Patents by Inventor Makoto Hosokawa

Makoto Hosokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5427961
    Abstract: A semiconductor device using an organic resin substrate, wherein an organic resin coating is provided on the surface of said organic resin substrate and a method for forming the same.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: June 27, 1995
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Akemi Takenouchi, Makoto Hosokawa, Yasuyuki Arai, Setsuo Nakajima
  • Patent number: 5192991
    Abstract: A polycrystalline semiconductor device and a method of manufacturing the device are disclosed. An amorphous semiconductor film is deposited on a glass substrate and given thermal treatment at a crystallization temperature of 600.degree. C. or lower to form a polycrystalline photoconductive strucutre. The substrate is made from a material having the property of contracting at a percentage different than the semiconductor film by 10% or less, the contraction being caused by the thermal treatment.
    Type: Grant
    Filed: September 24, 1991
    Date of Patent: March 9, 1993
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Makoto Hosokawa