Patents by Inventor Luc Haspeslagh
Luc Haspeslagh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11733095Abstract: A method for calibrating an image sensor begins by illuminating a portion of the image sensor with an input light spectrum, where the input light spectrum includes light of known wavelength and intensity. The method continues by sampling an output for each optical sensor of the image sensor, where each optical sensor is associated with one or more optical filters and where each optical filter being associated with a group of optical filters of a plurality of groups of optical filters. Each optical filter of a group of optical filters is configured to pass light in a different wavelength range and at least some optical filters in different groups of the plurality of groups of optical filters are configured to pass light in substantially a same wavelength range.Type: GrantFiled: April 27, 2021Date of Patent: August 22, 2023Assignee: IMECInventors: Nicolaas Tack, Andy Lambrechts, Luc Haspeslagh
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Publication number: 20230154914Abstract: According to a preferred embodiment of the method of the invention, an assembly is produced comprising a temporary wafer and one or more tiles that are removably attached to the temporary wafer, preferably through a temporary adhesive layer. The tiles comprise a carrier portion and an active material portion. The active material portion is attached to the temporary carrier. The assembly further comprises a single continuous layer of the first material surrounding each of the one or more tiles. Then the back side of the carrier portions of the tiles and of the continuous layer of the first material are simultaneously planarized, and the planarized back sides of the tiles and of the continuous layer of the first material are bonded to a permanent carrier wafer, after which the temporary carrier wafer is removed.Type: ApplicationFiled: November 15, 2022Publication date: May 18, 2023Inventors: Gauri Karve, Yunlong Li, Luc Haspeslagh, Philippe Soussan, Deniz Sabuncuoglu Tezcan
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Patent number: 11282702Abstract: The present invent provides a method comprising forming a first wafer comprising a first substrate of a group IV semiconductor, and a group III-V semiconductor device structure formed by selective area epitaxial growth on a surface portion of a front side of the first substrate. The method further comprises forming a second wafer comprising a second substrate of a group IV semiconductor, and a group IV semiconductor device structure formed on a front side of the second substrate, and bonding the first wafer to the second wafer with the front side of the first substrate facing the front side of the second wafer.Type: GrantFiled: October 12, 2020Date of Patent: March 22, 2022Assignee: IMEC VZWInventors: Philippe Soussan, Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Olga Syshchyk, Bernardette Kunert, Robert Langer
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Publication number: 20210247232Abstract: A method for calibrating an image sensor begins by illuminating a portion of the image sensor with an input light spectrum, where the input light spectrum includes light of known wavelength and intensity. The method continues by sampling an output for each optical sensor of the image sensor, where each optical sensor is associated with one or more optical filters and where each optical filter being associated with a group of optical filters of a plurality of groups of optical filters. Each optical filter of a group of optical filters is configured to pass light in a different wavelength range and at least some optical filters in different groups of the plurality of groups of optical filters are configured to pass light in substantially a same wavelength range.Type: ApplicationFiled: April 27, 2021Publication date: August 12, 2021Applicant: IMECInventors: Nicolaas Tack, Andy Lambrechts, Luc Haspeslagh
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Patent number: 11029207Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: GrantFiled: March 10, 2020Date of Patent: June 8, 2021Assignee: IMECInventors: Nicolaas Tack, Andy Lambrechts, Luc Haspeslagh
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Publication number: 20210111021Abstract: The present invent provides a method comprising forming a first wafer comprising a first substrate of a group IV semiconductor, and a group III-V semiconductor device structure formed by selective area epitaxial growth on a surface portion of a front side of the first substrate. The method further comprises forming a second wafer comprising a second substrate of a group IV semiconductor, and a group IV semiconductor device structure formed on a front side of the second substrate, and bonding the first wafer to the second wafer with the front side of the first substrate facing the front side of the second wafer.Type: ApplicationFiled: October 12, 2020Publication date: April 15, 2021Inventors: Philippe SOUSSAN, Vasyl MOTSNYI, Luc HASPESLAGH, Stefano GUERRIERI, Olga SYSHCHYK, Bernardette KUNERT, Robert LANGER
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Publication number: 20200278252Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: ApplicationFiled: March 10, 2020Publication date: September 3, 2020Inventors: Nicolaas Tack, Andy Lambrechts, Luc Haspeslagh
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Patent number: 10620049Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: GrantFiled: March 20, 2019Date of Patent: April 14, 2020Assignee: IMECInventors: Nicolaas Tack, Andy Lambrechts, Luc Haspeslagh
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Publication number: 20190285474Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: ApplicationFiled: March 20, 2019Publication date: September 19, 2019Inventors: Nicolaas Tack, Andy Lambrechts, Luc Haspeslagh
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Patent number: 10260945Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: GrantFiled: March 3, 2016Date of Patent: April 16, 2019Assignee: IMECInventors: Nicolaas Tack, Andy Lambrechts, Luc Haspeslagh
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Patent number: 10139280Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: GrantFiled: March 3, 2016Date of Patent: November 27, 2018Assignee: IMECInventors: Nicolaas Tack, Andy Lambrechts, Luc Haspeslagh
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Publication number: 20160252395Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: ApplicationFiled: March 3, 2016Publication date: September 1, 2016Inventors: Klaas Tack, Andy Lambrechts, Luc Haspeslagh
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Publication number: 20160252396Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: ApplicationFiled: March 3, 2016Publication date: September 1, 2016Inventors: Klaas Tack, Andy Lambrechts, Luc Haspeslagh
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Patent number: 9304039Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: GrantFiled: May 29, 2012Date of Patent: April 5, 2016Assignee: IMECInventors: Klaas Tack, Andy Lambrechts, Luc Haspeslagh
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Patent number: 8643937Abstract: A DND device is disclosed. In one aspect, the device includes a nano-mirror (21), and an actuating module configured to move the nano-mirror in an upward and/or downward position. The actuating module has a cantilever mounted to a fixed structure, and at least one first electrode for moving the cantilever in an upward and/or downward position. Such DND devices may be arranged in a 2D array.Type: GrantFiled: November 15, 2011Date of Patent: February 4, 2014Assignee: IMECInventors: Luc Haspeslagh, Xavier Rottenberg, Veronique Rochus
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Patent number: 8536662Abstract: A method is disclosed for manufacturing a semiconductor device, including providing a substrate comprising a main surface with a non flat topography, the surface comprising at least one substantial topography variation, forming a first capping layer over the main surface such that, during formation of the first capping layer, local defects in the first capping layer are introduced, the local defects being positioned at locations corresponding to the substantial topography variations and the local defects being suitable for allowing a predetermined fluid to pass through. Associated membrane layers, capping layers, and microelectronic devices are also disclosed.Type: GrantFiled: November 29, 2010Date of Patent: September 17, 2013Assignees: IMEC, Katholieke Universiteit Leuven, K.U. Leuven R&DInventors: Ann Witvrouw, Luc Haspeslagh, Bin Guo, Simone Severi, Gert Claes
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Publication number: 20120327248Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.Type: ApplicationFiled: May 29, 2012Publication date: December 27, 2012Applicant: IMECInventors: Klaas TACK, Andy Lambrechts, Luc Haspeslagh
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Publication number: 20120127558Abstract: A DND device is disclosed. In one aspect, the device includes a nano-mirror (21), and an actuating module configured to move the nano-mirror in an upward and/or downward position. The actuating module has a cantilever mounted to a fixed structure, and at least one first electrode for moving the cantilever in an upward and/or downward position. Such DND devices may be arranged in a 2D array.Type: ApplicationFiled: November 15, 2011Publication date: May 24, 2012Applicant: IMECInventors: Luc HASPESLAGH, Xavier ROTTENBERG, Veronique ROCHUS
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Publication number: 20120013020Abstract: A MEMS device is disclosed comprising a cavity containing a MEMS component, the cavity being formed in a dielectric layer stack having a thickness td, whereby the cavity and the dielectric layer stack are sandwiched between a substrate and a sealing dielectric layer having a thickness ts, and whereby the MEMS component is enclosed by at least one trench extending over the thickness td of the dielectric layer stack and of the sealing dielectric ts.Type: ApplicationFiled: July 13, 2011Publication date: January 19, 2012Applicant: IMECInventors: Bin Guo, Luc Haspeslagh
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Publication number: 20110163399Abstract: A method is disclosed for manufacturing a sealed cavity in a microelectronic device, comprising forming a sacrificial layer at least at locations where the cavity is to be provided, depositing a membrane layer over the top of the sacrificial layer, patterning the membrane layer in at least two separate membrane layer blocks, removing the sacrificial layer through the membrane layer, and sealing the cavity by sealing the membrane layer, wherein patterning the membrane layer is performed after removal of the sacrificial layer.Type: ApplicationFiled: November 29, 2010Publication date: July 7, 2011Applicant: IMECInventors: Ann Witvrouw, Luc Haspeslagh, Gert Claes