Patents by Inventor Lu-Ming Lai

Lu-Ming Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10720751
    Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: July 21, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Hsuan Tsai, Lu-Ming Lai, Ying-Chung Chen, Shih-Chieh Tang
  • Patent number: 10689249
    Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: June 23, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ching-Han Huang, Hsun-Wei Chan, Lu-Ming Lai
  • Publication number: 20200194328
    Abstract: A device package includes a first carrier, a lid and a chip. The first carrier includes a substrate having a first surface and a second surface opposite to the first surface. The substrate defines a through-hole extended from the first surface to the second surface. The through-hole includes a first opening proximal to the first surface, and a second opening proximal to the second surface. The first barrier dam is disposed on the first surface and surrounds the first opening of the through-hole. The second barrier dam is disposed on the second surface and surrounds the second opening of the through-hole. The lid is disposed on the first surface. The lid and the first carrier define a chamber. The chip is disposed on the first surface and in the chamber.
    Type: Application
    Filed: December 12, 2018
    Publication date: June 18, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Ling HUANG, Ying-Chung CHEN, Lu-Ming LAI
  • Patent number: 10665765
    Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: May 26, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Mei-Yi Wu, Lu-Ming Lai, Yu-Ying Lee, Yung-Yi Chang
  • Patent number: 10629787
    Abstract: At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal member and covers at least a portion of the second bottom surface.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: April 21, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Ying-Chung Chen, Lu-Ming Lai
  • Publication number: 20200080841
    Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ying-Chung CHEN, Hsun-Wei CHAN, Lu-Ming LAI, Kuang-Hsiung CHEN
  • Publication number: 20200020827
    Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 16, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsin-Ying HO, Ying-Chung CHEN, Lu-Ming LAI
  • Publication number: 20200002162
    Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.
    Type: Application
    Filed: June 25, 2019
    Publication date: January 2, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Yu-Hsuan TSAI, Yin-Hao CHEN, Hsin Lin WU, San-Kuei YU
  • Patent number: 10508910
    Abstract: An optical module includes a carrier, a light source disposed on an upper side of the carrier, an optical sensor disposed on the upper side of the carrier, and a housing disposed on the upper side of the carrier over the light source and the optical sensor. The housing defines a first aperture exposing at least a portion of the light source and a second aperture exposing at least a portion of the optical sensor. An outer sidewall of the housing includes at least one singulation portion adjacent to the upper side of the carrier and perpendicular to the upper side of the carrier.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: December 17, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai, Kuang-Hsiung Chen
  • Publication number: 20190348351
    Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 14, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tsann Huei LEE, Lu-Ming LAI
  • Patent number: 10436635
    Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: October 8, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi Wen Chiang, Hsin-Ying Ho, Hsun-Wei Chan, Lu-Ming Lai
  • Publication number: 20190267298
    Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.
    Type: Application
    Filed: February 21, 2019
    Publication date: August 29, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsin Lin WU, Yu-Hsuan TSAI, Chang Chin TSAI, Lu-Ming LAI, Ching-Han HUANG
  • Publication number: 20190202686
    Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.
    Type: Application
    Filed: December 6, 2018
    Publication date: July 4, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Shih-Chieh TANG, Hsin-Ying HO, Hsun-Wei CHAN
  • Publication number: 20190157492
    Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.
    Type: Application
    Filed: November 22, 2017
    Publication date: May 23, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Lu-Ming LAI, Shih-Chieh TANG
  • Publication number: 20190097387
    Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 28, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Hsuan TSAI, Lu-Ming LAI, Ying-Chung CHEN, Shih-Chieh TANG
  • Patent number: 10170658
    Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: January 1, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Hsuan Tsai, Lu-Ming Lai
  • Publication number: 20180334380
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.
    Type: Application
    Filed: May 18, 2017
    Publication date: November 22, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsu-Liang HSIAO, Lu-Ming LAI, Ching-Han HUANG, Chia-Hung SHEN
  • Patent number: 10069051
    Abstract: A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: September 4, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Lu-Ming Lai
  • Publication number: 20180233643
    Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
    Type: Application
    Filed: January 2, 2018
    Publication date: August 16, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Yi WU, Lu-Ming LAI, Yu-Ying LEE, Yung-Yi CHANG
  • Publication number: 20180213312
    Abstract: A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. The transducer unit is electrically connected to the first substrate, and includes a base and a membrane. The membrane is located between the through hole and the base. The semiconductor chip is electrically connected to the first substrate and the transducer unit. The second substrate is attached to the first substrate and defines a cavity. The transducer unit and the chip are disposed in the cavity, and the second substrate is electrically connected to the transducer unit and the semiconductor chip through the first substrate.
    Type: Application
    Filed: January 24, 2018
    Publication date: July 26, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsu-Liang Hsiao, Yu-Hsuan Tsai, Pu Shan Huang, Ching-Han Huang, Lu-Ming Lai