Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between a copper foil and a resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having a treated surface having a developed interfacial area ratio Sdr of 0.50% or more and 9.00% or less and a root mean square height Sq of 0.010 ?m or more and 0.200 ?m or less on at least one side, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The Sdr and Sq are values measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 0.55 ?m, and a cutoff wavelength of an L-filter is 10 ?m.

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 ?m thick having a surface having an arithmetic mean waviness Wa of 0.10 ?m or more and 0.25 ?m or less as measured in accordance with JIS B0601-2001 and a kurtosis Sku of 2.0 or more and 3.5 or less as measured in accordance with ISO 25178; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Abstract: There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 ?m thick having a surface having an arithmetic mean waviness Wa of 0.10 ?m or more and 0.25 ?m or less and a valley portion void volume Vvv of 0.010 ?m3/?m2 or more and 0.028 ?m3/?m2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Abstract: There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

Abstract: There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

Abstract: A bonding apparatus according to the present invention relates to a sewing machine (28) which on stitching a connecting flap and a flap to be connected (hereafter referred to as only ‘connected flap’) of one unit, one set of two sheets for a corrugated cardboard box, ensures the folding of the connecting flap and the connected flap, inhibits the blind movement of the position, rectangular in section, of the sheets for the corrugated cardboard box when thread-stitching them, solves the load burdened on a looper mechanism, and provides an appropriate thread-stitching work. The sewing machine (28) comprises a sewing-machine needle mechanism (28b) provided with a sewing-machine needle (28a) and the looper mechanism (28d) having a needle plate (28c).

Abstract: A regulator circuit including an output-stage transistor for supplying a current to an external circuit has an electrostatic protection transistor formed in parallel with the output-stage transistor. The base of the electrostatic protection transistor is connected to, for example, the base of the output-stage transistor, or alternatively to a ground line or to the emitter of the electrostatic protection transistor itself.

Abstract: One object of the present invention is to provide a production method of a steering wheel in which divided bodies are securely integrated into a single unit without using adhesive. In order to achieve the object, the present invention provides a production method of a steering wheel comprising the steps of: a) providing a plurality of divided bodies 6, each of which comprises a surface material 3 and a plastic layer 4 provided on the inside of said surface material 3; b) forming an outer shell 2 by integrally welding said plastic layers 4 of said divided bodies 6; c) providing a core metal 1 to be arranged in said outer shell 2; and d) filling plastic between said outer shell 2 and said core metal 1.

Abstract: One object of the present invention is to provide a production method of a steering wheel in which divided bodies are securely integrated into a single unit without using adhesive. In order to achieve the object, the present invention provides a production method of a steering wheel comprising the steps of: a) providing a plurality of divided bodies 6, each of which comprises a surface material 3 and a plastic layer 4 provided on the inside of said surface material 3; b) forming an outer shell 2 by integrally welding said plastic layers 4 of said divided bodies 6; c) providing a core metal 1 to be arranged in said outer shell 2; and d) filling plastic between said outer shell 2 and said core metal 1.

Abstract: In a region where a light-receiving face of a photodiode is located, when a first interconnection and a second interconnection are patterned, respective layers are removed. After a second interlayer insulating film and a cover insulating film are formed respectively as well, respective layers are removed. On the other hand, a protection insulating film is not removed by etching in the region where the light-receiving face of the photodiode is located, and an antireflection coating is still covered with the protection insulating film. Thus, a semiconductor device attaining reduction in the number of process steps without lowering light reflectivity, as well as an optical device can be obtained.

Abstract: An electronic device, such as a solar cell, having improved moisture, heat, and wear resistance, formed by applying an insulating film over the surfaces of the electronic device utilizing a screen printing process and curing the film with heat.

Abstract: A photosensitive device includes a semiconductor substrate and a first semiconductor layer, both of a first conductivity type, with the semiconductor layer being formed on the semiconductor substrate and having a lower impurity concentration than that of the semiconductor substrate. A second semiconductor layer, of a second conductivity type, is formed on the first semiconductor layer and at least one diffusion layer of the first conductivity type is formed from the surface of the second semiconductor layer so as to reach the surface of the first semiconductor layer. The diffusion layer subdivides the second semiconductor layer into a plurality of semiconductor regions At least one photodiode portion for converting signal light into an electrical signal is formed at a junction between at least one of the plurality of semiconductor regions and the first semiconductor layer.

Abstract: A semiconductor device includes: a photosensitive section essentially composed of a PN junction between a semiconductor multilayer structure of the first conductivity type and a first semiconductor layer of the second conductivity type; and a partitioning portion for splitting the photosensitive section into a plurality of regions. The semiconductor multilayer structure of the first conductivity type includes: a semiconductor substrate of the first conductivity type; a first semiconductor layer of the first conductivity type; and a second semiconductor layer of the first conductivity type. The partitioning portion includes a third semiconductor layer of the first conductivity type extending from the first semiconductor layer of the second conductivity type so as to reach the second semiconductor layer of the first conductivity type.

Abstract: The invention relates to a desired shaped plane type solar cell. The solar cell includes a plurality of photoelectric conversion devices formed by dividing the plane, a plurality of conductive paths for connecting each of the photoelectric conversion devices to each other in series, the conductive path being provided adjacent to the plurality of photoelectric conversion devices, and two drawing electrodes exposed on an opposite surface to a light irradiated surface, the electrodes being connected to two photoelectric conversion devices on both ends of the photoelectric conversion device connected in series.

Abstract: A resin composition for forming an insulating film suitable for fabricating an amorphous silicon solar cell utilizing a flexible substrate, obtained by mixing a first component comprising a polyfunctional isocyanate compound and a polyol based second component comprising polymers or oligomers having reactive hydroxyl groups which react with isocyanate groups to principally form urethane bonds.

Abstract: A semiconductor device using an organic resin substrate, wherein an organic resin coating is provided on the surface of said organic resin substrate and a method for forming the same.

Abstract: A magnetic detecting apparatus including a magnetic sensor for detecting the displacement of a member which is detected by a variation in the voltage, a sampler for sampling the voltage detected by the magnetic sensor at the required period, and a voltage power supplier for supplying the required power supply voltage to the magnetic sensor only while the sampler samples the voltage.

Abstract: In the cylinder-bed type sewing machine of the invention, a cylinder unit is provided. A feed base support, a feed base, and a feed dog which are disposed in the cylinder unit are reciprocally rotated in vertical and lengthwise directions in accordance with movements of a feed lifting rock shaft and a feed lengthwise shaft. The vertical and lengthwise reciprocal movements of the feed base are synthesized so that the feed dog is moved along an arcuate feeding locus. According to the cylinder-bed type sewing machine of the present invention, the peripheral length of the cylinder unit for holding a tubular sewing product which is fitted onto the cylinder unit, and the distance between a throat plate and the left end of the cylinder unit can be reduced as much as possible, and the feed dog can be moved along the arcuate locus. Therefore, a predetermined feeding operation on the sewing product can be conducted surely and smoothly.