Abstract: Described and provided herein are novel antibodies for Claudin 18.2. Also described and provided are pharmaceutical compositions of the antibodies and methods of use for the treatment of cancer.

Abstract: An embedded circuit board includes a circuit board including a flexible base layer, a first conductive circuit layer, a second conductive circuit layer, two adhesive layers, and two copper plates. The first conductive circuit layer and the second conductive circuit layer are formed on corresponding opposite base layer surfaces of the base layer and electrically interconnected together. A photosensitive layer is located on one surface of the circuit board. A component is located within a mounting slot formed within the photosensitive layer. Each copper plate includes a flexible insulating film and forms a third conductive circuit layer. The flexible insulating film is adhered to a corresponding one of the circuit board or the photosensitive material layer by a corresponding one of the adhesive layers.

Abstract: The invention relates to a cathode material of lithium cobalt oxide for a lithium ion secondary battery and preparation methods and applications thereof. A cathode material comprises a core material and a coating layer, wherein the core material is LixCo(1?y)AyO(2+z), wherein 1.0?x?1.11, 0?y?0.02, ?0.2<z<0.2, and A is one or two or more selected from the group consisting of Al, Mg, Y, Zr and Ti, wherein the coating layer is LiaMbBcOd, wherein M is a lithium ion active metal element and one or two or more selected from the group consisting of Co, Ni, Mn and Mo, and B is an inactive element, and one or two or more selected from the group consisting of Al, Mg, Ti, Zr and Y, and 0.95<b+c<2.5, and the molar ratio of Li to the active metal element M is 0<a/b<1. The battery prepared by the cathode material has advantages of high capacity, high compacted density and excellent cycling stability etc., under high voltage.

Abstract: An initial processing of natural raw rubber through an initial processing machine, comprising the steps of: (a) providing a coagulated latex which contains water and volatile compositions; (b) dewatering the coagulated latex through a screw-pressing process to remove free water; (c) forming a first pretreated latex material; (d) aging the first pretreated latex material through an aging process to remove water and volatile compositions; and (e) forming a final product of aged latex material. The screw-pressing process makes use of the temperature and pressure increase along the elongated channel structure. The aging process makes use of the further temperature and pressure increase of the rubber materials, together with the screwing effect of the screw-shaft component, the squeezing effect of the nozzle and additional heating at a particular location, which is around the mouthpiece of the nozzle to complete the aging process, which is energy saving, effective and efficient.

Abstract: A system includes a storage device storing a set of instructions and at least one processor in communication with the storage device. When executing the instructions, the at least one processor is configured to cause the system to obtain a dispatch demand associated with a target service area and determine at least one first candidate service provider for the dispatch demand. The at least one processor may also cause the system to transmit a dispatch request to the at least one first candidate service provider. The at least one processor may further cause the system to determine, among the at least one first candidate service provider, a second candidate service provider, and transmit a service order associated with the target service area to the second candidate service provider at a first time point.

Abstract: Starch nanoparticles (SNPs) were fluorescently labeled with 1-pyrenebutyric acid and pyrene fluorescence was employed to detect nitrated organic compounds (NOCs) in solution and on paper surfaces. Fluorescence quenching of the pyrene-labeled SNPs (Py-SNPs) by NOCs such as nitromethane, nitrotoluene (MNT), dinitrotoluene (DNT), and trinitrotoluene (TNT) was characterized in DMSO and water. Since pyrene is insoluble in water, the fluorescence of the pyrene excimer that dominated the fluorescence spectrum of the Py-SNPs dispersed in water was used for the fluorescence quenching experiments. The efficient binding of the aromatic NOCs to the pyrene aggregates of Py-SNPs dispersed in water was used to detect NOCs by Py-SNPs adsorbed at the surface of paper sheets. The low quantities of aromatic NOCs detected by the Py-SNPs demonstrate the potential of Py-SNP-coated paper for the detection of such compounds.

Abstract: A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board.

Abstract: Methods and computer systems for audio search on a social networking platform are disclosed. While running a social networking application, a computer system receives a first audio input from a user of the computer system and then generates a first audio confusion network from the first audio input. After comparing the first audio confusion network with one or more second audio confusion networks, each corresponding to a second audio input associated with one of a plurality of participants of a chat session of the social networking application, the computer system identifies at least one second audio input corresponding to the at least one second audio confusion network that matches the first audio confusion network and displays a portion of the chat session including a visual icon representing the identified second audio input on a display of the computer system.

Abstract: Methods, devices and systems for the planning and execution of computer-assisted robotic surgery are provided. The methods include methods to collect information about bones and prostheses, use the information to create virtual models and simulations, optionally receive input based on user discretion in generating the cut file, and to generate instruction for the execution of cut paths during the surgery. The system and devices include computers and peripherals and set-ups to link the components together into functional systems.

Abstract: High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

Abstract: A method of manufacturing an embedded flexible circuit board includes: providing a first circuit substrate comprising at least one welding pad which is further to carry on surface treatment on the at least one welding pad to form a protective layer; providing at least one embedded middle body including a base a thin-film resistor formed onto the base, and a conducting resin, the conducting resin formed onto the thin-film resistor and being opposite from the base; fitting the embedded middle body onto the at least one welding pad through the conducting resin, and electronically connecting the thin-film resistor and the at least one welding pad through the conducting resin; removing the base; and forming a second circuit substrate at a side of the first circuit substrate where the thin-film resistor attached on, thereby the thin-film resistor sandwiched between the first circuit substrate and the second circuit substrate.

Abstract: A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board.

Abstract: A method of manufacturing an embedded flexible circuit board includes: providing a first circuit substrate comprising at least one welding pad; providing at least one embedded middle body including a base a thin-film resistor formed onto the base, and a conducting resin, the conducting resin formed onto the thin-film resistor and being opposite from the base; fitting the embedded middle body onto the at least one welding pad through the conducting resin, and electronically connecting the thin-film resistor and the at least one welding pad through the conducting resin; removing the base; and forming a second circuit substrate at a side of the first circuit substrate where the thin-film resistor attached on, thereby the thin-film resistor sandwiched between the first circuit substrate and the second circuit substrate. An embedded flexible circuit board made by the method is also provided.

Abstract: A multilayer circuit board comprises an inner circuit board, a tin layer, at least one outer circuit board, and a solder mask. The inner circuit board comprises at least one first mounting region and at least one second mounting region. The tin layer is formed on a surface of the inner circuit board except the first mounting region connecting the outer circuit board. The outer circuit board comprises at least one first opening to expose the first mounting region and at least one second opening to expose a portion of the tin layer covering the second mounting region. The inner circuit board, the tin layer, and the outer circuit board together form a middle structure. The solder mask covers the middle structure except the portion and the first mounting region. A treatment layer is formed on the first mounting region.

Abstract: Microelectronic systems and components having integrated heat dissipation posts are disclosed, as are methods for fabricating such microelectronic systems and components. In various embodiments, the microelectronic system includes a substrate having a frontside, a socket cavity, and inner cavity sidewalls defining the socket cavity. A microelectronic component is seated on the frontside of the substrate such that a heat dissipation post, which projects from the microelectronic component, is received in the socket cavity and separated from the inner cavity sidewalls by a peripheral clearance. The microelectronic system further includes a bond layer contacting the inner cavity sidewalls, contacting an outer peripheral portion of the heat dissipation post, and at least partially filling the peripheral clearance.

Abstract: Methods, devices and systems for the planning and execution of computer-assisted robotic surgery are provided. The methods include methods to collect information about bones and prostheses, use the information to create virtual models and simulations, optionally receive input based on user discretion in generating the cut file, and to generate instruction for the execution of cut paths during the surgery. The system and devices include computers and peripherals and set-ups to link the components together into functional systems.

Abstract: The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.

Abstract: Microelectronic systems having integrated heat dissipation posts are disclosed, as are methods for fabricating such microelectronic systems. In various embodiments, the method includes the step or process of obtaining a microelectronic component from which a heat dissipation post projects. The microelectronic component is placed or seated on a substrate, such as a multilayer printed circuit board, having a socket cavity therein. The heat dissipation post is received in the socket cavity as the microelectronic component is seated on the substrate. Concurrent with or after seating the microelectronic component, the microelectronic component and the heat dissipation post are bonded to the substrate. In certain embodiments, the heat dissipation post may be dimensioned or sized such that, when the microelectronic component is seated on the substrate, the heat dissipation post occupies a volumetric majority of the socket cavity.