Abstract: A member supporting method for supporting a member using support pins includes: an abutting step (S1) of abutting an end of each of a plurality of support pins facing a surface to be supported of the member against the member by moving the plurality of support pins in a supporting direction which is a direction in which the support pins support the member; and a fixing step (S2) of fixing the plurality of support pins in position with the end of each of the plurality of support pins abutted against the member and located along irregularities on the surface to be supported in the abutting step (S1), and thereby restricting movement of the plurality of support pins in both directions parallel to the supporting direction.

Abstract: The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.

Abstract: The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.

Abstract: The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.

Abstract: A plurality of self-propelled system heads (5) are made to independently travel along a closed-loop travel track (6) in a manner that the heads do not interfere with each other by controlling respective drive devices (4). Components (2) from a component supply device (8) are held by component holding members (3) of the heads, and thereafter, the components held by the component holding members are mounted on boards (1) positioned by board positioning devices (7).

Abstract: A device for mounting components using mounting heads having a plurality of suction nozzles that provide a plurality of component pickups, positions or mounting operating positions. The mounting heads are positioned on a rotating table that is cooperatively positioned adjacent a component supply table having a plurality of component feeder members. The control unit can rotate the rotating table to position a mounting head at a component supply position and further position one of the plurality of suction nozzles to a first, second and third section operating position for picking up a component from a component feeder. The relative movement of the component supply table and the positioning of first and second suction operating positions relative to our reference point where the edge of the rotating table contacts the line of movement of the component supply table can increase the pickup speed of components.

Abstract: When a movable member (14) is moved from a gripping position in which a circuit board (2) was gripped by the movable member (14) and a stationary member (13), a separation mechanism (7, 12) forcibly separates the circuit board from the stationary member (13), to thereby prevent the occurrence of a state in which the circuit board (2) is stuck to the stationary member.

Abstract: The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing the objective, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling the moving, and further an identifying device. The arrangement enables switching the method of transferring boards in accordance with types of boards to be produced, and controlling the supply of board to the component mounting apparatus, so that the production efficiency is improved in accordance with types of boards.

Abstract: A component feed apparatus includes a first feed table (9, 9a) loaded with a plurality of component feed cassettes (1) thereon and moving in a manner so that the first feed table can be positioned in a right-left direction as an arrangement direction of the component feed cassettes. A second feed table (10, 10a) is located at the rear of the first feed table and is loaded and arranged with a plurality of component feed cassettes (1) in the right-left direction. Also, a component transfer unit (8) which is located at the lateral side of the first feed table and moves so that the component transfer unit can be positioned in the right-left direction, thereby receiving components from the component feed cassettes on the second feed table and sending the components forward.

Abstract: When a movable member (14) is moved from a gripping position in which a circuit board (2) was gripped by the movable member (14) and a stationary member (13), a separation mechanism (7, 12) forcibly separates the circuit board from the stationary member (13), to thereby prevent the occurrence of a state in which the circuit board (2) is stuck to the stationary member.

Abstract: A method for mounting components using mounting heads for which a plurality of suction or mounting operating positions are set for suction nozzles in a state where the mounting head is at rest in a component supply position or component mounting position, it being possible to select any of these operating positions, comprising a first step of selecting a component supply position or component mounting position such that the amount of movement of component feeder holding components to be mounted, or the amount of movement of the substrate to the mounting position for the next component to be mounted becomes a minimum, and moving the component feeder or substrate accordingly; and a second step of selecting a suction nozzle position corresponding to the component suction position or component mounting position in the first step, whilst the mounting head is moving towards the component suction position.

Abstract: When a movable member (14) is moved from a gripping position in which a circuit board (2) was gripped by the movable member (14) and a stationary member (13), a separation mechanism (7, 12) forcibly separates the circuit board from the stationary member (13), to thereby prevent the occurrence of a state in which the circuit board (2) is stuck to the stationary member.

Abstract: A method for mounting components using mounting heads for which a plurality of suction or mounting operating positions are set for suction nozzles in a state where the mounting head is at rest in a component supply position or component mounting position, it being possible to select any of these operating positions, comprising a first step of selecting a component supply position or component mounting position such that the amount of movement of component feeder holding components to be mounted, or the amount of movement of the substrate to the mounting position for the next component to be mounted becomes a minimum, and moving the component feeder or substrate accordingly; and a second step of selecting a suction nozzle position corresponding to the component suction position or component mounting position in the first step, whilst the mounting head is moving towards the component suction position.

Abstract: A positioning system for a circuit board having a reference positioning hole. The positioning system has a table on which the circuit board is placed and a positioning pin unit. The positioning pin unit has a plurality of nested positioning pins, each having a different pin diameter, and a plurality of springs each supporting at least one of the plurality of nested positioning pins. The circuit board, which is placed on the table, is positioned by inserting into the reference positioning hole that positioning pin having a diameter substantially matching the diameter of the reference positioning hole.

Abstract: A board transfer unit for transferring a printed circuit board on which electronic components are mounted. The board transfer unit has sensors for detecting the length, width, and thickness of the board. The board weight is calculated based on the detected data from the sensors. The board transfer unit also receives information on types of components mounted on the board from a machine in the previous process. Optimal acceleration and deceleration rates are selected from previously prepared data based on the board weight and the types of components mounted in the previous process. Accordingly, the board transfer unit realizes the optimal board transfer corresponding to diversifying board weight and mounting conditions.

Abstract: Provided is a plurality of component supply units (A, B, C) having a component supply table (11) mounted with a plurality of component supply cassettes (1), a rail (12) which reciprocatingly movably guides and supports the component supply table, a base (22) which fixes the rail, a driving member (14) which moves in a direction in which a component determining table moves while being able to be positioned in the base, and a coupling member (13f, 13c, 13r, 16) which can releasably couple the component determining table with the driving member.

Abstract: A component feeding device (1) comprises a first feeder table (7) provided with a plurality of component supply units (6) aligned in parallel rows thereon, and arranged for movement in a direction of the parallel alignment, a second feeder table (8) provided with a plurality of component supply units (6) aligned in parallel rows thereon, and located behind the first feeder table (7), and a transfer unit (9) for receiving and conveying supplementary components from the component supply units (6) on the second feeder table (8) to a predetermined component feeding position. When a certain group of the components on the first feeder table (7) has been exhausted, their new supplies are picked up from the second feeder table (8) by the transfer unit (9), conveyed to the component feeding position, and placed on a board (5), thereby eliminating necessity for providing waiting spaces for feeder tables (7, 8) in a flow direction of boards (5) and increasing productivity with a compact arrangement.

Abstract: A component mounting apparatus which comprises at least first and second component supply assemblies mounted on respective movable tables that are mounted on a common track for movement therealong. The apparatus also comprises at least one positioning device for positioning a printed circuit board on which components are desired to be mounted; at least one component mounting unit for receiving a component at a predetermined position of the component supply assembly and mounting the component onto the support member; and a table moving mechanism which is selectively connectable with one of the first and second movable tables for driving the movable table along the common track.

Abstract: A component mounting method, and an apparatus therefor, which includes the steps of causing a plurality of suction nozzles, supported for intermittent movement along a predetermined path in synchronism with each other, to receive electric components at a component receiving station and then to transport them towards a component mounting station, and effecting both the rectification of the position of each component in two directions perpendicular to each other and the angle adjustment of the respective component during the successive transportation of the components towards the component mounting station. Both the rectification of the position and the angle adjustment of each component are carried out while the associated suction nozzle is held still at a certain station, and electric characteristics of each component are checked during the rectification.

Abstract: In an electronic chip placement machine with test function, there is provided a suction nozzle for holding a chip, a chip-regulation device for regulating the attitude of the chip by clamping the chip at portions having no electrodes probes for testing electrical characteristics of the chip. The tip portion of the suction nozzle is made of an insulating material such as a ceramic or a synthetic resin in order to avoid a short-circuit between electrodes of the chip through the nozzle. Therefore, the electrical characteristics of the chip can be tested without the separation between the nozzle and the chip. Furthermore, since one cycle of the operational process according to the present invention is shorter than that of the conventional operational process, it is possible to provide chip-test and placement machines whose structure is simple. As a result, productivity and durability can also be increased.