Abstract: Example implementations relate to recessed keycaps. In an example, a recessed keycap includes a keyboard frame including recesses that extend at least partially through respective internal faces of the keyboard frame and a keycap including protrusions, where each protrusion of the protrusions is disposed at least partially within and in contact with a respective recess of the recesses to movably couple the keycap to the keyboard frame.

Abstract: Example implementations relate to recessed keycaps. In an example, a recessed keycap includes a keyboard frame including recesses that extend at least partially through respective internal faces of the keyboard frame and a keycap including protrusions, where each protrusion of the protrusions is disposed at least partially within and in contact with a respective recess of the recesses to movably couple the keycap to the keyboard frame.

Abstract: Example implementations relate to thermally fused spacers. In one example, keyboard membranes including thermally fused spacers include a first circuit including a first conductive trace and a first key contact of the keyboard membrane, where the first conductive trace is coupled to the first key contact, a second circuit including a second conductive trace and a second key contact of the keyboard membrane, where the second conductive trace is coupled to the second key contact, and wherein the second key contact is to couple to the first key contact, and a spacer formed of a layer of thermoplastic material, a first thermoplastic film, and a second thermoplastic film, where the spacer is fused via the first thermoplastic film to the first circuit and via the second thermoplastic film to the second circuit.

Abstract: Example implementations relate to thermally fused spacers. In one example, keyboard membranes including thermally fused spacers include a first circuit including a first conductive trace and a first key contact of the keyboard membrane, where the first conductive trace is coupled to the first key contact, a second circuit including a second conductive trace and a second key contact of the keyboard membrane, where the second conductive trace is coupled to the second key contact, and wherein the second key contact is to couple to the first key contact, and a spacer formed of a layer of thermoplastic material, a first thermoplastic film, and a second thermoplastic film, where the spacer is fused via the first thermoplastic film to the first circuit and via the second thermoplastic film to the second circuit.

Abstract: Example embodiments disclosed herein relate to a key including a primary dome, a plurality of second domes, and a first layer. The primary dome is to compress a switch if the primary dome collapses. The first layer is over the primary and secondary domes. The first layer collapses the primary dome and does not engage the secondary domes, if the first layer is pressed substantially levelly or parallel to the rest position.

Abstract: Interface systems and methods are provided. An interface system can include a first isolator (200) and a second isolator (300) coupled to a modular interface (110). The interface can include a plurality of conductors (120). The first isolator can be coupled to a first signal format compliant first input/output (I/O) device (130). The second isolator can be coupled to a second signal format compliant second I/O device (140). The first isolator can pass a first signal format compliant signal to, and suppress the reflection of at least a portion of a second signal format compliant signal from, the first I/O device. The second isolator can at least partially block a first signal format compliant signal from, and to pass a second signal format compliant signal to, the second I/O device.

Abstract: Example embodiments disclosed herein relate to a key including a primary dome, a plurality of second domes, and a first layer. The primary dome is to compress a switch if the primary dome collapses. The first layer is over the primary and secondary domes. The first layer collapses the primary dome and does not engage the secondary domes, if the first layer is pressed substantially levelly or parallel to the rest position.

Abstract: Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component.

Abstract: Interface systems and methods are provided. An interface system can include a first isolator (200) and a second isolator (300) coupled to a modular interface (110). The interface can include a plurality of conductors (120). The first isolator can be coupled to a first signal format compliant first input/output (I/O) device (130). The second isolator can be coupled to a second signal format compliant second I/O device (140). The first isolator can pass a first signal format compliant signal to, and suppress the reflection of at least a portion of a second signal format compliant signal from, the first I/O device. The second isolator can at least partially block a first signal format compliant signal from, and to pass a second signal format compliant signal to, the second I/O device.

Abstract: A vibration attenuation method comprising identifying a hard drive disposed on an electronic device and, based on the identity of the hard drive, attenuating an output of at least one operation of the electronic device.

Abstract: In one embodiment, an electrical connector adapted to receive a component module includes a body that defines a socket into which the module can be inserted, and an obstruction element adapted to physically interfere with the module when it is attempted to seat the module within the connector with the module only partially inserted into the socket.

Abstract: Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component.

Abstract: In one embodiment, an electrical connector adapted to receive a component module includes a body that defines a socket into which the module can be inserted, and an obstruction element adapted to physically interfere with the module when it is attempted to seat the module within the connector with the module only partially inserted into the socket.

Abstract: A vibration attenuation method comprising identifying a hard drive disposed on an electronic device and, based on the identity of the hard drive, attenuating an output of at least one operation of the electronic device.

Abstract: An end of a flexible ribbon cable is clamped to a side of a printed circuit board, and operatively coupled to electrically conductive surface traces thereon in a parallel relationship with the circuit board, using a molded plastic snap connector that carries an elastomeric member which resiliently bears against the cable end and presses it against the circuit board side. The connector member is provided with alignment pins which extend through corresponding holes in the cable end and the circuit board and function to precisely and automatically align the cable and board traces being operatively coupled, and snap tab portion which extend through holes in the cable end and circuit board and resiliently clip onto the board to maintain the elastomeric member in compression against the cable end portion. The alignment pins and the snap tab portions may alternatively be formed on a wall portion of a computer housing in which the printed circuit board is operatively disposed.