Patents by Inventor Lutz Rissing

Lutz Rissing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11729916
    Abstract: A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 15, 2023
    Assignee: MD ELEKTRONIK GMBH
    Inventors: Gerd Mittermaier, Matthias Borkowski, Nikolaus Lechleitner, Johann Friesinger, Alexander Haas, Christian Stoemmer, Martin Sterkel, Lutz Rissing
  • Publication number: 20220030722
    Abstract: A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 27, 2022
    Inventors: Gerd Mittermaier, Matthias Borkowski, Nikolaus Lechleitner, Johann Friesinger, Alexander Haas, Christian Stoemmer, Martin Sterkel, Lutz Rissing
  • Patent number: 10645810
    Abstract: A sensor for measuring the position of a component that is displaceable relative to the sensor, includes a circuit board and a metal body. The circuit board includes a first region in which a detector is located, and a second region in which electronic components are located, which are electrically connected to the detector. The metal body includes a first layer having a first area as well as a second layer having a second area. The first region of the circuit board is fixed in place in the first area and the second region of the circuit board is fixed in place in the second area. The first layer and the second layer of the metal body are situated between the first region and the second region of the circuit board so that the first region is located in a first plane and the second region is located in a second plane.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: May 5, 2020
    Assignee: DR. JOHANNES HEIDENHAIN GmbH
    Inventors: Lutz Rissing, Marc Oliver Tiemann, Alexander Frank
  • Patent number: 10627262
    Abstract: A sensor unit for measuring the position of a component that is movable relative to the sensor unit includes a metal body, which has a first opening. An electronic component is arranged in the first opening such that a gap is provided between the electronic component and the metal body, the gap being filled with an electrically insulating molding compound. In addition, an electrically insulating first layer is applied on the electronic component and on the molding compound. The electronic component is electrically contacted with a circuit trace, and the circuit trace is routed through the first layer in a first section and extends on the first layer in a second section.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: April 21, 2020
    Assignee: DR. JOHANNES HEIDENHAIN GMBH
    Inventors: Lutz Rissing, Martin Sterkel
  • Patent number: 10247665
    Abstract: The invention relates to a device tier determining a concentration of a chemical substance dissolved in a liquid, which chemical substance absorbs light (10) of an absorption wavelength, wherein the device comprises: at least one flow-through chamber (2) having at least one inlet opening (4), at least one outlet opening (6), and at least one peripheral wall (24); at least one laser (8) for emitting light (10) of the absorption wavelength; and at least one detector (18) for detecting the emitted light (10); wherein the laser (8) and the detector (18) are arranged in such a way that the light (10) emitted by the laser (8) is conducted through the flow-through chamber (2) along at least two different paths before said light hits the detector (18), and wherein the device has two lasers (8) which emit light of different wavelengths. The invention further relates to a method for producing a flow-through chamber for such a device.
    Type: Grant
    Filed: January 19, 2015
    Date of Patent: April 2, 2019
    Assignee: Gottfried Wilhelm Leibniz Universitaet Hannover
    Inventors: Lutz Rissing, Stephanie Holz, Dominik Hoheisel
  • Publication number: 20180321061
    Abstract: A sensor unit for measuring the position of a component that is movable relative to the sensor unit includes a metal body, which has a first opening. An electronic component is arranged in the first opening such that a gap is provided between the electronic component and the metal body, the gap being filled with an electrically insulating molding compound. In addition, an electrically insulating first layer is applied on the electronic component and on the molding compound. The electronic component is electrically contacted with a circuit trace, and the circuit trace is routed through the first layer in a first section and extends on the first layer in a second section.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 8, 2018
    Inventors: Lutz RISSING, Martin STERKEL
  • Publication number: 20180220533
    Abstract: A sensor for measuring the position of a component that is displaceable relative to the sensor, includes a circuit board and a metal body. The circuit board includes a first region in which a detector is located, and a second region in which electronic components are located, which are electrically connected to the detector. The metal body includes a first layer having a first area as well as a second layer having a second area. The first region of the circuit board is fixed in place in the first area and the second region of the circuit board is fixed in place in the second area. The first layer and the second layer of the metal body are situated between the first region and the second region of the circuit board so that the first region is located in a first plane and the second region is located in a second plane.
    Type: Application
    Filed: December 6, 2017
    Publication date: August 2, 2018
    Inventors: Lutz Rissing, Marc Oliver Tiemann, Alexander Frank
  • Publication number: 20160334328
    Abstract: The invention relates to a device tier determining a concentration of a chemical substance dissolved in a liquid, which chemical substance absorbs light (10) of an absorption wavelength, wherein the device comprises: at least one flow-through chamber (2) having at least one inlet opening (4), at least one outlet opening (6), and at least one peripheral wall (24); at least one laser (8) for emitting light (10) of the absorption wavelength; and at least one detector (18) for detecting the emitted light (10); wherein the laser (8) and the detector (18) are arranged in such a way that the light (10) emitted by the laser (8) is conducted through the flow-through chamber (2) along at least two different paths before said light hits the detector (18), and wherein the device has two lasers (8) which emit light of different wavelengths. The invention further relates to a method for producing a flow-through chamber for such a device.
    Type: Application
    Filed: January 19, 2015
    Publication date: November 17, 2016
    Inventors: Lutz RISSING, Stephanie HOLZ, Dominik HOHEISEL
  • Patent number: 7535729
    Abstract: An optoelectronic system includes a printed circuit board having a ground pad and a bond pad as well as an optoelectronic element. The optoelectronic element is electrically connected to the bond pad via a bonding wire and is additionally fastened to the ground pad by a soldering connection. The ground pad is arranged such that one part of the space between the printed circuit board and the optoelectronic element is not filled with solder. Furthermore, a method is for manufacturing such an optoelectronic system.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: May 19, 2009
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventors: Lutz Rissing, Dietmar Siglbauer
  • Patent number: 7518157
    Abstract: Optoelectronic component assemblies include a carrier element having a recess, the recess having at least one stepped supporting surface in the region of its periphery at a defined height between the bottom of the recess and the top edge of the recess. Arranged above the optoelectronic component in the region of the recess is a transparent cover element which has a structuring in at least one partial area. The cover element rests in the region of the supporting surface and is secured in this region by a bonding material. The upper side of the cover element may project above the top edge of the recess. Different materials may be provided as an encapsulation material and a bonding material.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: April 14, 2009
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventors: Lutz Rissing, Jan Braasch
  • Patent number: 7223921
    Abstract: A composite of at least two flat elements that includes a first support substrate having a first solder pad, and a second support substrate having a second solder pad that is soldered together with the first solder pad. Strip conductor structures are applied to the first support substrate and the second support substrate and a link area that connects a solder shunting area with the first solder pad, wherein the link area is narrower than the first solder pad and the solder shunting area.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: May 29, 2007
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventors: Lutz Rissing, Peter Fischer
  • Patent number: 7157903
    Abstract: An inductive sensor includes at least two circuit boards and receiver circuit traces applied on the first circuit board. Arranged on the second circuit board are components of an evaluation electronics for evaluating signals that originate from the receiver circuit traces. The two circuit boards are joined in a sandwich-type manner and at least one component of the evaluation electronics is accommodated between the two circuit boards. A rotary encoder may be fitted with this inductive sensor.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: January 2, 2007
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventor: Lutz Rissing
  • Publication number: 20060278955
    Abstract: An optoelectronic system includes a printed circuit board having a ground pad and a bond pad as well as an optoelectronic element. The optoelectronic element is electrically connected to the bond pad via a bonding wire and is additionally fastened to the ground pad by a soldering connection. The ground pad is arranged such that one part of the space between the printed circuit board and the optoelectronic element is not filled with solder. Furthermore, a method is for manufacturing such an optoelectronic system.
    Type: Application
    Filed: May 9, 2006
    Publication date: December 14, 2006
    Inventors: Lutz Rissing, Dietmar Siglbauer
  • Patent number: 7082829
    Abstract: A Ferraris sensor for measuring an acceleration of a moving body along a direction. The sensor includes a flat eddy current body and a scanning head arranged on one side of the eddy current body. The scanning head includes N magnets that generate an external magnetic field that extends approximately perpendicular to a surface of the eddy current body, wherein N=1, 2, 3, . . . and M detector coils, wherein M=1, 2, 3, 4, . . . and each detector coil includes an axis and detects changes of an interior magnetic field within the N magnets that are caused by an acceleration of the eddy current body and a resulting change in eddy currents. The axis is approximately perpendicular with respect to the surface of the eddy current body, each detector coil lacks a ferromagnetic core and the N magnets and the M detector coils are arranged alternatingly next to each other in a direction that the acceleration is to be measured.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: August 1, 2006
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventors: Michael Schwabe, Ralph Schmidt, Lutz Rissing
  • Publication number: 20050098472
    Abstract: Optoelectronic component assemblies include a carrier element having a recess, the recess having at least one stepped supporting surface in the region of its periphery at a defined height between the bottom of the recess and the top edge of the recess. Arranged above the optoelectronic component in the region of the recess is a transparent cover element which has a structuring in at least one partial area. The cover element rests in the region of the supporting surface and is secured in this region by a bonding material. The upper side of the cover element may project above the top edge of the recess. Different materials may be provided as an encapsulation material and a bonding material.
    Type: Application
    Filed: October 12, 2004
    Publication date: May 12, 2005
    Inventors: Lutz Rissing, Jan Braasch
  • Patent number: 6861683
    Abstract: In an optoelectronic component assembly and a method for the production thereof, the optoelectronic component assembly includes an optoelectronic component arranged on a support element, which is surrounded by a closed dam. An encapsulation is arranged in an inner area of the dam, which encapsulates the optoelectronic component and includes two sealing materials. The inner area of the dam may be filled with a first sealing material up to the top edge of the optoelectronic component. The inner area of the dam located above the optoelectronic component is filled with a second transparent sealing material at least in one area of the window.
    Type: Grant
    Filed: March 30, 2002
    Date of Patent: March 1, 2005
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventors: Lutz Rissing, Florian Obermayer, Florian Schroll
  • Publication number: 20040237649
    Abstract: A Ferraris sensor for measuring an acceleration of a moving body along a direction. The sensor includes a flat eddy current body and a scanning head arranged on one side of the eddy current body. The scanning head includes N magnets that generate an external magnetic field that extends approximately perpendicular to a surface of the eddy current body, wherein N=1, 2, 3, . . . and M detector coils, wherein M=1, 2, 3, 4, . . . and each detector coil includes an axis and detects changes of an interior magnetic field within the N magnets that are caused by an acceleration of the eddy current body and a resulting change in eddy currents. The axis is approximately perpendicular with respect to the surface of the eddy current body, each detector coil lacks a ferromagnetic core and the N magnets and the M detector coils are arranged alternatingly next to each other in a direction that the acceleration is to be measured.
    Type: Application
    Filed: July 12, 2004
    Publication date: December 2, 2004
    Inventors: Michael Schwabe, Ralph Schmidt, Lutz Rissing
  • Patent number: 6815263
    Abstract: In a component assembly and method for producing the same, the component assembly includes at least one component arranged on a support subframe, e.g., a printed circuit board. An insulator enclosing the component and including two isolating superimposed layers is also arranged on the support substrate. A sealing mass covering the component is arranged inside the insulator. The two or more isolating layers are made from the same isolating material and connected at the contact area.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: November 9, 2004
    Assignee: Dr. Johannes Heidenhain GmbH
    Inventors: Lutz Rissing, Florian Obermayer
  • Publication number: 20040164728
    Abstract: An inductive sensor includes at least two circuit boards and receiver circuit traces applied on the first circuit board. Arranged on the second circuit board are components of an evaluation electronics for evaluating signals that originate from the receiver circuit traces. The two circuit boards are joined in a sandwich-type manner and at least one component of the evaluation electronics is accommodated between the two circuit boards. A rotary encoder may be fitted with this inductive sensor.
    Type: Application
    Filed: February 20, 2004
    Publication date: August 26, 2004
    Inventor: Lutz Rissing
  • Publication number: 20040134684
    Abstract: A composite of at least two flat elements that includes a first support substrate having a first solder pad, and a second support substrate having a second solder pad that is soldered together with the first solder pad. Strip conductor structures are applied to the first support substrate and the second support substrate and a link area that connects a solder shunting area with the first solder pad, wherein the link area is narrower than the first solder pad and the solder shunting area.
    Type: Application
    Filed: February 20, 2004
    Publication date: July 15, 2004
    Inventors: Lutz Rissing, Peter Fischer