Abstract: A non-volatile storage system connects a signal driver to a first control line that is connected to a first non-volatile storage element, charges the first control line using the signal driver while the signal driver is connected to the first control line, disconnects the signal driver from the first control line while the first control line remains charged from the signal driver, connects the signal driver to a second control line that is connected to a second non-volatile storage element, charges the second control line using the signal driver while the signal driver is connected to the second control line, and disconnects the signal driver from the second control line. Charging the control lines causes the respective non-volatile storage elements to experience a program operation.

Abstract: A storage system includes a three-dimensional memory array that has multiple layers of non-volatile storage elements grouped into blocks. The blocks are grouped into bays. The storage system includes array lines of a first type in communication with storage elements, array lines of a second type in communication with storage elements, and sense amplifiers. Each block is geographically associated with two sense amplifiers and all blocks of a particular bay share a group of sense amplifiers associated with the blocks of the particular bay. The system includes multiple sets of local data lines in one or more routing metal layers below the three-dimensional memory array and multiple sets of global data lines in one or more top metal layers above the three-dimensional memory array. Each set of one or more blocks include one set of the local data lines. Each bay includes one set of global data lines that connect to the group of sense amplifiers associated with the blocks of the respective bay.

Abstract: A cross point memory cell includes a portion of a first distributed diode, a portion of a second distributed diode, a memory layer located between the portion of the first distributed diode and the portion of a second distributed diode, a bit line electrically connected to the first distributed diode, and a word line electrically connected to the second distributed diode.

Abstract: A three-dimensional flash memory array incorporates thin film transistors having a charge storage dielectric arranged in series-connected NAND strings to achieve a 4F2 memory cell layout. The memory array may be programmed and erased using only tunneling currents, and no leakage paths are formed through non-selected memory cells. Each NAND string includes two block select devices for respectively coupling one end of the NAND string to a global bit line, and the other end to a shared bias node. Pairs of NAND strings within a block share the same global bit line. The memory cells are preferably depletion mode SONOS devices, as are the block select devices. The memory cells may be programmed to a near depletion threshold voltage, and the block select devices are maintained in a programmed state having a near depletion mode threshold voltage. NAND strings on more than one layer may be connected to global bit lines on a single layer.

Abstract: A memory array comprising array lines of first and second types coupled to memory cells includes a first hierarchical decoder circuit for decoding address information and selecting one or more array lines of the first type. The first hierarchical decoder circuit includes at least two hierarchical levels of multi-headed decoder circuits. The first hierarchical decoder circuit may include a first-level decoder circuit for decoding a plurality of address signal inputs and generating a plurality of first-level decoded outputs, a plurality of second-level multi-headed decoder circuits, each respective one coupled to a respective first-level decoded output, each for providing a respective plurality of second-level decoded outputs, and a plurality of third-level multi-headed decoder circuits, each respective one coupled to a respective second-level decoded output, each for providing a respective plurality of third-level decoded outputs coupled to the memory array.

Abstract: A three-dimensional (3D) high density memory array includes multiple layers of segmented bit lines (i.e., sense lines) with segment switch devices within the memory array that connect the segments to global bit lines. The segment switch devices reside on one or more layers of the integrated circuit, preferably residing on each bit line layer. The global bit lines reside preferably on one layer below the memory array, but may reside on more than one layer. The bit line segments preferably share vertical connections to an associated global bit line. In certain EEPROM embodiments, the array includes multiple layers of segmented bit lines with segment connection switches on multiple layers and shared vertical connections to a global bit line layer. Such memory arrays may be realized with much less write-disturb effects for half selected memory cells, and may be realized with a much smaller block of cells to be erased.

Abstract: An exemplary NAND string memory array provides for capacitive boosting of a half-selected memory cell channel to reduce program disturb effects of the half selected cell. To reduce the effect of leakage current degradation of the boosted level, multiple programming pulses of a shorter duration are employed to limit the time period during which such leakage currents may degrade the voltage within the unselected NAND strings. In addition, multiple series select devices at one or both ends of each NAND string further ensure reduced leakage through such select devices, for both unselected and selected NAND strings. In certain exemplary embodiments, a memory array includes series-connected NAND strings of memory cell transistors having a charge storage dielectric, and includes more than one plane of memory cells formed above a substrate.

Abstract: An exemplary NAND string memory array includes at least one plane of memory cells, said memory cells comprising thin film modifiable conductance switch devices and which cells are arranged in a plurality of series-connected NAND strings, said NAND strings including a series select device at each end thereof. Another exemplary NAND string memory array includes a group of more than four adjacent NAND strings within the same memory block each associated with a respective global bit line not shared by the other NAND string of the group. Another exemplary NAND string memory array includes NAND strings on identical pitch as their respective global bit lines.

Abstract: A three-dimensional (3D) high density memory array includes multiple layers of segmented bit lines (i.e., sense lines) with segment switch devices within the memory array that connect the segments to global bit lines. The segment switch devices reside on one or more layers of the integrated circuit, preferably residing on each bit line layer. The global bit lines reside preferably on one layer below the memory array, but may reside on more than one layer. The bit line segments preferably share vertical connections to an associated global bit line. In certain EEPROM embodiments, the array includes multiple layers of segmented bit lines with segment connection switches on multiple layers and shared vertical connections to a global bit line layer. Such memory arrays may be realized with much less write-disturb effects for half selected memory cells, and may be realized with a much smaller block of cells to be erased.

Abstract: Extremely dense memory cell structures provide for new array structures useful for implementing memory and logic functions. An exemplary non-volatile memory array includes a first plurality of X-lines configured to be logically identical in a read mode of operation, and each associated with a first Y-line group numbering at least one Y-line. Each of the first plurality of X-lines may also be associated with a second Y-line group numbering at least one Y-line. In some embodiments, the first and second Y-Line groups are simultaneously selectable in a read mode and, when so selected, are respectively coupled to true and complement inputs of a sense amplifier circuit. Such Y-line groups may number only one Y-line, or may number more than one Y-line. Many types of memory cells may be used, such as various passive element cells and EEPROM cells, in both 2D or 3D memory arrays.

Abstract: An array of transistors includes a plurality of transistors, a plurality of word lines extending in a first direction and a plurality of bit lines extending in a second direction. Each transistor includes a source, a drain, a channel and a localized charge storage dielectric. A first transistor of the plurality of transistors and a second transistor of the plurality of transistors share a common source/drain. A first localized charge storage dielectric of the first transistor does not overlap the common source/drain and a second localized charge storage dielectric of the second transistor overlaps the common source/drain.

Abstract: A decoding circuit for non-binary groups of memory line drivers is disclosed. In one embodiment, an integrated circuit is disclosed comprising a binary decoder and circuitry operative to perform a non-binary arithmetic operation, wherein a result of the non-binary arithmetic operation is provided as input to the binary decoder. In another embodiment, an integrated circuit is disclosed comprising a memory array comprising a plurality of array lines, a non-integral-power-of-two number of array line driver circuits, and control circuitry configured to select one of the array line driver circuits. The control circuitry can comprise a binary decoder and a pre-decoder portion that performs a non-binary arithmetic operation. The concepts described herein may be used alone or in combination.

Abstract: An integrated circuit having a three-dimensional memory array provides for a given number of memory planes, but may be fabricated instead to include a lesser number of memory planes by omitting the masks and processing steps associated with the omitted memory planes, without changing any of the other fabrication masks for the other memory planes or for the remainder of the device, and without requiring routing or other configuration changes to the read or read/write path for the array. Control circuitry for selectively enabling certain layer selector circuits is configurable, and the layer selector circuits are suitably arranged, to couple a respective array line on an implemented memory layer to each respective I/O bus line irrespective of the number of implemented memory planes.

Abstract: An integrated circuit memory array includes alternating first and second types of memory blocks, each memory block including respective array lines shared with a respective array line in an adjacent memory block. The array lines of a defective block of one type are mapped into a spare block of the same type. The array lines of a first adjacent block which are shared with array lines of the defective block, and the array lines of a second adjacent block which are shared with array lines of the defective block, are mapped into a second spare block of the other type, thereby mapping the defective block and portions of both adjacent blocks into just two spare blocks.

Abstract: A memory array comprising array lines of first and second types coupled to memory cells includes a first hierarchical decoder circuit for decoding address information and selecting one or more array lines of the first type. The first hierarchical decoder circuit includes at least two hierarchical levels of multi-headed decoder circuits. The first hierarchical decoder circuit may include a first-level decoder circuit for decoding a plurality of address signal inputs and generating a plurality of first-level decoded outputs, a plurality of second-level multi-headed decoder circuits, each respective one coupled to a respective first-level decoded output, each for providing a respective plurality of second-level decoded outputs, and a plurality of third-level multi-headed decoder circuits, each respective one coupled to a respective second-level decoded output, each for providing a respective plurality of third-level decoded outputs coupled to the memory array.

Abstract: In an embodiment of the invention an integrated circuit includes a memory array having a first plurality of decoded lines traversing across the memory array and a pair of dual-mode decoders, each decoder coupled to each of the plurality of decoded lines a respective location along said decoded lines, such as at opposite ends thereof. Both decoder circuits receive like address information. Normally both decoder circuits operate in a forward decode mode to decode the address information and drive a selected one of the decoded lines. During a test mode, one decoder is enabled in a reverse decode mode while the other decoder remains in a forward decode mode to verify proper decode operation and integrity of the decoded lines between the decoders.

Abstract: A monolithic integrated circuit includes a memory array having first and second groups of NAND strings, each NAND string comprising at least two series-connected devices and coupled at one end to an associated global array line. NAND strings of the first and second groups differ in at least one physical characteristic, such as the number of series-connected devices forming the NAND string, but both groups are disposed in a region of the memory array traversed by a plurality of global array lines. The memory array may include a three-dimensional memory array having more than one memory plane. Some of the NAND strings of the first group may be disposed on one memory plane, and some of the NAND strings of the second group may be disposed on another memory plane. In some cases, NAND strings of both groups may share global array lines.

Abstract: An apparatus is disclosed comprising a plurality of word lines and word line drivers, a plurality of bit lines and bit line drivers, and a plurality of memory cells coupled between respective word lines and bit lines. The apparatus also comprises circuitry operative to select a writing and/or reading condition to apply to a memory cell based on the memory cell's location with respect to one or both of a word line driver and a bit line driver. The apparatus can also comprise circuitry that is operative to select a number of memory cells to be programmed in parallel based on memory cell location with respect to a word line and/or bit line driver.

Abstract: A programmable system device includes an embedded FLASH memory module and an embedded programmable logic device (PLD) module. A sole embedded power supply voltage generator generates a plurality of voltages for use by the FLASH memory module and the PLD module during programming, reading and erasing operations. A switching network receives at least some of the generated voltages and selectively chooses among and between the received generated voltages for application to the FLASH memory module and the PLD module depending on whether that particular module is engaged in programming, reading or erasing operations. A load adjustment circuit controls operation of the sole power supply voltage generator based on whether the generated voltages are being used by the FLASH memory module or the PLD module to account for differences in loading between the FLASH memory module and the PLD module during programming, reading and erasing operations.

Abstract: The preferred embodiments described herein relate to a method and system for temperature compensation for memory cells with temperature-dependent behavior. In one preferred embodiment, at least one of a first temperature-dependent reference voltage comprising a negative temperature coefficient and a second temperature-dependent reference voltage comprising a positive temperature coefficient is generated. One of a wordline voltage and a bitline voltage is generated from one of the at least one of the first and second temperature-dependent reference voltages. The other of the wordline and bitline voltages is generated, and the wordline and bitline voltages are applied across a memory cell. Other methods and systems are disclosed for sensing a memory cell comprising temperature-dependent behavior, and each of the preferred embodiments can be used alone or in combination with one another.