Patents by Inventor Lu-Ming Lai
Lu-Ming Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200194328Abstract: A device package includes a first carrier, a lid and a chip. The first carrier includes a substrate having a first surface and a second surface opposite to the first surface. The substrate defines a through-hole extended from the first surface to the second surface. The through-hole includes a first opening proximal to the first surface, and a second opening proximal to the second surface. The first barrier dam is disposed on the first surface and surrounds the first opening of the through-hole. The second barrier dam is disposed on the second surface and surrounds the second opening of the through-hole. The lid is disposed on the first surface. The lid and the first carrier define a chamber. The chip is disposed on the first surface and in the chamber.Type: ApplicationFiled: December 12, 2018Publication date: June 18, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Ling HUANG, Ying-Chung CHEN, Lu-Ming LAI
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Patent number: 10665765Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.Type: GrantFiled: January 2, 2018Date of Patent: May 26, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Yi Wu, Lu-Ming Lai, Yu-Ying Lee, Yung-Yi Chang
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Patent number: 10629787Abstract: At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal member and covers at least a portion of the second bottom surface.Type: GrantFiled: March 22, 2017Date of Patent: April 21, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Ying-Chung Chen, Lu-Ming Lai
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Publication number: 20200080841Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.Type: ApplicationFiled: November 13, 2019Publication date: March 12, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ying-Chung CHEN, Hsun-Wei CHAN, Lu-Ming LAI, Kuang-Hsiung CHEN
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Publication number: 20200020827Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.Type: ApplicationFiled: July 8, 2019Publication date: January 16, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-Ying HO, Ying-Chung CHEN, Lu-Ming LAI
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Publication number: 20200002162Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.Type: ApplicationFiled: June 25, 2019Publication date: January 2, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chi Sheng TSENG, Lu-Ming LAI, Yu-Hsuan TSAI, Yin-Hao CHEN, Hsin Lin WU, San-Kuei YU
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Patent number: 10508910Abstract: An optical module includes a carrier, a light source disposed on an upper side of the carrier, an optical sensor disposed on the upper side of the carrier, and a housing disposed on the upper side of the carrier over the light source and the optical sensor. The housing defines a first aperture exposing at least a portion of the light source and a second aperture exposing at least a portion of the optical sensor. An outer sidewall of the housing includes at least one singulation portion adjacent to the upper side of the carrier and perpendicular to the upper side of the carrier.Type: GrantFiled: December 18, 2015Date of Patent: December 17, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai, Kuang-Hsiung Chen
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Publication number: 20190348351Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.Type: ApplicationFiled: May 11, 2018Publication date: November 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tsann Huei LEE, Lu-Ming LAI
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Patent number: 10436635Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.Type: GrantFiled: September 15, 2016Date of Patent: October 8, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi Wen Chiang, Hsin-Ying Ho, Hsun-Wei Chan, Lu-Ming Lai
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Publication number: 20190267298Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.Type: ApplicationFiled: February 21, 2019Publication date: August 29, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin Lin WU, Yu-Hsuan TSAI, Chang Chin TSAI, Lu-Ming LAI, Ching-Han HUANG
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Publication number: 20190202686Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.Type: ApplicationFiled: December 6, 2018Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chi Sheng TSENG, Lu-Ming LAI, Shih-Chieh TANG, Hsin-Ying HO, Hsun-Wei CHAN
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Publication number: 20190157492Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.Type: ApplicationFiled: November 22, 2017Publication date: May 23, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Lu-Ming LAI, Shih-Chieh TANG
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Publication number: 20190097387Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.Type: ApplicationFiled: August 30, 2018Publication date: March 28, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Hsuan TSAI, Lu-Ming LAI, Ying-Chung CHEN, Shih-Chieh TANG
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Patent number: 10170658Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.Type: GrantFiled: November 13, 2015Date of Patent: January 1, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yu-Hsuan Tsai, Lu-Ming Lai
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Publication number: 20180334380Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.Type: ApplicationFiled: May 18, 2017Publication date: November 22, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsu-Liang HSIAO, Lu-Ming LAI, Ching-Han HUANG, Chia-Hung SHEN
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Patent number: 10069051Abstract: A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.Type: GrantFiled: January 10, 2017Date of Patent: September 4, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Lu-Ming Lai
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Publication number: 20180233643Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.Type: ApplicationFiled: January 2, 2018Publication date: August 16, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi WU, Lu-Ming LAI, Yu-Ying LEE, Yung-Yi CHANG
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Publication number: 20180213312Abstract: A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. The transducer unit is electrically connected to the first substrate, and includes a base and a membrane. The membrane is located between the through hole and the base. The semiconductor chip is electrically connected to the first substrate and the transducer unit. The second substrate is attached to the first substrate and defines a cavity. The transducer unit and the chip are disposed in the cavity, and the second substrate is electrically connected to the transducer unit and the semiconductor chip through the first substrate.Type: ApplicationFiled: January 24, 2018Publication date: July 26, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsu-Liang Hsiao, Yu-Hsuan Tsai, Pu Shan Huang, Ching-Han Huang, Lu-Ming Lai
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Patent number: 9977147Abstract: An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space.Type: GrantFiled: December 18, 2015Date of Patent: May 22, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ruei-Bin Ma, Ying-Chung Chen, Lu-Ming Lai
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Publication number: 20180066982Abstract: The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. The electronic component includes a plurality of pixels. Each of the light conducting pillars is disposed over a corresponding pixel of the plurality of pixels of the electronic component. The opaque layer covers a lateral surface of each of the light conducting pillars.Type: ApplicationFiled: August 25, 2017Publication date: March 8, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Min PENG, Ching-Han HUANG, Lu-Ming LAI