Abstract: A method for manufacturing a flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes providing an inner wiring board including a first conductive wiring layer and a first substrate layer, the first conductive wiring layer including a signal line and two ground lines on both sides of the signal line, the first substrate layer covering a side of the first conductive wiring layer and defining first through holes which expose the signal line; providing two copper clad laminates including a second substrate layer and a copper foil, the second substrate layer having second through hole aligned with the first through holes; laminating the two copper clad laminates onto two sides of the inner wiring board via two adhesive layers, each adhesive layer defining third through holes aligned with the first and second through holes; and forming a second conductive wiring layer from the copper foil.

Abstract: The present disclosure relates to a damping system for a hydraulic coupling device, comprising: an output hub having a central axis and a torus which surrounds the central axis, a first track being arranged in the torus; a plurality of turbine mass assemblies uniformly distributed around the central axis, each turbine mass assembly comprising a turbine section, each turbine section carrying a plurality of blades and being provided with a second track corresponding to the first track; a roller that can roll along a roller track defined by the first track and a corresponding second track, so that the turbine mass assembly can move relative to the output hub and exert torque on the output hub; wherein each turbine mass assembly further comprises a mass plate fixedly connected to the turbine section, the output hub being arranged between the mass plate and the turbine section.

Abstract: A thermal interface structure for transferring heat from an electronic component to a system heat sink includes a stack of one or more layers of a stiff thermal interface material and one or more layers of a compliant thermal interface material stacked on and connected to the one or more layers of the compliant thermal interface material. In some embodiments, the thermal interface structure also may include one or more layers of a shape memory alloy and/or a collapsible encasement.

Abstract: The present invention discloses a method for recognizing a seawater polluted area based on a high-resolution remote sensing image and a device and belongs to the field of digital image processing.

Abstract: Described and provided herein are novel antibodies for Claudin 18.2. Also described and provided are pharmaceutical compositions of the antibodies and methods of use for the treatment of cancer.

Abstract: The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.

Abstract: A display screen allowing higher pixel density and thus better screen resolution by virtue of the structures connecting to LED chip light sources includes a substrate, a number of pad structures, the LED chips, and a number of carrier boards. Each pad structure includes a positive electrode pad and three negative electrode pads. Each LED chip package includes a red light chip, a green light chip, and a blue light chip arranged on the three negative electrode pads. Each carrier board includes a positive electrode connection terminal and a negative electrode connection terminal, the positive electrode connection terminal is electrically connected to the positive electrode pad, the negative electrode connection terminal is electrically connected to one red light chip, one green light chip, or one blue light chip. The disclosure also provides a displaying device having the display screen.

Abstract: Techniques related to training and implementing a bidirectional pairing architecture for object detection are discussed. Such techniques include generating a first enhanced feature map for each frame of a video sequence by processing the frames in a first direction, generating a second enhanced feature map for frame by processing the frames in a second direction opposite the first, and determining object detection information for each frame using the first and second enhanced feature map for the frame.

Abstract: A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.

Abstract: System and techniques are provided for three-dimension (3D) semantic segmentation. A device for 3D semantic segmentation includes: an interface, to obtain a point cloud data set for a time-ordered sequence of 3D frames, the 3D frames including a current 3D frame and one or more historical 3D frames previous to the current 3D frame; and processing circuitry, to: invoke a first artificial neural network (ANN) to estimate a 3D scene flow field for each of the one or more historical 3D frames by taking the current 3D frame as a reference frame; and invoke a second ANN to: produce an aggregated feature map, based on the reference frame and the estimated 3D scene flow field for each of the one or more historical 3D frames; and perform the 3D semantic segmentation based on the aggregated feature map.

Abstract: The present disclosure provides an unmanned aerial vehicle platform based vision measurement method for a static rigid object. Aiming at the problem of high professionality but poor versatility of existing vision measurement methods, the present disclosure uses a method combining object detection and three-dimensional reconstruction to mark an object to be measured, and uses a three-dimensional point cloud processing method to further mark a size to be measured and calculate its length, which takes full advantage of the convenience of data collection by an unmanned aerial vehicle platform (UAV), and its global navigation satellite system (GNSS), an inertial measurement unit (IMU) and the like to assist measurement. There is no need to use common auxiliary devices such as a light pen and a marker, which can improve the versatility of vision measurement.

Abstract: A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Abstract: Systems, apparatuses and methods (30) may provide for technology that stores data associated with a plurality of intermediate operations in an autonomous vehicle process (32), generates a visualization output based at least partly on the data (34), and changes a magnification level of the visualization output based on user input (38), the visualization output is generated further based on parameter input and the data includes vector chart data.

Abstract: Techniques related to training and implementing a bidirectional pairing architecture for object detection are discussed. Such techniques include generating a first enhanced feature map for each frame of a video sequence by processing the frames in a first direction, generating a second enhanced feature map for frame by processing the frames in a second direction opposite the first, and determining object detection information for each frame using the first and second enhanced feature map for the frame.

Abstract: A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Abstract: A method for fabricating memory device includes: providing a substrate having a bottom electrode layer therein, forming a buffer layer and a mask layer on the buffer layer over the substrate, in contact with the bottom electrode layer, performing an advanced oxidation process on a sidewall of the buffer layer to form a resistive layer, which surrounds the whole sidewall of the buffer layer and extends upward vertically from the substrate, and forming, over the substrate, a noble metal layer and a top electrode layer on the noble metal layer, fully covering the resistive layer and the mask layer.

Abstract: A substrate is described with a thermal dissipation structure sintered to thermal vias. In one example, a microelectronic module includes a recess between first and second substrate surfaces. One or more thermal vias extend between the first substrate surface and the interior recess surface, wherein each of the thermal vias has an interior end exposed at the interior recess surface. A sintered metal layer is in the recess and in physical contact with the interior end of the thermal vias and a thermal dissipation structure is in the recess over the sintered metal layer. The thermal dissipation structure is attached to the substrate within the recess by the sintered metal layer, and the thermal dissipation structure is thermally coupled to the thermal vias through the sintered metal layer.

Abstract: A force sensor comprising a force sensitive resistor having a common electrode and an electrode array separated by a force sensitive resistor material. The sensor includes a preload structure, where the preload structure imparts a force on the force sensitive resistor material. The sensor may also include a signal conditioning board to read a signal from the electrode array and convert it to a digital output.

Abstract: Systems and methods for providing transportation service are disclosed. A method for providing transportation service may include: receiving, from a remote passenger terminal, a transportation service request in an area; receiving, from at least one service vehicle in the area, vehicle information of the at least one service vehicle; assigning, via a processor, the transportation service request to a service queue; determining, via the processor, that the transportation service request qualifies for prioritized processing based on the transportation service request, the vehicle information, and a status of the service queue; and providing, to the remote passenger terminal, an option for prioritized processing.

Abstract: The present invention relates to a structure of a memory device. The structure of a memory device includes a substrate, including a bottom electrode layer formed therein. A buffer layer is disposed on the substrate, in contact with the bottom electrode layer. A resistive layer surrounds a whole sidewall of the buffer layer, and extends upward vertically from the substrate. A mask layer is disposed on the buffer layer and the resistive layer. A noble metal layer is over the substrate, and fully covers the resistive layer and the mask layer. A top electrode layer is disposed on the noble metal layer.