Patents by Inventor Lutz Hoppel
Lutz Hoppel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11404402Abstract: A component assembly includes an intermediate carrier, a plurality of components and a plurality of anchoring elements. The components have at least two electrical devices and an insulating layer. At least one of the electrical devices is an optoelectronic semiconductor chip. The insulating layer is between the electrical devices of a same component. The at least two electrical devices of the same component are arranged next to one another and enclosed laterally by the insulating layer. The at least two electrical devices and the insulating layer of the same component are integral parts of a self-supporting and mechanically stable unit. The self-supporting and mechanically stable unit and the anchoring elements fix the positions of the components on the intermediate carrier. The components that are self-supporting and mechanically stable units are detachable from the intermediate carrier, and the anchoring elements release the components under mechanical load when the latter are removed.Type: GrantFiled: November 6, 2018Date of Patent: August 2, 2022Assignee: OSRAM OLED GmbHInventors: Tilman Rügheimer, Thomas Schwarz, Lutz Höppel, Andreas Plößl, Alexander F. Pfeuffer
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Publication number: 20220238773Abstract: In an embodiment a method for producing a component having a carrier and at least one component part electrically conductively connected to the carrier and mechanically fixed to the carrier by an electrically insulating bonding layer includes providing the carrier having a connection layer, wherein the bonding layer is disposed on the carrier and has at least one opening, wherein a connection surface of the connection layer is exposed, and wherein the bonding layer projects vertically beyond the exposed connection surface or vice versa, applying the component part having a contact layer on the carrier in such that, in top view of the carrier, an exposed contact surface of the contact layer covers the opening and the connection surface located therein, wherein the exposed contact surface is spaced apart from the exposed connection surface by a vertical distance and reducing the vertical distance by changing a volume of the bonding layer such that the exposed contact surface and the exposed connection surface aType: ApplicationFiled: May 6, 2020Publication date: July 28, 2022Inventors: Alexander F. Pfeuffer, Tobias Berthold, Lutz Höppel, Tobias Meyer, Korbinian Perzlmaier
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Patent number: 11251081Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.Type: GrantFiled: October 25, 2018Date of Patent: February 15, 2022Assignee: OSRAM OLED GMBHInventors: Thomas Schwarz, Lutz Höppel, Thorsten Frank Baumheinrich, Jens Richter
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Patent number: 11088297Abstract: A method for producing a component and a component are disclosed. In an embodiment a method includes providing a substrate, applying a composite of components to the substrate, forming an anchoring layer on the composite of components, attaching a carrier to the anchoring layer, wherein the anchoring layer is disposed between the substrate and the carrier and removing the substrate, wherein the composite of components is divided into a plurality of components by forming a plurality of separating trenches, wherein, after removing the substrate, the components continue to be held on the carrier by the anchoring layer, and wherein the anchoring layer comprises at least one predetermined breaking layer having at least one predetermined breaking position, the predetermined breaking position being laterally surrounded by the separating trenches and—in a plan view of the carrier—being covered by one of the components.Type: GrantFiled: March 20, 2018Date of Patent: August 10, 2021Assignee: OSRAM OLED GMBHInventor: Lutz Höppel
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Publication number: 20210183834Abstract: A component assembly includes an intermediate carrier, a plurality of components and a plurality of anchoring elements. The components have at least two electrical devices and an insulating layer. At least one of the electrical devices is an optoelectronic semiconductor chip. The insulating layer is between the electrical devices of a same component. The at least two electrical devices of the same component are arranged next to one another and enclosed laterally by the insulating layer. The at least two electrical devices and the insulating layer of the same component are integral parts of a self-supporting and mechanically stable unit. The self-supporting and mechanically stable unit and the anchoring elements fix the positions of the components on the intermediate carrier. The components that are self-supporting and mechanically stable units are detachable from the intermediate carrier, and the anchoring elements release the components under mechanical load when the latter are removed.Type: ApplicationFiled: November 6, 2018Publication date: June 17, 2021Inventors: Tilman RÜGHEIMER, Thomas SCHWARZ, Lutz HÖPPEL, Andreas PLÖßL, Alexander F. PFEUFFER
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Patent number: 10985292Abstract: A method for transferring semiconductor bodies and a semiconductor chip are disclosed.Type: GrantFiled: March 6, 2018Date of Patent: April 20, 2021Assignee: OSRAM OLED GMBHInventor: Lutz Höppel
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Publication number: 20200350207Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.Type: ApplicationFiled: October 25, 2018Publication date: November 5, 2020Inventors: Thomas Schwarz, Lutz Höppel, Thorsten Frank Baumheinrich, Jens Richter
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Patent number: 10784408Abstract: An optoelectronic semiconductor chip includes a semiconductor body including a first semiconductor region, a second semiconductor region and an active zone disposed between the first and second semiconductor regions, an electrically conductive contact layer arranged on a side of the first semiconductor region facing away from the second semiconductor region, and an electrically conductive mirror layer arranged between the first semiconductor region and the electrically conductive contact layer, and laterally protruding at the edge by the first semiconductor region and the electrically conductive contact layer so that between the first semiconductor region and the electrically conductive contact layer there is an interspace in which a protective layer is arranged for protecting the mirror layer, wherein the electrically conductive contact layer extends laterally to an edge of the first semiconductor region, and the electrically conductive contact layer consists of Ni.Type: GrantFiled: April 10, 2017Date of Patent: September 22, 2020Assignee: OSRAM OLED GmbHInventor: Lutz Höppel
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Patent number: 10665758Abstract: A component having a metal carrier and a method for producing a component are disclosed. In an embodiment the component includes a carrier having a metallic carrier layer, an insulating layer and a first through-contact extending in a vertical direction throughout the carrier layer, wherein the through-contact is electrically isolated from the carrier layer via the insulating layer. The component further includes a semiconductor body and a wiring structure arranged in the vertical direction between the carrier and the semiconductor body at least places and electrically contacting the semiconductor body, wherein the wiring structure has a first connection area and a second connection area, wherein the connection areas adjoin the carrier and are assigned to different electrical polarities of the component, wherein the first through-contact is in electrical contact with one of the connection areas, and wherein the component is configured to be externally electrically connectable via the carrier.Type: GrantFiled: July 14, 2016Date of Patent: May 26, 2020Assignee: OSRAM OLED GmbHInventors: Christian Leirer, Thomas Schwarz, Lutz Höppel
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Patent number: 10586788Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact; and embedding the first pin, the second pin, and the protection diode in a molded body.Type: GrantFiled: April 11, 2017Date of Patent: March 10, 2020Assignee: OSRAM OLED GmbHInventors: Jürgen Moosburger, Lutz Höppel, Norwin von Malm
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Patent number: 10573787Abstract: A light-emitting semiconductor chip and a method for producing a light-emitting semiconductor chip are disclosed. In an embodiment a light-emitting chip includes a semiconductor body having an active region designed to generate light, a dielectric mirror including an electrically insulating material and a first metallic mirror including an electrically conductive material, wherein the semiconductor body expands towards a light exit side, wherein the dielectric mirror is arranged on a side of the semiconductor body facing away from the light exit side, wherein the first metallic mirror is arranged on a side of the dielectric mirror facing away from the semiconductor body, wherein the first metallic mirror electrically contacts the semiconductor body through at least one opening in the dielectric mirror, and wherein the dielectric mirror, apart from the at least one opening, completely covers the semiconductor body on the side facing away from the light exit side.Type: GrantFiled: March 15, 2017Date of Patent: February 25, 2020Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventor: Lutz Höppel
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Publication number: 20200035855Abstract: A method for transferring semiconductor bodies and a semiconductor chip are disclosed.Type: ApplicationFiled: March 6, 2018Publication date: January 30, 2020Inventor: Lutz Höppel
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Publication number: 20190393376Abstract: A method for producing a component and a component are disclosed. In an embodiment a method includes providing a substrate, applying a composite of components to the substrate, forming an anchoring layer on the composite of components, attaching a carrier to the anchoring layer, wherein the anchoring layer is disposed between the substrate and the carrier and removing the substrate, wherein the composite of components is divided into a plurality of components by forming a plurality of separating trenches, wherein, after removing the substrate, the components continue to be held on the carrier by the anchoring layer, and wherein the anchoring layer comprises at least one predetermined breaking layer having at least one predetermined breaking position, the predetermined breaking position being laterally surrounded by the separating trenches and—in a plan view of the carrier—being covered by one of the components.Type: ApplicationFiled: March 20, 2018Publication date: December 26, 2019Inventor: Lutz Höppel
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Patent number: 10381521Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a component includes a semiconductor layer sequence having a first semiconductor layer, an active layer, a second semiconductor layer and a top side stacked in the recited order, a first contact layer arranged at the first semiconductor layer, a mirror layer arranged on the top side and a recess in the semiconductor layer sequence which extends from the top side through the entire second semiconductor layer and the active layer, wherein the recess has a bottom surface in a region of the first semiconductor layer, wherein the mirror layer covers a portion of the recess in plan view, wherein the first contact layer is in direct electrical and mechanical contact with a contact pin, and wherein the contact pin extends from the first contact layer to the top side of the semiconductor layer sequence.Type: GrantFiled: January 9, 2017Date of Patent: August 13, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Lutz Höppel, Dominik Scholz
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Patent number: 10361345Abstract: A method of producing a plurality of optoelectronic semiconductor components includes a) preparing a composite with a semiconductor layer sequence, wherein the composite includes a plurality of component areas mechanically connected to one another; b) forming a plurality of connecting surfaces on the semiconductor layer sequence, wherein at least one connecting surface is formed on each component area; c) forming a molding compound on the semiconductor layer sequence, wherein the molding compound fills interstices between the connecting surfaces; and d) singulating the composite with the molding compound, wherein during singulation a plurality of molded bodies is formed from the molding compound, each of which is associated with a semiconductor body obtained from a component area of the composite.Type: GrantFiled: January 13, 2016Date of Patent: July 23, 2019Assignee: OSRAM Opto Semiconductors GmbHInventor: Lutz Höppel
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Patent number: 10355174Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.Type: GrantFiled: July 12, 2016Date of Patent: July 16, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Markus Maute, Lutz Höppel, Jürgen Moosburger, Thomas Schwarz, Matthias Sabathil, Ralph Wirth, Alexander Linkov, Johannes Baur
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Publication number: 20190131497Abstract: An optoelectronic semiconductor chip includes a semiconductor body including a first semiconductor region, a second semiconductor region and an active zone disposed between the first and second semiconductor regions, an electrically conductive contact layer arranged on a side of the first semiconductor region facing away from the second semiconductor region, and an electrically conductive mirror layer arranged between the first semiconductor region and the electrically conductive contact layer, and laterally protruding at the edge by the first semiconductor region and the electrically conductive contact layer so that between the first semiconductor region and the electrically conductive contact layer there is an interspace in which a protective layer is arranged for protecting the mirror layer, wherein the electrically conductive contact layer extends laterally to an edge of the first semiconductor region, and the electrically conductive contact layer consists of Ni.Type: ApplicationFiled: April 10, 2017Publication date: May 2, 2019Applicant: OSRAM Opto Semiconductors GmbHInventor: Lutz Höppel
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Patent number: 10276752Abstract: An optoelectronic semiconductor component includes a light-emitting semiconductor body having a radiation side, a current expansion layer arranged on the radiation side of the semiconductor body and at least partially covers this side, wherein the current expansion layer includes an electrically-conductive material transparent to the light radiated by the semiconductor body, and particles of a further material, and an electrical contact arranged on a side of the current expansion layer facing away from the semiconductor body.Type: GrantFiled: July 11, 2016Date of Patent: April 30, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Johannes Baur, Jürgen Moosburger, Lutz Höppel, Markus Maute, Thomas Schwarz, Matthias Sabathil, Ralph Wirth, Alexander Linkov
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Publication number: 20190027654Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a component includes a semiconductor layer sequence having a first semiconductor layer, an active layer, a second semiconductor layer and a top side stacked in the recited order, a first contact layer arranged at the first semiconductor layer, a mirror layer arranged on the top side and a recess in the semiconductor layer sequence which extends from the top side through the entire second semiconductor layer and the active layer, wherein the recess has a bottom surface in a region of the first semiconductor layer, wherein the mirror layer covers a portion of the recess in plan view, wherein the first contact layer is in direct electrical and mechanical contact with a contact pin, and wherein the contact pin extends from the first contact layer to the top side of the semiconductor layer sequence.Type: ApplicationFiled: January 9, 2017Publication date: January 24, 2019Inventors: Lutz Höppel, Dominik Scholz
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Publication number: 20190019921Abstract: A light-emitting semiconductor chip and a method for producing a light-emitting semiconductor chip are disclosed. In an embodiment a light-emitting chip includes a semiconductor body having an active region designed to generate light, a dielectric mirror including an electrically insulating material and a first metallic mirror including an electrically conductive material, wherein the semiconductor body expands towards a light exit side, wherein the dielectric mirror is arranged on a side of the semiconductor body facing away from the light exit side, wherein the first metallic mirror is arranged on a side of the dielectric mirror facing away from the semiconductor body, wherein the first metallic mirror electrically contacts the semiconductor body through at least one opening in the dielectric mirror, and wherein the dielectric mirror, apart from the at least one opening, completely covers the semiconductor body on the side facing away from the light exit side.Type: ApplicationFiled: March 15, 2017Publication date: January 17, 2019Inventor: Lutz Höppel