Patents by Inventor Lu-Ming Lai

Lu-Ming Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210210662
    Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.
    Type: Application
    Filed: January 3, 2020
    Publication date: July 8, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi Wen CHIANG, Kuang-Hsiung CHEN, Lu-Ming LAI, Hsun-Wei CHAN, Hsin-Ying HO, Shih-Chieh TANG
  • Publication number: 20210206628
    Abstract: A semiconductor package structure includes a die paddle, a plurality of leads, an electronic component and a package body. Each of the plurality of leads is separated from the die paddle and has an inner side surface facing the die paddle. The electronic component is disposed on the die paddle. The package body covers the die paddle, the plurality of leads and the electronic component. The package body is in direct contact with a bottom surface of the die paddle and the inner side surface of the plurality of leads.
    Type: Application
    Filed: January 3, 2020
    Publication date: July 8, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Hsuan TSAI, Lu-Ming LAI, Chien-Wei FANG, Ching-Han HUANG
  • Publication number: 20210183839
    Abstract: An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsin-Ying HO, Ying-Chung CHEN, Lu-Ming LAI
  • Patent number: 11014806
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: May 25, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsu-Liang Hsiao, Lu-Ming Lai, Ching-Han Huang, Chia-Hung Shen
  • Publication number: 20210147219
    Abstract: A semiconductor package structure includes an electronic device having a first surface and an exposed region adjacent to the first surface; a dam disposed on the first surface and surrounding the exposed region of the electronic device; and a filter structure disposed on the dam.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 20, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Wei LIU, Huei-Siang WONG, Lu-Ming LAI
  • Publication number: 20210134857
    Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 6, 2021
    Inventors: Shih-Chieh TANG, Lu-Ming LAI, Chia Yun HSU
  • Publication number: 20210111083
    Abstract: A sensing module, a semiconductor device package and a method of manufacturing the same are provided. The sensing module includes a sensing device, a first protection film and a second protection film. The sensing device has an active surface and a sensing region disposed adjacent to the active surface of the sensing device. The first protection film is disposed on the active surface of the sensing device and fully covers the sensing region. The second protection film is in contact with the first protection film and the active surface of the sensing device.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 15, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Wei LIU, Huei-Siang WONG, Lu-Ming LAI
  • Publication number: 20210082835
    Abstract: A semiconductor device package and a method for packaging the same are provided. A semiconductor device package includes a carrier, an electronic component, a buffer layer, a reinforced structure, and an encapsulant. The electronic component is disposed over the carrier and has an active area. The buffer layer is disposed on the active area of the electronic component. The reinforced structure is disposed on the buffer layer. The encapsulant encapsulates the carrier, the electronic component and the reinforced structure.
    Type: Application
    Filed: September 12, 2019
    Publication date: March 18, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Che HUANG, Lu-Ming LAI
  • Publication number: 20210082791
    Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 18, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Ying-Chung CHEN, Hui-Chung LIU
  • Patent number: 10916492
    Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: February 9, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tsann Huei Lee, Lu-Ming Lai
  • Publication number: 20210036658
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Application
    Filed: October 19, 2020
    Publication date: February 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Ching-Han HUANG, Hui-Chung LIU, Kuo-Hua LAI, Cheng-Ling HUANG
  • Publication number: 20210017018
    Abstract: A semiconductor package structure includes an electronic device having an exposed region adjacent to a first surface, a dam surrounding the exposed region of the semiconductor die and disposed on the first surface, the dam having a top surface away from the first surface, an encapsulant encapsulating the first surface of the electronic device, exposing the exposed region of the electronic device. A surface of the dam is retracted from a top surface of the encapsulant. A method for manufacturing the semiconductor package structure is also provided.
    Type: Application
    Filed: July 19, 2019
    Publication date: January 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Wei LIU, Huei-Siang WONG, Lu-Ming LAI
  • Publication number: 20200402879
    Abstract: A semiconductor package structure includes a substrate; a first die on the substrate, wherein an active surface of the first die is facing away from the substrate; a second die on the active surface of the first die, electrically connected to the first die through a plurality of conductive terminals; and a sealing structure on the active surface of the first die, surrounding the plurality of conductive terminals and abutting the second die thereby forming a cavity between the first die and the second die. A method for manufacturing the semiconductor package structure is also provided.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 24, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Hui-Chung LIU
  • Patent number: 10862014
    Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: December 8, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Lu-Ming Lai, Shih-Chieh Tang
  • Patent number: 10841679
    Abstract: A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. The transducer unit is electrically connected to the first substrate, and includes a base and a membrane. The membrane is located between the through hole and the base. The semiconductor chip is electrically connected to the first substrate and the transducer unit. The second substrate is attached to the first substrate and defines a cavity. The transducer unit and the chip are disposed in the cavity, and the second substrate is electrically connected to the transducer unit and the semiconductor chip through the first substrate.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: November 17, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsu-Liang Hsiao, Yu-Hsuan Tsai, Pu Shan Huang, Ching-Han Huang, Lu-Ming Lai
  • Patent number: 10818816
    Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: October 27, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Lu-Ming Lai, Shih-Chieh Tang
  • Patent number: 10812017
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: October 20, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua Lai, Cheng-Ling Huang
  • Publication number: 20200328322
    Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 15, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiang-Chen TSAI, Lu-Ming LAI, Hsun-Wei CHAN, Ying-Chung CHEN
  • Patent number: 10782184
    Abstract: The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. The electronic component includes a plurality of pixels. Each of the light conducting pillars is disposed over a corresponding pixel of the plurality of pixels of the electronic component. The opaque layer covers a lateral surface of each of the light conducting pillars.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: September 22, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Min Peng, Ching-Han Huang, Lu-Ming Lai
  • Patent number: 10752494
    Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: August 25, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Shih-Chieh Tang, Hsin-Ying Ho, Hsun-Wei Chan