Patents by Inventor Maiko Ariga

Maiko Ariga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11367993
    Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: June 21, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke Inaba, Maiko Ariga, Kazuki Yamaoka
  • Patent number: 11283234
    Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 22, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki Yamaoka, Maiko Ariga, Yusuke Inaba
  • Publication number: 20220007496
    Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.
    Type: Application
    Filed: September 17, 2021
    Publication date: January 6, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko ARIGA, Yusuke INABA, Kazuki YAMAOKA, Atsushi IZAWA, Kazuya NAGASHIMA
  • Publication number: 20210367398
    Abstract: An optical module includes: an optical functional element outputting a first light beam; a first optical part receiving the first light beam, having a predetermined effect on the first light beam, and outputting the affected first light beam as a second light beam; a second optical part receiving the second light beam, having a predetermined effect on the second light beam, outputting the affected second light beam as a third light beam, and reflecting a reflected light beam in a direction not coupled to the first optical part, the reflected light beam being generated from the second light on an incident surface on which the second light beam is incident; a housing accommodating the optical functional element, the first optical part, and the second optical part; and an optical attenuator provided inside the housing and attenuating power of the reflected light beam incident on the optical attenuator.
    Type: Application
    Filed: August 9, 2021
    Publication date: November 25, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki YAMAOKA, Maiko ARIGA, Yusuke INABA
  • Publication number: 20210367399
    Abstract: An optical module includes: an optical element; and a thermoelectric module on which the optical element is mounted. Further, the thermoelectric module includes a first substrate, a second substrate disposed to face the first substrate, and a plurality of thermoelectric elements provided between the first substrate and the second substrate, and a pattern made of a material different from a material of the first substrate is formed on a surface of the first substrate opposite to a back surface of the first substrate facing the second substrate, and the optical element is mounted on the surface of the first substrate in association with the pattern.
    Type: Application
    Filed: August 4, 2021
    Publication date: November 25, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke INABA, Maiko ARIGA, Kazuki YAMAOKA
  • Publication number: 20210364697
    Abstract: An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.
    Type: Application
    Filed: August 4, 2021
    Publication date: November 25, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke INABA, Junichi HASEGAWA, Maiko ARIGA, Kazuki YAMAOKA
  • Publication number: 20210364713
    Abstract: An optical module includes: a base having a predetermined product of a coefficient of linear expansion and a Young's modulus; a planar lightwave circuit element mounted on the base; and a warpage suppression component, which is mounted on a surface of the planar lightwave circuit element, the surface being on a side opposite to a side where the planar lightwave circuit element is mounted on the base, having a product of a coefficient of linear expansion and a Young's modulus that reduces warpage of the planar lightwave circuit element in accordance with warpage of the base depending on temperature change.
    Type: Application
    Filed: August 2, 2021
    Publication date: November 25, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko ARIGA, Yusuke INABA, Kazuki YAMAOKA, Junichi HASEGAWA
  • Publication number: 20210234331
    Abstract: An optical module includes: at least one optical element; a housing main body that houses therein the at least one optical element; and a plurality of lead pins that are provided to a side wall of the housing main body. Further, at least one of the lead pins is electrically connected to the at least one optical element, and the lead pins are lined up in a plurality of rows along a height direction of the side wall, and are arranged in such a manner that adjacent lead pins do not overlap each other in a top view.
    Type: Application
    Filed: April 13, 2021
    Publication date: July 29, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko ARIGA, Yusuke INABA, Kazuki YAMAOKA
  • Patent number: 11031746
    Abstract: A semiconductor laser module includes a semiconductor laser device that outputs laser light; an optical fiber that includes a core portion and a cladding portion formed at an outer periphery of the core portion and that receives the laser light from one end and guides the laser light to the outside of the semiconductor laser module; an optical part disposed at an outer periphery of the optical fiber, having optical transmittance at a wavelength of the laser light, and that fixes the optical fiber; a first fixative that fixes the optical part and the optical fiber; and a housing that accommodates the semiconductor laser device and the one end of the optical fiber that receives the laser light, wherein an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: June 8, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Maiko Ariga, Masaki Iwama
  • Patent number: 10886693
    Abstract: An optical module includes a housing and an optical element that is disposed in the housing and emits light in the housing, in which a partial area of a surface inside the housing serves as a reduced optical reflection area processed so as to absorb the light and have a rough surface.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: January 5, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko Ariga, Yuta Ishige, Masaki Iwama
  • Patent number: 10869395
    Abstract: A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: December 15, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Etsuji Katayama, Jun Miyokawa, Maiko Ariga, Toshio Sugaya
  • Publication number: 20200366054
    Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.
    Type: Application
    Filed: August 5, 2020
    Publication date: November 19, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke INABA, Maiko ARIGA, Kazuki YAMAOKA
  • Publication number: 20200366056
    Abstract: A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.
    Type: Application
    Filed: August 5, 2020
    Publication date: November 19, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke INABA, Maiko ARIGA, Kazuki YAMAOKA
  • Publication number: 20200366053
    Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.
    Type: Application
    Filed: August 6, 2020
    Publication date: November 19, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki YAMAOKA, Maiko ARIGA, Yusuke INABA
  • Patent number: 10811840
    Abstract: A laser module that can suppress influence due to a reflected light between chips is provided. A laser module 100 according to one embodiment of the present invention includes: a laser element 110 provided on a first substrate and having a laser oscillation unit that generates a laser light and a first optical waveguide that guides the laser light; and an optical amplifier 120 provided on a second substrate and having a second waveguide that guides the laser light. The first optical waveguide is nonparallel relative to an end face of the first substrate and connected thereto, the second optical waveguide is nonparallel relative to an end face of the second substrate and connected thereto, and the first substrate and the second substrate are arranged such that the laser light output from the first optical waveguide is optically coupled to the second optical waveguide.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: October 20, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko Ariga, Yusuke Inaba, Kazuaki Kiyota, Toshihito Suzuki
  • Publication number: 20200203917
    Abstract: An optical module includes a first optical function device that has an emission end and emits a light from the emission end; a second optical function device that has an entry end and an emission end, amplifies the light entering the entry end, and emits the amplified light from the emission end, wherein the light is emitted from the emission end of the first optical function device and enters the entry end; a first optical non-reciprocal device that is arranged between the emission end of the first optical function device and the entry end of the second optical function device, transmits a light in a first direction from the emission end of the first optical function device toward the entry end of the second optical function device, and blocks or attenuates a light in a second direction opposite to the first direction; and a second optical non-reciprocal device that is arranged on the emission end side of the second optical function device, transmits a light in a third direction outward from the emission end
    Type: Application
    Filed: March 3, 2020
    Publication date: June 25, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki YAMAOKA, Maiko ARIGA, Kazuaki KIYOTA, Yusuke INABA
  • Patent number: 10558063
    Abstract: An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a connection surface of another end portion of the wiring are different from each other.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: February 11, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Toshio Sugaya, Maiko Ariga
  • Publication number: 20190363511
    Abstract: A semiconductor laser module includes a semiconductor laser device that outputs laser light; an optical fiber that includes a core portion and a cladding portion formed at an outer periphery of the core portion and that receives the laser light from one end and guides the laser light to the outside of the semiconductor laser module; an optical part disposed at an outer periphery of the optical fiber, having optical transmittance at a wavelength of the laser light, and that fixes the optical fiber; a first fixative that fixes the optical part and the optical fiber; and a housing that accommodates the semiconductor laser device and the one end of the optical fiber that receives the laser light, wherein an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part.
    Type: Application
    Filed: August 13, 2019
    Publication date: November 28, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Maiko Ariga, Masaki Iwama
  • Publication number: 20190363510
    Abstract: An optical module includes a housing and an optical element that is disposed in the housing and emits light in the housing, in which a partial area of a surface inside the housing serves as a reduced optical reflection area processed so as to absorb the light and have a rough surface.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 28, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko ARIGA, Yuta ISHIGE, Masaki IWAMA
  • Publication number: 20190312414
    Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.
    Type: Application
    Filed: June 18, 2019
    Publication date: October 10, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko Ariga, Yusuke Inaba, Kazuki Yamaoka, Toshio Sugaya