the non-excitation response signal.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: June 11, 2024
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Hiroshi Haga, Shin Takeuchi, Kenji Sera, Kenichi Hayashi, Feng Lu, Haochi Yu, QiJun Yao
  • Patent number: 12009893
    Abstract: Provided are a method and device for reporting channel state information (CSI), a method and device for processing channel state information, and a storage medium. The method for reporting channel state information includes: dividing M subbands to be reported into two sets; determining a relative value between CSI of each subband in a second set and CSI of a reference subband corresponding to the each subband in the second set; and reporting CSI of each subband in a first set and the relative value of the each subband in the second set to a base station.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 11, 2024
    Assignee: ZTE CORPORATION
    Inventors: Yong Li, Hao Wu, Yu Ngok Li, Zhaohua Lu, Yijian Chen
  • Patent number: 12010456
    Abstract: A frame interpolation method for generating a third image frame interpolated between a first image frame and a second image frame includes: performing motion estimation upon a first input image frame and a second input image frame, to obtain a single-directional motion, wherein the first input image frame is derived from the first image frame, and the second input image frame is derived from the second image frame; scaling the single-directional motion according to a time point of the third image frame, to generate a scaled motion; deriving a forward-warped result from a result of performing a forward warping operation and a first inverse operation upon the scaled motion; performing a second inverse operation upon the forward-warped result, to generate an inversed result; and generating the third image frame according to the first image frame, the second image frame, the forward-warped result, and the inversed result.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: June 11, 2024
    Assignee: MEDIATEK INC.
    Inventors: Yao-Sheng Wang, Pei-Kuei Tsung, Chia-Ni Lu, Yu-Sheng Lin, Chien-Yu Huang, Chih-Wen Goo, Cheng-Lung Jen
  • Patent number: 12009362
    Abstract: A method of making a semiconductor device includes forming a first active region on a first side of a substrate. The method further includes forming a first source/drain (S/D) electrode surrounding a first portion of the first active region. The method further includes forming an S/D connect via extending through the substrate. The method further includes flipping the substrate. The method further includes forming a second active region on a second side of the substrate, wherein the second side of the substrate is opposite to the first side of the substrate. The method further includes forming a second S/D electrode surrounding a first portion of the second active region, wherein the S/D connect directly contacts both the first S/D electrode and the second S/D electrode.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Yu Lai, Chih-Liang Chen, Chi-Yu Lu, Shang-Syuan Ciou, Hui-Zhong Zhuang, Ching-Wei Tsai, Shang-Wen Chang
  • Patent number: 12010186
    Abstract: Disclosed herein is a method for indirect communication in a core network of a wireless communication system using a Service Communication Proxy, SCP, with Transport Layer Security, TLS, the method comprising: at a Network Function, NF, service consumer: sending, to the SCP, a Hypertext Transfer Protocol, HTTP, message that is intended for a first NF service producer instance, the HTTP message using a Fully Qualified Domain Name, FQDN, of the SCP and having a path that includes a query parameter set to a first value; and at the SCP: receiving the HTTP message from the NF service consumer; obtaining a HTTP response for the HTTP message; and sending the HTTP response to the NR service consumer; and at the NF service consumer: receiving the HTTP response from the SCP.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: June 11, 2024
    Assignee: Telefonaktiebolaget L M Ericsson (publ)
    Inventors: Yong Yang, Jesus-Angel de-Gregorio-Rodriguez, Yunjie Lu
  • Patent number: 12009407
    Abstract: A method of forming a semiconductor device includes: forming a dummy gate structure over a nanostructure, where the nanostructure overlies a fin that protrudes above a substrate, where the nanostructure comprises alternating layers of a first semiconductor material and a second semiconductor material; forming openings in the nanostructure on opposing sides of the dummy gate structure, the openings exposing end portions of the first semiconductor material and end portions of the second semiconductor material; recessing the exposed end portions of the first semiconductor material to form first sidewall recesses; filling the first sidewall recesses with a multi-layer spacer film; removing at least one sublayer of the multi-layer spacer film to form second sidewall recesses; and forming source/drain regions in the openings after removing at least one sublayer, where the source/drain regions seal the second sidewall recesses to form sealed air gaps.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Kai Lin, Yung-Cheng Lu, Che-Hao Chang, Chi On Chui
  • Patent number: 12010574
    Abstract: When a quantity of radio resources available for a terminal device is less than a quantity of required radio resources, the terminal device sends a request to another terminal device, to request the another terminal device to release at least one radio resource currently used by the another terminal device or reselect a radio resource. The another terminal device that receives the request may autonomously release or request a network to release the at least one radio resource currently used by the another terminal device, or autonomously reselect or request a network to reselect the radio resource, and send a response to the terminal that sends the request. Nonconsecutive fragmented radio resources may be integrated into consecutive and relatively large radio resources, so that radio resource fragments are reduced, and the terminal device can send control information and data in a timely manner, thereby improving radio resource utilization.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: June 11, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jinfang Zhang, Zhengzheng Xiang, Hongjia Su, Lei Lu
  • Patent number: 12009256
    Abstract: A method includes forming a metal seed layer over a first conductive feature of a wafer, forming a patterned photo resist on the metal seed layer, forming a second conductive feature in an opening in the patterned photo resist, and heating the wafer to generate a gap between the second conductive feature and the patterned photo resist. A protection layer is plated on the second conductive feature. The method further includes removing the patterned photo resist, and etching the metal seed layer.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin
  • Patent number: 12009139
    Abstract: An electromagnetic component assembly includes a first magnetic core piece, a second magnetic core piece, and an inverted U-shaped conductive winding including a base section and first and second legs extending from base section. One of the first and second magnetic core pieces is configured to receive the base section. The first and second magnetic core pieces are gapped from one another to define a first gap, and one of the first and second magnetic core pieces includes a second gap that, in combination with the first gap, allows the component to be operated at more than one stable open circuit inductance (OCL) corresponding to different current loads.
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: June 11, 2024
    Assignee: Eaton Intelligent Power Limited
    Inventors: Yipeng Yan, Dengyan Zhou, Jinliang Xu, Jin Lu
  • Patent number: 12010720
    Abstract: A terminal connection method includes that: a first terminal sends a first message to a second terminal, the first message including a first access layer configuration parameter, and the first access layer configuration parameter being used by the second terminal to configure a parameter of an access layer to communicate with the first terminal.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: June 11, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Qianxi Lu, Jianhua Liu, Zhenshan Zhao, Huei-Ming Lin
  • Patent number: 12009505
    Abstract: Provided is a composite layer of graphene sheets and anode particles being dispersed in a conducting polymer network for a lithium battery anode (negative electrode), the layer comprising a mixture of a conducting polymer network, multiple graphene sheets, and multiple particles of an anode active material, wherein the anode particles have a diameter or thickness from 0.5 nm to 20 ?m and occupy from 30% to 98% by weight, the graphene sheets occupy from 0.01% to 25% by weight, and the conducting polymer network occupies from 1% to 30% by weight based on the total mixture weight and wherein the graphene sheets and the conducting polymer network together form dual conducting pathways for both electrons and lithium ions.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: June 11, 2024
    Assignee: Honeycomb Battery Company
    Inventors: Sheng-Yi Lu, Aruna Zhamu, Bor Z. Jang
  • Patent number: 12009979
    Abstract: Systems and methods are provided for zero-touch provisioning of devices, such as sensors, on a network. When a device is unable/cannot access a network via Ethernet, cellular, or near field communications capabilities resident on the device, the device can alternatively be provisioned via an intermediate network device, such as an access point using, e.g., Device Provisioning Protocol or Wi-Fi EasyConnect. A cloud-based network management system may receive a device's bootstrapping information during or after manufacturing of the device. Ultimately, the device, via the intermediate network device, is able to communicate with a back-end, cloud-based network insight system from which configuration parameters for the device may be obtained.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: June 11, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Mohd Shahnawaz Siraj, Rahul Bahal, Kannan Konath, Hao Lu
  • Patent number: 12009254
    Abstract: A method includes forming a first conductive feature on a substrate, forming a via that contacts the first conductive feature, the via comprising a conductive material, performing a Chemical Mechanical Polishing (CMP) process to a top surface of the via, depositing an Interlayer Dielectric (ILD) layer on the via, forming a trench within the ILD layer to expose the via, and filling the trench with a second conductive feature that contacts the via, the second conductive feature comprising a same material as the conductive material.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Yuan Chen, Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin
  • Patent number: 12010105
    Abstract: A first device and a home hub have a same TEE platform, and a second device and the home hub have different TEE platforms. A control method includes the home hub receiving an identity credential of the second device and public key information of the first device from the second device. The home hub controls an IoT device based on the identity credential of the second device. The home hub receives private key information that is of the first device and that is from the first device. The home hub forms an identity credential of the first device based on the public key information of the first device and the private key information of the first device to control the IoT device.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: June 11, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Lu Gan, Xiaoshuang Ma, Jianhao Huang, Chao He
  • Patent number: 12009265
    Abstract: A method of forming an integrated circuit structure includes forming a first source/drain contact plug over and electrically coupling to a source/drain region of a transistor, forming a first dielectric hard mask overlapping a gate stack, recessing the first source/drain contact plug to form a first recess, forming a second dielectric hard mask in the first recess, recessing an inter-layer dielectric layer to form a second recess, and forming a third dielectric hard mask in the second recess. The third dielectric hard mask contacts both the first dielectric hard mask and the second dielectric hard mask.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Lin-Yu Huang, Li-Zhen Yu, Sheng-Tsung Wang, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang
  • Patent number: 12010692
    Abstract: This application provides example sidelink control information sending methods and example communications devices. One example method includes sending, by a first communications device, first sub control information to a second communications device and a third communications device, where the first sub control information is scrambled by using a common scrambling sequence, the first communications device and the second communications device belong to a first communications device group, and the third communications device does not belong to the first communications device group. The first communications device can then send second sub control information to the second communications device, where the second sub control information is scrambled by using a scrambling sequence generated by using a user equipment identifier of the second communications device or a scrambling sequence generated by using a group identifier of the first communications device group.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: June 11, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jinfang Zhang, Hongjia Su, Zhengzheng Xiang, Lei Lu
  • Patent number: 12006324
    Abstract: Disclosed herein is a specific method of preparation of Trilaciclib. The said method is to provide an efficacy of a protection free synthetic method of Trilaciclib with less steps and good yields.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: June 11, 2024
    Assignee: CHUNGHWA CHEMICAL SYNTHESIS & BIOTECH CO. LTD.
    Inventors: Satyanarayana Kamani, Hsin-Yun Chang, Tzu-Chiang Lu, Chin-Cheng Mai
  • Patent number: D1031096
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: June 11, 2024
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Di Zhou, Cathy Wang, Qiwen Xu, Lei Lei Lu