Patents by Inventor Maki Tanaka

Maki Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957300
    Abstract: An information processing apparatus (2000) detects an abnormal region (30) from a moving image frame (14). The abnormal region (30) is a region that is estimated to represent an abnormal part inside a body of a subject. The information processing apparatus (2000) generates and outputs output information based on the number of detected abnormal regions (30).
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: April 16, 2024
    Assignees: NEC CORPORATION, NATIONAL CANCER CENTER
    Inventors: Ikuma Takahashi, Maki Sano, Kimiyasu Takoh, Motoyasu Okutsu, Chiemi Tanaka, Masahiro Saikou, Hitoshi Imaoka, Kenichi Kamijo, Ryuji Hamamoto, Yutaka Saito, Masayoshi Yamada
  • Patent number: 11508047
    Abstract: Even if a generated wide-field image includes residual local misalignment, this charged particle microscope device can prompt for user input to correct such local misalignment, and can regenerate, on the basis of the user input, a wide-field image that includes little misalignment even in local areas of the overlap regions thereof.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: November 22, 2022
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Mitsutoshi Kobayashi, Maki Tanaka, Yoshinobu Hoshino
  • Publication number: 20200265568
    Abstract: Even if a generated wide-field image includes residual local misalignment, this charged particle microscope device can prompt for user input to correct such local misalignment, and can regenerate, on the basis of the user input, a wide-field image that includes little misalignment even in local areas of the overlap regions thereof.
    Type: Application
    Filed: September 14, 2017
    Publication date: August 20, 2020
    Inventors: Mitsutoshi KOBAYASHI, Maki TANAKA, Yoshinobu HOSHINO
  • Patent number: 10331249
    Abstract: A touch sensor substrate including a base material having a first surface, and electrodes each having a bottom surface positioned on the first surface, a top surface opposite to the bottom surface, and side surfaces connecting the bottom and top surfaces, each of the electrodes having a blackened layer formed on the side surfaces and at least one of the bottom and top surfaces. The blackened layer has a surface resistivity of less than 1 ?/square.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: June 25, 2019
    Assignee: VTS-TOUCHSENSOR CO., LTD.
    Inventors: Hiroki Goto, Maki Tanaka, Gen Nakamura
  • Patent number: 10242489
    Abstract: An image processing device and an image processing method that performs image interpretation as fast as possible, without oversight by an interactive operation, when performing the image interpretation of a large amount of volume data in which an interest region is set in advance are provided. The image processing device that generates a two-dimensional image from a captured three-dimensional image and displays the generated two-dimensional image receives an input signal relating to primary display control information including a speed of a display control input of the two-dimensional image, calculates the primary display control information from the input signal, calculates secondary display control information including a display speed of the two-dimensional image based on information of an interest region and the primary display control information, and sequentially generates the two-dimensional images based on the secondary display control information and displays the generated two-dimensional image.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: March 26, 2019
    Assignee: Hitachi, Ltd.
    Inventors: Hanae Yoshida, Maki Tanaka
  • Patent number: 10186399
    Abstract: A scanning electron microscope capable of properly determining a step of a step pattern formed on a sample regardless of combination of material of a groove of the step pattern and material of a projection of the step pattern, the scanning electron microscope includes a beam source, a detection unit having a first detection unit that detects a secondary electron emitted from the sample at an angle between an optical axis direction of the primary electron beam which is equal to or less than a predetermined value, and a second detection unit that detects a secondary electron emitted from the sample at an angle between the optical axis direction of the primary electron beam which is greater than the predetermined value, and a processing unit to obtain information on the step pattern using the information on a ratio between signals outputted from the first and the second detection unit.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: January 22, 2019
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Mayuka Osaki, Chie Shishido, Maki Tanaka, Hitoshi Namai, Fumihiro Sasajima, Makoto Suzuki, Yoshinori Momonoi
  • Patent number: 9859093
    Abstract: A scanning charged particle microscope apparatus includes image quality improvement unit which performs an image quality improvement process on image data which is obtained by detecting particles generated from a sample, the image quality improvement unit divides a region in which the image data is acquired into two or more regions on the basis of a distance from a region in which the image data within a visual field of a charged particle optical unit is not acquired, determines an image quality improvement processing method and a processing parameter for image quality improvement for the image data in each of the separate regions according to the separate regions; and performs an image quality improvement process on the image data in each of the separate regions by using the determined processing method and processing parameter corresponding to the separate region.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: January 2, 2018
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Kenji Nakahira, Maki Tanaka
  • Patent number: 9852881
    Abstract: In order to allow detecting backscattered electrons (BSEs) generated from the bottom of a hole for determining whether a hole with a super high aspect ratio is opened or for inspecting and measuring the ratio of the top diameter to the bottom diameter of a hole, which are typified in 3D-NAND processes of opening a hole, a primary electron beam accelerated at a high accelerating voltage is applied to a sample. Backscattered electrons (BSEs) at a low angle (e.g. a zenith angle of five degrees or more) are detected. Thus, the bottom of a hole is observed using “penetrating BSEs” having been emitted from the bottom of the hole and penetrated the side wall. Using the characteristics in which a penetrating distance is relatively prolonged through a deep hole and the amount of penetrating BSEs is decreased to cause a dark image, a calibration curve expressing the relationship between a hole depth and the brightness is given to measure the hole depth.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: December 26, 2017
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Chie Shishido, Takuma Yamamoto, Shinya Yamada, Maki Tanaka
  • Patent number: 9824853
    Abstract: In order to enable high-speed imaging of a wide-field image, the imaging method using the electron microscope comprises: irradiating and scanning a wide-field region of the sample with a low-dose amount of electron beam, and acquiring a wide-field image of the sample; setting, from this wide-field image, a narrow-field region; irradiating and scanning this narrow-field region with a high-dose amount of the electron beam, and acquiring a narrow-field image of the sample; determining the noise-removal parameters for the acquired wide-field image and narrow-field image; performing image quality improvement processing on the wide-field image and the narrow-field image; performing drift correction on the narrow-field image undergone the image quality improvement processing; and combining the narrow-field image undergone this drift correction and the wide-field image in such a manner that the visibility of each is at the same level throughout the entirety of the combined image.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: November 21, 2017
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Mitsutoshi Kobayashi, Kenji Nakahira, Maki Tanaka
  • Publication number: 20170301513
    Abstract: A scanning electron microscope capable of properly determining a step of a step pattern formed on a sample regardless of combination of material of a groove of the step pattern and material of a projection of the step pattern, the scanning electron microscope includes a beam source, a detection unit having a first detection unit that detects a secondary electron emitted from the sample at an angle between an optical axis direction of the primary electron beam which is equal to or less than a predetermined value, and a second detection unit that detects a secondary electron emitted from the sample at an angle between the optical axis direction of the primary electron beam which is greater than the predetermined value, and a processing unit to obtain information on the step pattern using the information on a ratio between signals outputted from the first and the second detection unit.
    Type: Application
    Filed: February 28, 2017
    Publication date: October 19, 2017
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Mayuka OSAKI, Chie SHISHIDO, Maki TANAKA, Hitoshi NAMAI, Fumihiro SASAJIMA, Makoto SUZUKI, Yoshinori MOMONOI
  • Publication number: 20170243391
    Abstract: An image processing device and an image processing method that performs image interpretation as fast as possible, without oversight by an interactive operation, when performing the image interpretation of a large amount of volume data in which an interest region is set in advance are provided. The image processing device that generates a two-dimensional image from a captured three-dimensional image and displays the generated two-dimensional image receives an input signal relating to primary display control information including a speed of a display control input of the two-dimensional image, calculates the primary display control information from the input signal, calculates secondary display control information including a display speed of the two-dimensional image based on information of an interest region and the primary display control information, and sequentially generates the two-dimensional images based on the secondary display control information and displays the generated two-dimensional image.
    Type: Application
    Filed: June 5, 2015
    Publication date: August 24, 2017
    Inventors: Hanae YOSHIDA, Maki TANAKA
  • Patent number: 9741530
    Abstract: A charged-particle-beam device is provided with a data processing unit that removes, from a detector signal, the effect that scattering of a primary charged-particle beam before the primary charged-particle beam reaches a specimen has on the spot shape of the primary charged-particle beam. For example, when using an electron microscope to observe a specimen in a non-vacuum atmosphere, the effect that scattering of a primary charged-particle beam due to a barrier film or a gas present in a non-vacuum space has on the spot shape of the primary charged-particle beam is removed from a signal acquired by a detector. This makes it easy to obtain high-quality images.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: August 22, 2017
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Yusuke Ominami, Kenji Nakahira, Maki Tanaka, Shinsuke Kawanishi
  • Publication number: 20170169992
    Abstract: In order to enable high-speed imaging of a wide-field image, the imaging method using the electron microscope comprises: irradiating and scanning a wide-field region of the sample with a low-dose amount of electron beam, and acquiring a wide-field image of the sample; setting, from this wide-field image, a narrow-field region; irradiating and scanning this narrow-field region with a high-dose amount of the electron beam, and acquiring a narrow-field image of the sample; determining the noise-removal parameters for the acquired wide-field image and narrow-field image; performing image quality improvement processing on the wide-field image and the narrow-field image; performing drift correction on the narrow-field image undergone the image quality improvement processing; and combining the narrow-field image undergone this drift correction and the wide-field image in such a manner that the visibility of each is at the same level throughout the entirety of the combined image.
    Type: Application
    Filed: May 27, 2015
    Publication date: June 15, 2017
    Inventors: Mitsutoshi KOBAYASHI, Kenji NAKAHIRA, Maki TANAKA
  • Patent number: 9671223
    Abstract: Beforehand, the device characteristic patterns of each critical dimension SEM are measured, a sectional shape of an object to undergo dimension measurement is presumed by a model base library (MBL) matching system, dimension measurements are carried out by generating signal waveforms through SEM simulation by inputting the presumed sectional shapes and the device characteristic parameters, and differences in the dimension measurement results are registered as machine differences. In actual measurements, from the dimension measurement results in each critical dimension SEM, machine differences are corrected by subtracting the registered machine differences. Furthermore, changes in critical dimension SEM's over time are monitored by periodically measuring the above-mentioned device characteristic parameters and predicting the above-mentioned dimension measurement results. According to the present invention, actual measurements of machine differences, which require considerable time and effort, are unnecessary.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: June 6, 2017
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Chie Shishido, Maki Tanaka, Katsuhiro Sasada
  • Publication number: 20170102808
    Abstract: A touch sensor substrate including a base material having a first surface, and electrodes each having a bottom surface positioned on the first surface, a top surface opposite to the bottom surface, and side surfaces connecting the bottom and top surfaces, each of the electrodes having a blackened layer formed on the side surfaces and at least one of the bottom and top surfaces. The blackened layer has a surface resistivity of less than 1 ?/square.
    Type: Application
    Filed: December 22, 2016
    Publication date: April 13, 2017
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Hiroki GOTO, Maki TANAKA, Gen NAKAMURA
  • Publication number: 20160379798
    Abstract: In order to allow detecting backscattered electrons (BSEs) generated from the bottom of a hole for determining whether a hole with a super high aspect ratio is opened or for inspecting and measuring the ratio of the top diameter to the bottom diameter of a hole, which are typified in 3D-NAND processes of opening a hole, a primary electron beam accelerated at a high accelerating voltage is applied to a sample. Backscattered electrons (BSEs) at a low angle (e.g. a zenith angle of five degrees or more) are detected. Thus, the bottom of a hole is observed using “penetrating BSEs” having been emitted from the bottom of the hole and penetrated the side wall. Using the characteristics in which a penetrating distance is relatively prolonged through a deep hole and the amount of penetrating BSEs is decreased to cause a dark image, a calibration curve expressing the relationship between a hole depth and the brightness is given to measure the hole depth.
    Type: Application
    Filed: November 19, 2014
    Publication date: December 29, 2016
    Inventors: Chie SHISHIDO, Takuma YAMAMOTO, Shinya YAMADA, Maki TANAKA
  • Publication number: 20160343540
    Abstract: A scanning charged particle microscope apparatus includes image quality improvement unit which performs an image quality improvement process on image data which is obtained by detecting particles generated from a sample, the image quality improvement unit divides a region in which the image data is acquired into two or more regions on the basis of a distance from a region in which the image data within a visual field of a charged particle optical unit is not acquired, determines an image quality improvement processing method and a processing parameter for image quality improvement for the image data in each of the separate regions according to the separate regions; and performs an image quality improvement process on the image data in each of the separate regions by using the determined processing method and processing parameter corresponding to the separate region.
    Type: Application
    Filed: December 3, 2014
    Publication date: November 24, 2016
    Inventors: Kenji NAKAHIRA, Maki TANAKA
  • Publication number: 20160336145
    Abstract: A charged-particle-beam device is provided with a data processing unit that removes, from a detector signal, the effect that scattering of a primary charged-particle beam before the primary charged-particle beam reaches a specimen has on the spot shape of the primary charged-particle beam. For example, when using an electron microscope to observe a specimen in a non-vacuum atmosphere, the effect that scattering of a primary charged-particle beam due to a barrier film or a gas present in a non-vacuum space has on the spot shape of the primary charged-particle beam is removed from a signal acquired by a detector. This makes it easy to obtain high-quality images.
    Type: Application
    Filed: December 3, 2014
    Publication date: November 17, 2016
    Applicant: Hitachi High-Technologies Corporation
    Inventors: Yusuke OMINAMI, Kenji NAKAHIRA, Maki TANAKA, Shinsuke KAWANISHI
  • Patent number: 9354049
    Abstract: A model based measurement method is capable of estimating a cross-sectional shape by matching various pre-created cross-sectional shapes with a library of SEM signal waveforms. The present invention provides a function for determining whether or not it is appropriate to create a model of a cross-sectional shape or a function for verifying the accuracy of estimation results to a conventional model based measurement method, wherein a solution space (expected solution space) is obtained by matching library waveforms and is displayed before measuring the real pattern by means of model based measurement. Moreover, after the real pattern is measured by means of model based measurement, the solution space (real solution space) is obtained by matching the real waveforms with the library waveforms and is displayed.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: May 31, 2016
    Assignee: HUTACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Chie Shishido, Maki Tanaka, Atsushi Miyamoto, Akira Hamamatsu, Manabu Yano
  • Patent number: 9190240
    Abstract: A charged particle microscope apparatus includes a radiation optical system that radiates a focused charged particle beam to an upper side of a sample provided with a pattern and scans the sample; a detection optical system that detects charged particles generated from the sample to which the charged particle beam has been radiated by the radiation optical system; and a processing unit that processes the charged particles detected by the detection optical system to obtain a charged particle image of the sample, estimates diffusion of the charged particles at any depth of the pattern of the sample, on the basis of information on a depth or a material of the pattern of the sample or radiation energy of the charged particle beam in the radiation optical system; corrects the obtained charged particle image using the estimated diffusion of the charged particles; and processes the corrected charged particle image.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: November 17, 2015
    Assignee: Hitachi High-Technologies Corporation
    Inventor: Maki Tanaka