Patents by Inventor Mahesh BHATKAR

Mahesh BHATKAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PAD SOLUTIONS FOR RELIABLE BONDS
    Publication number: 20150061156
    Abstract: A bonding pad and a method of manufacturing a bonding pad are presented. The method includes providing a substrate prepared with circuits component and an interlevel dielectric (ILD) layer with interconnects. A final passivation level is formed on the substrate surface and includes a pad opening. A wire bond in contact with the pad interconnect is formed in the pad opening. The pad interconnect is suitable for, for example, copper wire bond and can avoid the formation of intermetallic compound during wire bonding. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 5, 2015
    Inventors: Yi JIANG, Xiaohua ZHAN, Wanbing YI, Mahesh BHATKAR, Yoke Leng LIM, Siow Lee CHWA, Juan Boon TAN, Soh Yun SIAH
  • Dielectric posts in metal layers
    Patent number: 8957523
    Abstract: A semiconductor device is disclosed. The semiconductor device includes a substrate comprises a plurality of metal layers. The semiconductor device also includes dielectric posts disposed in the metal layers. The density of the dielectric posts in the metal layers is equal to about 15-25%.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: February 17, 2015
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Fan Zhang, Wei Shao, Juan Boon Tan, Yeow Kheng Lim, Mahesh Bhatkar, Soh Yun Siah
  • DIELECTRIC POSTS IN METAL LAYERS
    Publication number: 20140191407
    Abstract: A semiconductor device is disclosed. The semiconductor device includes a substrate comprises a plurality of metal layers. The semiconductor device also includes dielectric posts disposed in the metal layers. The density of the dielectric posts in the metal layers is equal to about 15-25%.
    Type: Application
    Filed: January 10, 2013
    Publication date: July 10, 2014
    Applicant: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Fan ZHANG, Wei SHAO, Juan Boon TAN, Yeow Kheng LIM, Mahesh BHATKAR, Soh Yun SIAH