Abstract: A composition comprising a compound represented by formula (1): wherein two R1 are the same and each is a fluorine atom or a fluoroalkyl group, and further comprising, based on 100 parts by mass of the compound represented by formula (1), 0.00001 to 1 part by mass of a compound represented by formula (10): wherein R41, R42, R43, and R44 are the same or different and each is a hydrogen atom or an alkyl group, or two of them are optionally linked to each other to form a ring optionally having one or more substituents.

Abstract: A drug inspection apparatus includes an inspection processing portion for collating a photographed image of each drug with drug master data for a dispensed drug group; and determines a normal result when the photographed image is contained in the drug group, as an uncertain result when it is uncertain if the photographed image is a drug in the drug group, and as a result to be confirmed when it is estimated that the photographed image is a drug contained in the drug group, but recommended to be confirmed by a person. The inspection result processor displays the photographed image corresponding to the drug which needs to be confirmed in a first display field that is provided corresponding to each drug which has been identified in the inspection process, on the inspection process screen, and displays the photographed image which has been determined as uncertain, in a second display field.

Abstract: A liquid discharge apparatus includes a storage section including a plurality of walls and storing a liquid in a space surrounded by the plurality of walls, a discharging section that discharges the liquid supplied from the storage section, a first electrode and a second electrode that are provided on a first surface of a first wall among the plurality of walls for detecting a remaining amount of the liquid in the storage section, and a protrusion portion that is provided on a second surface of the first wall opposite to the first surface, in which the protrusion portion is located between the first electrode and the second electrode in a first direction, which is a direction in which the liquid decreases in the storage section.

Abstract: The present disclosure provides, for example, a method that can produce a fluorolactone compound from hexafluoropropylene oxide or the like in a single step. The present disclosure relates to a method for producing a compound represented by formula (1): wherein two R1 are the same and each is a fluorine atom or a fluoroalkyl group, the method comprising step A of reacting a compound represented by formula (2): wherein R1 is as defined above, with a compound represented by formula (3): wherein R31, R32, and R33 are the same or different and each is a hydrogen atom or an alkyl group, or two of them are optionally linked to each other to form a ring optionally having one or more substituents, and a compound represented by formula (4-1) or the like: wherein R41, R42, R43, and R44 are the same or different and each is a hydrogen atom ox an alkyl group, or two of them are optionally linked to each other to form a ring optionally having one or more substituents.

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 ?m thick having a surface having an arithmetic mean waviness Wa of 0.10 ?m or more and 0.25 ?m or less as measured in accordance with JIS B0601-2001 and a kurtosis Sku of 2.0 or more and 3.5 or less as measured in accordance with ISO 25178; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between a copper foil and a resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having a treated surface having a developed interfacial area ratio Sdr of 0.50% or more and 9.00% or less and a root mean square height Sq of 0.010 ?m or more and 0.200 ?m or less on at least one side, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The Sdr and Sq are values measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 0.55 ?m, and a cutoff wavelength of an L-filter is 10 ?m.

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 ?m thick having a surface having an arithmetic mean waviness Wa of 0.10 ?m or more and 0.25 ?m or less as measured in accordance with JIS B0601-2001 and a kurtosis Sku of 2.0 or more and 3.5 or less as measured in accordance with ISO 25178; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Abstract: There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 ?m thick having a surface having an arithmetic mean waviness Wa of 0.10 ?m or more and 0.25 ?m or less and a valley portion void volume Vvv of 0.010 ?m3/?m2 or more and 0.028 ?m3/?m2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Abstract: There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

Abstract: There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

Abstract: A bonding apparatus according to the present invention relates to a sewing machine (28) which on stitching a connecting flap and a flap to be connected (hereafter referred to as only ‘connected flap’) of one unit, one set of two sheets for a corrugated cardboard box, ensures the folding of the connecting flap and the connected flap, inhibits the blind movement of the position, rectangular in section, of the sheets for the corrugated cardboard box when thread-stitching them, solves the load burdened on a looper mechanism, and provides an appropriate thread-stitching work. The sewing machine (28) comprises a sewing-machine needle mechanism (28b) provided with a sewing-machine needle (28a) and the looper mechanism (28d) having a needle plate (28c).

Abstract: A regulator circuit including an output-stage transistor for supplying a current to an external circuit has an electrostatic protection transistor formed in parallel with the output-stage transistor. The base of the electrostatic protection transistor is connected to, for example, the base of the output-stage transistor, or alternatively to a ground line or to the emitter of the electrostatic protection transistor itself.

Abstract: One object of the present invention is to provide a production method of a steering wheel in which divided bodies are securely integrated into a single unit without using adhesive. In order to achieve the object, the present invention provides a production method of a steering wheel comprising the steps of: a) providing a plurality of divided bodies 6, each of which comprises a surface material 3 and a plastic layer 4 provided on the inside of said surface material 3; b) forming an outer shell 2 by integrally welding said plastic layers 4 of said divided bodies 6; c) providing a core metal 1 to be arranged in said outer shell 2; and d) filling plastic between said outer shell 2 and said core metal 1.

Abstract: One object of the present invention is to provide a production method of a steering wheel in which divided bodies are securely integrated into a single unit without using adhesive. In order to achieve the object, the present invention provides a production method of a steering wheel comprising the steps of: a) providing a plurality of divided bodies 6, each of which comprises a surface material 3 and a plastic layer 4 provided on the inside of said surface material 3; b) forming an outer shell 2 by integrally welding said plastic layers 4 of said divided bodies 6; c) providing a core metal 1 to be arranged in said outer shell 2; and d) filling plastic between said outer shell 2 and said core metal 1.

Abstract: In a region where a light-receiving face of a photodiode is located, when a first interconnection and a second interconnection are patterned, respective layers are removed. After a second interlayer insulating film and a cover insulating film are formed respectively as well, respective layers are removed. On the other hand, a protection insulating film is not removed by etching in the region where the light-receiving face of the photodiode is located, and an antireflection coating is still covered with the protection insulating film. Thus, a semiconductor device attaining reduction in the number of process steps without lowering light reflectivity, as well as an optical device can be obtained.

Abstract: An electronic device, such as a solar cell, having improved moisture, heat, and wear resistance, formed by applying an insulating film over the surfaces of the electronic device utilizing a screen printing process and curing the film with heat.

Abstract: A photosensitive device includes a semiconductor substrate and a first semiconductor layer, both of a first conductivity type, with the semiconductor layer being formed on the semiconductor substrate and having a lower impurity concentration than that of the semiconductor substrate. A second semiconductor layer, of a second conductivity type, is formed on the first semiconductor layer and at least one diffusion layer of the first conductivity type is formed from the surface of the second semiconductor layer so as to reach the surface of the first semiconductor layer. The diffusion layer subdivides the second semiconductor layer into a plurality of semiconductor regions At least one photodiode portion for converting signal light into an electrical signal is formed at a junction between at least one of the plurality of semiconductor regions and the first semiconductor layer.