Apparatuses and methods for dissipating heat from a computer component
Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component.
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Application Ser. No. 12/867,849 is a national stage entry of PCT/US2008/058986 filed Apr. 1, 2008. Various components provided within computers generate heat. For instance, chip-based components, such as processors, that are mounted on motherboards of such computers generate substantial amounts of heat. Normally, such heat must be dissipated to avoid failure of the heat-generating components.
Often times heat sinks, such as thermal dies, are placed in contact with the heat-generating components to draw the heat energy from the components. The level of heat transfer from the heat-generating component to the heat sink that can be attained depends at least in part on the level of contact between the component and the heat sink. Specifically, if the heat sink unevenly contacts the heat-generating component, heat transfer is impaired. Unfortunately, that is the case with many current designs in which the heat sink is urged into contact with the heat-generating component. In several such designs, a spring is provided at each corner of the heat sink. When the springs are not identical, for example due to manufacturing tolerance, an uneven pressure distribution may result.
The disclosed apparatuses and methods can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale.
As described above, existing heat dissipation apparatuses that comprise multiple springs to urge a heat sink into contact with a heat-generating component may not apply even pressure to the heat sink and therefore may not achieve a desired level of heat transfer from the component to the heat sink. As described in the following, however, more even pressure distribution can be attainted when a single spring is used to urge the heat sink and the heat-generating component into contact with each other. In some embodiments, a heat dissipation apparatus includes first and second brackets are provided on opposite sides of a circuit board on which the heat-generating component is mounted. One of the brackets includes a single spring that contacts the circuit board (directly or indirectly) on a side opposite to the heat-generating component so as to pull a heat sink associated with the other bracket into contact with the component. Because only a single spring is used, the heat sink contacts the heat-generating component more evenly, thereby resulting in a desired level of heat transfer.
Referring now in more detail to the drawings in which like numerals indicate corresponding parts throughout the views,
As indicated in
With reference to
In the illustrated embodiment, the top bracket 200 includes a central body 210 from which extend multiple arms 212. As indicated in
With further reference to
Turning to aspects of the heat dissipation apparatus 126 provided on the other side of the circuit board 120, the force distribution member 204 comprises a planar member, such as a flat plate, that is positioned between the circuit board and the bottom bracket 206. In some embodiments, the force distribution member 204 is bonded to the bottom surface of the circuit board 120 (i.e., the surface opposite the mounting surface 122). The bottom bracket 206 is generally similar in form to the top bracket 200 and therefore includes a central body 224 having corners from which multiple arms 226 extend. Provided at the end of each arm 226 is a fastener receiving member 228 that include a threaded opening 230 into which the fasteners 218 can thread after passing through the passages 216 of the fastener receiving members 214 of the top bracket 200. The fastener receiving members 228 of the bottom bracket 206 can also be formed as cylindrical members. Regardless, the fastener receiving members 228 of the bottom bracket 206 are sized and configured so as to fit within the passages 216 of the fastener receiving members 214 of the top bracket 200.
With further reference to
As described above, the heat dissipation apparatus 126 can freely move up and down relative to the circuit board 124 given that the fastener receiving members 214 of the top bracket 200 do not contact the openings 215 provided in the circuit board 120. Therefore, the heat dissipation apparatus 126 can freely pivot relative to the single pivot point 302, which coincides with the center of the heat-generating device 124. That pivoting capability enables the top bracket 200 to reach an equilibrium at which the force provided by the spring 232 is evenly distributed across the surface area of the heat-generating component 124.
Referring next to
It is noted that various modifications of the disclosed apparatus are possible. For example, although first and second brackets have been described, the brackets could instead comprise a single integrated bracket, in which case the first and second brackets would be first and second portions of the same bracket.
Claims
1. Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board, the heat dissipation apparatus comprising:
- a thermally-conductive heat sink to contact the heat-generating component;
- a bracket having a first portion provided on a first side of the circuit board and a second portion provided on a second side of the circuit board, the first portion of the bracket to hold the thermally-conductive heat sink in place relative to the heat-generating component;
- a spring mounted to the second portion of the bracket to urge the second portion of the bracket away from the circuit board so as to draw the first portion of the bracket toward the circuit board to urge the heat sink into contact with the heat-generating component; and
- a force distribution member disposed between the spring and the circuit board, wherein the force distribution member comprises a flat plate that is bonded to the circuit board.
2. The apparatus of claim 1, wherein the first bracket portion comprises an independent first bracket and the second bracket portion comprises an independent second bracket and wherein the first and second brackets are secured to each other.
3. The apparatus of claim 1, wherein the first bracket portion comprises a body and a plurality of arms that extend from the body.
4. The apparatus of claim 3, wherein the first bracket portion further comprises fastener receiving members provided at the ends of the arms.
5. The apparatus of claim 1, wherein the second bracket portion comprises a body and a plurality of arms that extend from the body.
6. The apparatus of claim 5, wherein the second bracket portion further comprises fastener receiving members provided at the ends of the arms.
7. The apparatus of claim 1, wherein the heat sink comprises a heat pipe.
8. The apparatus of claim 1, wherein the heat sink comprises an integral part of the first bracket portion.
9. The apparatus of claim 1, wherein the spring comprises a coil spring.
10. The apparatus of claim 1, wherein the spring is positioned in the center of the second bracket portion.
11. The apparatus of claim 1, wherein the spring is positioned on the bracket so as to align with the heat-generating component.
12. The apparatus of claim 1, wherein the apparatus comprises no other springs that urge the heat sink into contact with the heat-generating component.
13. Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a mounting surface provided on a first side of a circuit board, the heat dissipation apparatus comprising:
- a thermally-conductive heat sink to contact the heat-generating component;
- a first bracket to couple to the first side of the circuit board, the first bracket to hold the heat sink in place relative to the heat-generating component, wherein the thermally-conductive heat sink is integral with the first bracket;
- a second bracket to couple to a second side of the circuit board opposite to the first side, the second bracket comprising a body; and
- a spring mounted in a central position on the body of the second bracket act the circuit board at pivot point aligned with a center of the heat-generating component, wherein the spring is to urge the second bracket away from the circuit board to draw the first bracket toward the circuit board to urge the heat sink into contact with the heart-generating component.
14. The apparatus of claim 13, wherein the heat sink comprises a heat pipe.
15. The apparatus of claim 13, wherein the spring comprises a coil spring.
16. The apparatus of claim 13, wherein the circuit board comprises a force distribution member bonded to the circuit board that the spring is to contact.
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Type: Grant
Filed: Apr 1, 2008
Date of Patent: Aug 27, 2013
Patent Publication Number: 20110110031
Assignee: Hewlett-Packard Development Company, L.P. (Houston, TX)
Inventors: Steven S. Homer (Tomball, TX), Dustin L. Hoffman (Cypress, TX), Jeffrey A. Lev (Tomball, TX), Mark S. Tracy (Tomball, TX), Luis C. Armendariz (Spring, TX), Mark H. Ruch (The Woodlands, TX)
Primary Examiner: Courtney Smith
Application Number: 12/867,849
International Classification: H05K 7/20 (20060101);