Patents by Inventor Makoto Agatani
Makoto Agatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170012189Abstract: A light emitting device (10) includes light emitting elements (12), conductor wirings (14), and alignment marks (18) formed on a substrate (11). The alignment marks (18) and the conductor wirings (14) are formed by printing.Type: ApplicationFiled: September 21, 2016Publication date: January 12, 2017Inventors: Toshio HATA, Makoto AGATANI, Shinya ISHIZAKI, Makoto MATSUDA, Tomokazu NADA, Toyonori UEMURA
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Publication number: 20160353544Abstract: Provided is a light-emitting device that is capable of adjusting color temperature through the supply of electric power from a single power supply. The light-emitting device includes an anode electrode land, a cathode electrode land, and first and second wires through which the anode electrode land and the cathode electrode land are connected to each other. The first wire is higher in electric resistance than the second wire. The color temperature of light that is emitted by a whole light-emitting unit including a first light-emitting unit electrically connected to the first wire and a second light-emitting unit electrically connected to the second wire is adjustable.Type: ApplicationFiled: January 7, 2015Publication date: December 1, 2016Inventors: Nobumasa KANEKO, Tomokazu NADA, Makoto AGATANI, Toshio HATA, Osamu JINUSHI, Yoshiki SOTA, Naveen Venkata Rama DEVISETTI, Kazuaki KANEKO, Hiroaki ONUMA
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Patent number: 9490236Abstract: A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.Type: GrantFiled: October 14, 2015Date of Patent: November 8, 2016Assignee: SHARP KABUSHIKI KAISHAInventors: Makoto Agatani, Toshio Hata, Tomokazu Nada, Shinya Ishizaki
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Patent number: 9484502Abstract: By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.Type: GrantFiled: April 4, 2014Date of Patent: November 1, 2016Assignee: SHARP KABUSHIKI KAISHAInventors: Masahiro Konishi, Makoto Agatani, Toshio Hata
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Patent number: 9484309Abstract: A light emitting device (10) includes light emitting elements (12), conductor wirings (14), and alignment marks (18) formed on a substrate (11). The alignment marks (18) and the conductor wirings (14) are formed by printing.Type: GrantFiled: July 11, 2013Date of Patent: November 1, 2016Assignee: SHARP KABUSHIKI KAISHAInventors: Toshio Hata, Makoto Agatani, Shinya Ishizaki, Makoto Matsuda, Tomokazu Nada, Toyonori Uemura
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Patent number: 9478716Abstract: By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.Type: GrantFiled: March 4, 2015Date of Patent: October 25, 2016Assignee: SHARP KABUSHIKI KAISHAInventors: Masahiro Konishi, Makoto Agatani, Toshio Hata
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Publication number: 20160300882Abstract: A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.Type: ApplicationFiled: June 21, 2016Publication date: October 13, 2016Inventors: Shinya ISHIZAKI, Makoto AGATANI, Tomokazu NADA, Toshio HATA
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Patent number: 9425236Abstract: A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.Type: GrantFiled: March 31, 2015Date of Patent: August 23, 2016Assignee: Sharp Kabushiki KaishaInventors: Shinya Ishizaki, Makoto Agatani, Tomokazu Nada, Toshio Hata
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Publication number: 20160149093Abstract: By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.Type: ApplicationFiled: February 4, 2016Publication date: May 26, 2016Applicant: Sharp Kabushiki KaishaInventors: Masahiro KONISHI, Makoto AGATANI, Toshio HATA
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Patent number: 9341318Abstract: An LED bulb (100) including a light source device (105) provided on a mounting plate (102) and covered by a globe (104) in a shape of a spherical shell is configured such that the light source device (105) includes: a reflecting member (108) in a truncated cone shape; and a plurality of LED chips (15) provided on a top surface of the substrate (11), at least a side face of the reflecting member (108) has a light reflecting function, and the light source device (105) is provided on the mounting plate (102) in such a way that a bottom surface of the substrate (11) faces the mounting plate (102).Type: GrantFiled: December 22, 2014Date of Patent: May 17, 2016Assignee: Sharp Kabushiki KaishaInventors: Toshio Hata, Makoto Agatani, Toyonori Uemura
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Patent number: 9312304Abstract: A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.Type: GrantFiled: February 20, 2015Date of Patent: April 12, 2016Assignee: Sharp Kabushiki KaishaInventors: Shinya Ishizaki, Makoto Agatani, Tomokazu Nada, Toshio Hata
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Publication number: 20160091191Abstract: A light-emitting device (100) is provided with: a light-emitting module (1) in which a light-emitting section (30) is provided on a ceramic substrate (11); a heat sink (2); a holder (4) comprising a ceramic plate (50) for attaching the light-emitting module (1) to the heat sink (2); and a heat-dissipating sheet (3) provided between the ceramic substrate (11) and the heat sink (2).Type: ApplicationFiled: June 9, 2014Publication date: March 31, 2016Inventors: Makoto MATSUDA, Makoto AGATANI
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Publication number: 20160086928Abstract: The light-emitting device of the present invention includes LED chips provided on a ceramic substrate and a sealing material in which the LED chips are embedded. The sealing material contains a fluorescent substance and divided into a first fluorescent-substance-containing resin layer and a second fluorescent-substance-containing resin layer by a first resin ring and a second resin ring.Type: ApplicationFiled: December 2, 2015Publication date: March 24, 2016Inventors: Makoto AGATANI, Toshio HATA, Toyonori UEMURA
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Publication number: 20160035710Abstract: A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.Type: ApplicationFiled: October 14, 2015Publication date: February 4, 2016Inventors: Makoto AGATANI, Toshio HATA, Tomokazu NADA, Shinya ISHIZAKI
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Patent number: 9243791Abstract: A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.Type: GrantFiled: April 2, 2014Date of Patent: January 26, 2016Assignee: SHARP KABUSHIKI KAISHAInventors: Makoto Agatani, Toshio Hata, Tomokazu Nada, Shinya Ishizaki
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Patent number: 9231023Abstract: The light-emitting device of the present invention includes LED chips provided on a ceramic substrate and a sealing material in which the LED chips are embedded. The sealing material contains a fluorescent substance and divided into a first fluorescent-substance-containing resin layer and a second fluorescent-substance-containing resin layer by a first resin ring and a second resin ring.Type: GrantFiled: March 20, 2015Date of Patent: January 5, 2016Assignee: SHARP KABUSHIKI KAISHAInventors: Makoto Agatani, Toshio Hata, Toyonori Uemura
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Patent number: 9188321Abstract: A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.Type: GrantFiled: October 22, 2014Date of Patent: November 17, 2015Assignee: SHARP KABUSHIKI KAISHAInventors: Makoto Agatani, Toshio Hata, Tomokazu Nada, Shinya Ishizaki
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Publication number: 20150276198Abstract: A light-emitting apparatus has a substrate (72) having a generally disc shape, a light-emitting part (76) having a plurality of LED chips (73) mounted on one main surface of the substrate (72), the plurality of LED chips (73) being sealed with a resin (74), and a heat-sink attachment part having a heat-sink attachment male thread (80) formed on a side surface of the substrate (72). When the attachment area of the substrate (72) to the heat sink is kept the same, the light-emitting part (76) may be enlarged, and when the light-emitting unit (76) is kept the same, the attachment area of the substrate (72) may be reduced.Type: ApplicationFiled: October 10, 2013Publication date: October 1, 2015Applicant: SHARP KABUSHIKI KAISHAInventors: Toshio Hata, Makoto Agatani, Tomokazu Nada, Yuhsuke Fujita, Ippei Yamaguchi, Masahiro Konishi
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Patent number: 9093357Abstract: A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.Type: GrantFiled: March 18, 2014Date of Patent: July 28, 2015Assignee: Sharp Kabushiki KaishaInventors: Shinya Ishizaki, Makoto Agatani, Tomokazu Nada, Toshio Hata
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Publication number: 20150207048Abstract: A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.Type: ApplicationFiled: March 31, 2015Publication date: July 23, 2015Inventors: Shinya ISHIZAKI, Makoto AGATANI, Tomokazu NADA, Toshio HATA