Patents by Inventor Mahesh K. Kumashikar

Mahesh K. Kumashikar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220113788
    Abstract: The present disclosure describes programmable logic that may be operated in a turbo processing mode to cause an ongoing operation to be completed faster than a scheduled completion time. With at least some of the remaining time to the scheduled completion time, power savings may be realized by operating the programmable logic into a deep sleep mode, where configuration memory associated with the programmable logic may be set to a suitable voltage level as to not cause data loss at lower or zero voltage levels but otherwise realize power savings relative to an amount of power consumed during average processing operations.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventors: Mahesh K. Kumashikar, Ankireddy Nalamalpu, Mahesh A. Iyer, Atul Maheshwari, Yuet Li, MD Altaf Hossain
  • Publication number: 20220116045
    Abstract: An integrated circuit device that includes programmable logic circuitry that includes a plurality of regions each configured to operate at different voltage levels. The regions may be separated by level shifters that enable communication between the different voltage level regions. The integrated circuitry may also include software that performs voltage aware placement and routing for a user register-transfer level design, and may direct logic to regions according to voltages defined for the regions.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventors: Mahesh K. Kumashikar, Ankireddy Nalamalpu, MD Altaf Hossain, Atul Maheshwari, Yuet Li, Mahesh A. Iyer
  • Publication number: 20220113694
    Abstract: Systems or methods of the present disclosure may provide efficient power consumption for programmable logic devices based on reducing guardband voltages. A programmable logic device may include circuit monitors to mimic critical paths of an implemented circuit design and generate timing information based on the critical paths. A controller on the programmable logic device may adjust the voltage guardband based on the timing information.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventors: Mahesh K. Kumashikar, MD Altaf Hossain, Mahesh A. Iyer, Yuet Li, Atul Maheshwari, Ankireddy Nalamalpu
  • Publication number: 20220113756
    Abstract: Systems or methods of the present disclosure may provide for gradually adjusting a frequency of a clock signal. When transitioning from a configuration mode to a user mode, a clock of an integrated circuit (e.g., a field-programmable gate array or FPGA) may quickly (e.g., instantaneously) switch from a low configuration mode frequency to a high user mode frequency. This rapid increase in clock frequency may cause an inrush current and corresponding current-resistance voltage (IR) drop. To reduce or avoid the inrush current and IR drop, a frequency of the clock may be gradually ramped up from the configuration mode frequency to the user mode frequency.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventors: Atul Maheshwari, Ankireddy Nalamalpu, Mahesh A. Iyer, Mahesh K. Kumashikar
  • Publication number: 20220115315
    Abstract: A reticle-stitched integrated circuit is provided. The reticle-stitched integrated circuit extends over a first die area and a second die area of an integrated circuit wafer. While individually the first die area and the second die area are within their respective reticle limits, collectively the first die area and the second die area exceed the reticle limit. A first layer of the reticle-stitched integrated circuit may have communication wires that remain exclusively in only one of the first die area and the second die area. A second layer of the reticle-stitched integrated circuit may have communication wires that overlap the first die area and the second die area, thereby allowing communication between the two die areas and enabling the reticle-stitched integrated circuit to exceed the limit of the reticle.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventors: Atul Maheshwari, Ankireddy Nalamalpu, Mahesh K. Kumashikar, David Parkhouse
  • Patent number: 11294852
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20220102281
    Abstract: A digitally communicative circuit may use standardized interfaces for connection and communication with other circuit components. Such digitally communicative circuit may benefit from using wider variety of interconnect schemes with the respective interfaces for transmission and reception of data. Some chiplets may communicate using a high data bandwidth interface while other chiplets may communicate using interfaces with lower data bandwidth. Alternate interface is introduced that may facilitate scaled communication with Advanced Interface Bus 2.0 without translation circuitry and with different data bandwidth.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Inventors: Dheeraj Subbareddy, Ankireddy Nalamalpu, Lai Guan Tang, Mahesh K. Kumashikar
  • Publication number: 20220092016
    Abstract: Embodiments herein relate to systems, apparatuses, or techniques for using an optical physical layer die within a system-on-a-chip to optically couple with an optical physical layer die on another package to provide high-bandwidth memory access between the system-on-a-chip and the other package. In embodiments, the other package may be a large optically connected memory device that includes a memory controller coupled with an optical physical layer die, where the memory controller is coupled with memory. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 24, 2020
    Publication date: March 24, 2022
    Inventors: Mahesh K. KUMASHIKAR, Dheeraj SUBBAREDDY, Anshuman THAKUR, MD Altaf HOSSAIN, Ankireddy NALAMALPU, Casey G. THIELEN, Daniel S. KLOWDEN, Kevin P. MA, Sergey Yuryevich SHUMARAYEV, Sandeep SANE, Conor O'KEEFFE
  • Publication number: 20220050805
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Publication number: 20220013488
    Abstract: An integrated circuit device includes multiple microbumps and a top programmable fabric die including a first programmable fabric and a first microbump interface coupled to the multiple microbumps. The integrated circuit device also includes a base programmable fabric die having a second programmable fabric and a second microbump interface coupled to the first microbump interface via a coupling to the multiple microbumps. The top programmable fabric die and the base programmable fabric die have a same design. Moreover, the top programmable fabric die and the base programmable fabric die are arranged in a three-dimensional die arrangement with the top programmable fabric die flipped above the base programmable fabric die.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Mahesh K. Kumashikar, Dheeraj Subbareddy, Ankireddy Nalamalpu, MD Altaf Hossain, Atul Maheshwari
  • Publication number: 20200334196
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 10795853
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20180101502
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: September 30, 2017
    Publication date: April 12, 2018
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 9552308
    Abstract: A request associated with a particular cache record is generated to be sent to a system component associated with a cache bank over an interconnect. A wake-warn signal is sent over a dedicated wake-warn channel to indicate to the system component that the request is to arrive. Wake-warn signals cause a disabled clock to be ungated to an enabled state. The request is then sent to the system component.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: January 24, 2017
    Assignee: Intel Corporation
    Inventors: Suresh Sugumar, Mahesh K. Kumashikar, Rahul Pal, Sridhar Muthrasanallur
  • Patent number: 9229879
    Abstract: Embodiments of the present disclosure describe techniques and configurations to reduce power consumption using unmodified information in evicted cache lines. A method includes identifying unmodified information of a cache line stored in a cache of a processor, tracking the unmodified information using a bit vector comprising one or more bits to indicate the unmodified information of the cache line, and selectively suppressing a write operation or send operation for the unmodified information of the cache line that is evicted from the cache to an input/output (I/O) component coupled to the cache, the selective suppressing being based on the one or more bits, and the I/O component being an outer component external to the cache. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: January 5, 2016
    Assignee: Intel Corporation
    Inventors: Mahesh K. Kumashikar, Ashok Jagannathan
  • Publication number: 20150095688
    Abstract: A request associated with a particular cache record is generated to be sent to a system component associated with a cache bank over an interconnect. A wake-warn signal is sent over a dedicated wake-warn channel to indicate to the system component that the request is to arrive. Wake-warn signals cause a disabled clock to be ungated to an enabled state. The request is then sent to the system component.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Inventors: Suresh Sugumar, Mahesh K. Kumashikar, Rahul Pal, Sridhar Muthrasanallur
  • Publication number: 20130019064
    Abstract: Embodiments of the present disclosure describe techniques and configurations to reduce power consumption using unmodified information in evicted cache lines. A method includes identifying unmodified information of a cache line stored in a cache of a processor, tracking the unmodified information using a bit vector comprising one or more bits to indicate the unmodified information of the cache line, and selectively suppressing a write operation or send operation for the unmodified information of the cache line that is evicted from the cache to an input/output (I/O) component coupled to the cache, the selective suppressing being based on the one or more bits, and the I/O component being an outer component external to the cache. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 11, 2011
    Publication date: January 17, 2013
    Inventors: Mahesh K. Kumashikar, Ashok Jagannathan
  • Publication number: 20070299902
    Abstract: Embodiments disclosed herein provide sparse adder circuits comprising Ling type propagate and generate circuits and sparse carry circuits to efficiently add first and second operands to one another.
    Type: Application
    Filed: June 26, 2006
    Publication date: December 27, 2007
    Inventors: Mahesh K. Kumashikar, Sanu Mathew, Ram Krishnamurthy, Daniel Jackson