Abstract: A laser module that can suppress influence due to a reflected light between chips is provided. A laser module 100 according to one embodiment of the present invention includes: a laser element 110 provided on a first substrate and having a laser oscillation unit that generates a laser light and a first optical waveguide that guides the laser light; and an optical amplifier 120 provided on a second substrate and having a second waveguide that guides the laser light. The first optical waveguide is nonparallel relative to an end face of the first substrate and connected thereto, the second optical waveguide is nonparallel relative to an end face of the second substrate and connected thereto, and the first substrate and the second substrate are arranged such that the laser light output from the first optical waveguide is optically coupled to the second optical waveguide.

Abstract: An optical module includes a first optical function device that has an emission end and emits a light from the emission end; a second optical function device that has an entry end and an emission end, amplifies the light entering the entry end, and emits the amplified light from the emission end, wherein the light is emitted from the emission end of the first optical function device and enters the entry end; a first optical non-reciprocal device that is arranged between the emission end of the first optical function device and the entry end of the second optical function device, transmits a light in a first direction from the emission end of the first optical function device toward the entry end of the second optical function device, and blocks or attenuates a light in a second direction opposite to the first direction; and a second optical non-reciprocal device that is arranged on the emission end side of the second optical function device, transmits a light in a third direction outward from the emission end

Abstract: An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a connection surface of another end portion of the wiring are different from each other.

Abstract: A semiconductor laser module includes a semiconductor laser device that outputs laser light; an optical fiber that includes a core portion and a cladding portion formed at an outer periphery of the core portion and that receives the laser light from one end and guides the laser light to the outside of the semiconductor laser module; an optical part disposed at an outer periphery of the optical fiber, having optical transmittance at a wavelength of the laser light, and that fixes the optical fiber; a first fixative that fixes the optical part and the optical fiber; and a housing that accommodates the semiconductor laser device and the one end of the optical fiber that receives the laser light, wherein an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part.

Abstract: An optical module includes a housing and an optical element that is disposed in the housing and emits light in the housing, in which a partial area of a surface inside the housing serves as a reduced optical reflection area processed so as to absorb the light and have a rough surface.

Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.

Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a semiconductor optical amplifier configured to receive laser light emitted from the semiconductor laser device and amplify the laser light that has been received; and a first light receiving device that measures an intensity of a part of the laser light emitted from the semiconductor laser device, for monitoring a wavelength of the laser light, wherein the semiconductor optical amplifier is located rearward in relation to a light receiving surface of the first light receiving device along a propagation direction of the laser light emitted from the semiconductor device.

Abstract: A laser module that can suppress influence due to a reflected light between chips is provided. A laser module 100 according to one embodiment of the present invention includes: a laser element 110 provided on a first substrate and having a laser oscillation unit that generates a laser light and a first optical waveguide that guides the laser light; and an optical amplifier 120 provided on a second substrate and having a second waveguide that guides the laser light. The first optical waveguide is nonparallel relative to an end face of the first substrate and connected thereto, the second optical waveguide is nonparallel relative to an end face of the second substrate and connected thereto, and the first substrate and the second substrate are arranged such that the laser light output from the first optical waveguide is optically coupled to the second optical waveguide.

Abstract: A flexible substrate includes: an insulating base member; a plurality of lands formed aligned in a plurality of lines in a first direction on the base member; and a plurality of wirings formed on the base member, extending in a second direction intersecting the first direction, and connected to the plurality of lands on each line of the plurality of lines, wherein the plurality of wirings include a wiring extending between the lands aligned in the first direction, and wherein each of the plurality of lands has a planar shape longer in the second direction.

Abstract: A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.

Abstract: An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a connection surface of another end portion of the wiring are different from each other.

Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.

Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.

Abstract: [Objective] To restrict degradation of optical characteristics due to a resin adhesive containing an inorganic filler. [Means] The width d of a lens body 31 and the height of an inorganic filler 341 in a direction orthogonal to the surface of a substrate are set such that an inclination angle of a collimating lens 3 does not exceed a maximum tolerable inclination angle when the inorganic filler 341 is positioned near the width-wise center of the lens body 31. As a result, even when the inorganic filler 341 is inserted between the bottom surface of the collimating lens 3 and the top surface of the substrate 4, degradation of the optical characteristics of the laser module including skewing of the optical axis of the laser light and distortion of the beam shape of the laser light can be restricted.

Abstract: [Objective] To restrict degradation of optical characteristics due to a resin adhesive containing an inorganic filler. [Means] The width d of a lens body 31 and the height of an inorganic filler 341 in a direction orthogonal to the surface of a substrate are set such that an inclination angle of a collimating lens 3 does not exceed a maximum tolerable inclination angle when the inorganic filler 341 is positioned near the width-wise center of the lens body 31. As a result, even when the inorganic filler 341 is inserted between the bottom surface of the collimating lens 3 and the top surface of the substrate 4, degradation of the optical characteristics of the laser module including skewing of the optical axis of the laser light and distortion of the beam shape of the laser light can be restricted.

Abstract: [Objective] To prevent change in a direction of an optical axis of a split light within a plane parallel to a surface on which the beam splitter is installed. [Means] A laser module including a laser light source that emits a laser light and a beam splitter that splits a portion of the laser light emitted from the laser light source. The beam splitter includes a first reflective surface and a second reflective surface that are parallel to each other. The first reflective surface transmits a first portion of the laser light and reflects a second portion of the laser light to the second reflective surface. The second reflective surface receives the second portion of the laser light from the first reflective surface and reflects received laser light in a direction parallel to the laser light emitted from the laser light source.

Abstract: A surface emitting laser element array comprises a plurality of surface emitting laser elements (15) on a same substrate (1) each comprising a mesa post formed of a laminated structure including an active layer (4) for reducing a crosstalk between the surface emitting laser elements constituting the surface emitting laser element array, and for improving a high speed response, wherein each of the surface emitting laser elements (15) comprises a first electrode (9), a second electrode (10) and a third electrode (11) that have a polarity different from that of the first electrode (9); the first electrode (9) is arranged on the mesa post; the second electrode (10) is arranged on one surface of the substrate (1) same as that of the first electrode (9); the third electrode (11) is arranged on the other surface of the substrate (1) opposite to that of the first electrode and the second electrode (9, 10) and is provided as a common electrode of the surface emitting laser elements (15); and an electric current is app

Abstract: An optical module 10 has a laser light source 20, optical branching means 24 for receiving laser light from the laser light source 20, making a part of the laser light pass through the optical branching means and branching a remaining part of the laser light; a photodetecting portion 30P receiving the remaining part of the laser light branched from the optical branching means 24 and a package 11 holding therein the laser light source 20, the optical branching means 24 and the photodetecting portion 30P, the package 11 having stray light reducing means 200, 201 and 202 provided therein to reduce stray light generated inside the package.

Abstract: A surface emitting laser element array comprises a plurality of surface emitting laser elements (15) on a same substrate (1) each comprising a mesa post formed of a laminated structure including an active layer (4) for reducing a crosstalk between the surface emitting laser elements constituting the surface emitting laser element array, and for improving a high speed response, wherein each of the surface emitting laser elements (15) comprises a first electrode (9), a second electrode (10) and a third electrode (11) that have a polarity different from that of the first electrode (9); the first electrode (9) is arranged on the mesa post; the second electrode (10) is arranged on one surface of the substrate (1) same as that of the first electrode (9); the third electrode (11) is arranged on the other surface of the substrate (1) opposite to that of the first electrode and the second electrode (9, 10) and is provided as a common electrode of the surface emitting laser elements (15); and an electric current is app

Abstract: An optical module 10 has a laser light source 20, optical branching means 24 for receiving laser light from the laser light source 20, making a part of the laser light pass through the optical branching means and branching a remaining part of the laser light; a photodetecting portion 30P receiving the remaining part of the laser light branched from the optical branching means 24 and a package 11 holding therein the laser light source 20, the optical branching means 24 and the photodetecting portion 30P, the package 11 having stray light reducing means 200, 201 and 202 provided therein to reduce stray light generated inside the package.