Patents by Inventor Luis Rosales
Luis Rosales has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11953161Abstract: A system for monitoring pipeline leaks including a data acquisition unit configured to receive measurement data from a plurality of pipeline instruments, the measurement data corresponding to operation of a pipeline, at least one leak detection engine configured to receive at least a portion of the measurement data and generate at least one pipeline leak parameter, a process analyzer configured to receive at least a portion of the measurement data and determine a state of operation of the pipeline, and an orchestrator configured to determine whether a pipeline leak has occurred based on the pipeline leak parameters and the state of operation of the pipeline.Type: GrantFiled: April 18, 2023Date of Patent: April 9, 2024Assignee: Intelcon System C.A.Inventors: Andres Emilio Rosales Chinchilla, Carlos Rivero, Jesus Varajas, Jose Luis Buceta, Domingo Rafael Vargas, Adolfo Anibal Torres Camperos
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Patent number: 11744045Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.Type: GrantFiled: November 10, 2021Date of Patent: August 29, 2023Assignee: QUALCOMM INCORPORATEDInventors: Hung-Wen Lin, Sin-Shong Wang, Jen-Chun Chang, Qiang Du, Jorge Luis Rosales, Ajit Kumar Vallabhaneni
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Publication number: 20230145773Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.Type: ApplicationFiled: November 10, 2021Publication date: May 11, 2023Inventors: Hung-Wen LIN, Sin-Shong WANG, Jen-Chun CHANG, Qiang DU, Jorge Luis ROSALES, Ajit Kumar VALLABHANENI
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Patent number: 11616185Abstract: A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.Type: GrantFiled: June 1, 2017Date of Patent: March 28, 2023Assignee: QUALCOMM INCORPORATEDInventors: Jorge Luis Rosales, Victor Adrian Chiriac, Mario Francisco Velez, Peng Wang
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Patent number: 11437328Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.Type: GrantFiled: May 14, 2020Date of Patent: September 6, 2022Assignee: QUALCOMM IncorporatedInventors: Peng Wang, Le Gao, Jorge Luis Rosales, Don Le
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Patent number: 11209215Abstract: Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.Type: GrantFiled: July 27, 2018Date of Patent: December 28, 2021Assignee: QUALCOMM IncorporatedInventors: Victor Adrian Chiriac, Jorge Luis Rosales
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Patent number: 11181323Abstract: An example heat-dissipating device with enhanced interfacial properties generally includes a first heat spreader configured to be thermally coupled to a region configured to generate heat, a second heat spreader, an interposer thermally coupled to at least one of the first heat spreader or the second heat spreader, at least one interfacial layer including a graphene material disposed on at least one surface of the interposer, and a phase change material disposed between the at least one interfacial layer and at least one of the first heat spreader or the second heat spreader and thermally coupled to at least one of the first heat spreader or the second heat spreader.Type: GrantFiled: February 21, 2019Date of Patent: November 23, 2021Assignee: QUALCOMM IncorporatedInventors: Sean Charles Andrews, Jorge Luis Rosales, Victor Adrian Chiriac
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Publication number: 20200365522Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.Type: ApplicationFiled: May 14, 2020Publication date: November 19, 2020Inventors: Peng WANG, Le GAO, Jorge Luis ROSALES, Don LE
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Publication number: 20200271388Abstract: Certain aspects of the present disclosure provide a heat-dissipating device with enhanced interfacial properties. One example heat-dissipating device generally includes a first heat spreader configured to be thermally coupled to a region configured to generate heat, a second heat spreader, an interposer thermally coupled to at least one of the first heat spreader or the second heat spreader, at least one interfacial layer comprising a graphene material disposed on at least one surface of the interposer, and a phase change material disposed between the at least one interfacial layer and at least one of the first heat spreader or the second heat spreader and thermally coupled to at least one of the first heat spreader or the second heat spreader.Type: ApplicationFiled: February 21, 2019Publication date: August 27, 2020Inventors: Sean Charles ANDREWS, Jorge Luis ROSALES, Victor Adrian CHIRIAC
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Patent number: 10746474Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.Type: GrantFiled: April 29, 2019Date of Patent: August 18, 2020Assignee: QUALCOMM IncorporatedInventors: Jorge Luis Rosales, Le Gao, Don Le, Jon James Anderson
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Publication number: 20200083155Abstract: Apparatuses, systems and methods associated with electrical routing layout of printed circuit boards and integrated circuit substrates are disclosed herein. In embodiments, an apparatus includes a first electrically conductive path that extends through a region, wherein the first electrically conductive path includes a first pad located at a surface of the region, a first via that extends through the region, and a first trace that extends in a first direction. The apparatus further includes a second electrically conductive path that extends through the region, wherein the second electrically conductive path includes a second pad located at the surface and adjacent to the first pad, a second via that extends through the region, and a second trace that extends in a second direction. Other embodiments may be described and/or claimed.Type: ApplicationFiled: September 11, 2018Publication date: March 12, 2020Inventors: Raul ENRIQUEZ SHIBAYAMA, Vijaya BODDU, Luis Nathan PEREZ ACOSTA, Francisco Javier GALARZA MEDINA, Kai XIAO, Luis ROSALES-GALVAN, Beom-Taek LEE, Carlos Alberto LIZALDE MORENO, Gaudencio HERNANDEZ SOSA, Mo LIU
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Publication number: 20200033066Abstract: Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.Type: ApplicationFiled: July 27, 2018Publication date: January 30, 2020Inventors: Victor Adrian CHIRIAC, Jorge Luis ROSALES
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Publication number: 20190257589Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.Type: ApplicationFiled: April 29, 2019Publication date: August 22, 2019Inventors: Jorge Luis ROSALES, Le GAO, Don LE, Jon James ANDERSON
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Patent number: 10381562Abstract: Some features pertain to an apparatus that includes a first heat spreader and a second heat spreader, a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersects the second plurality of portions, and a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.Type: GrantFiled: May 17, 2018Date of Patent: August 13, 2019Assignee: QUALCOMM IncorporatedInventors: Jorge Luis Rosales, Victor Chiriac, Sean Charles Andrews
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Patent number: 10353445Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.Type: GrantFiled: April 7, 2017Date of Patent: July 16, 2019Assignee: QUALCOMM IncorporatedInventors: Victor Adrian Chiriac, Jorge Luis Rosales, Stephen Arthur Molloy, Jon James Anderson
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Publication number: 20190061970Abstract: Some features pertain to a quad-rotor or other aerial drone having a thermoelectric generator (TEG) for harvesting waste heat from a processor of the drone. The TEG is positioned, in some examples, with its inner metal electrode coating adjacent the drone processor to function as the “hot” side of the TEG. The outer metal electrode coating of the TEG forms a portion of the outer surface of the housing of the drone to function as the “cold” side of the TEG. The inner and outer metal coatings of the TEG are coupled to a battery recharger so current generated by the TEG during operation of the drone can help recharge the drone battery to extend flight time. In some examples, an outer perimeter of the TEG extends into an airflow region near the drone rotors so propeller wash serves to cool the perimeter of the TEG.Type: ApplicationFiled: August 29, 2017Publication date: February 28, 2019Inventors: Peng WANG, Jorge Luis ROSALES, Victor Adrian CHIRIAC
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Publication number: 20180351066Abstract: A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.Type: ApplicationFiled: June 1, 2017Publication date: December 6, 2018Inventors: Jorge Luis Rosales, Victor Adrian Chiriac, Mario Francisco Velez, Peng Wang
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Publication number: 20170293329Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.Type: ApplicationFiled: April 7, 2017Publication date: October 12, 2017Inventors: Victor Adrian Chiriac, Jorge Luis Rosales, Stephen Arthur Molloy, Jon James Anderson
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Patent number: D736830Type: GrantFiled: January 18, 2013Date of Patent: August 18, 2015Assignee: ZIH Corp.Inventors: Roy Lyman, Dave Beck, Chrissy Holden, Michael Prince, Luis Rosales, Jorge Tomas, Emily Beck
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Patent number: D856228Type: GrantFiled: September 21, 2017Date of Patent: August 13, 2019Inventors: Kevin Dunn, Jose Luis Rosales