Abstract: A robot system includes a first robot and a second robot, and the second robot has a base, a shaft provided translationally along an axis direction of a first axis on the base, and an arm provided rotatably with respect to the shaft, and the first robot can perform work on a work object that can be carried by the second robot.

Abstract: A transport jig includes: a frame member; and a support section that is installed on the frame member and that supports a plurality of elongated members. The elongated members are each entirely housed inside the frame member in a lengthwise direction and the support section supports the plurality of elongated members in parallel with one another in one direction.

Abstract: To facilitate mounting of a second member on a first member having a plate shape while the first member is supported in a state of being deformable due to gravity. A method for manufacturing a component includes: a step (S13) where a supporting robot supports a skin having a plate shape in a state where the skin is deformable due to gravity, and a support state of the skin is changed based on teaching data based on a deformed shape of the skin, which is recorded in advance in a storage unit and which is obtained at the time of mounting a frame on the skin; and a step (S15) where a mounting robot makes the frame overlap with the skin where a support state is changed.

Abstract: A component production method includes: a step of binding a long frame by a plurality of support devices arranged along the frame; a step of measuring, with a distance sensor, a distance to the frame supported by the plurality of support devices; a step in which, based on frame shape data prerecorded in a memory, the support devices move support positions where the frame is supported so that a calculated radial position of the frame being supported by the support devices matches the data about the frame shape; a step of fixing the frame in a state in which the data about the frame shape matches the radial position of the frame; and a step of performing a hole-making operation on the fixed frame.

Abstract: A component manufacturing method includes a step in which a robot for attachment gripping a long frame presses the frame against a tabular skin and a step in which, in a state in which the frame is pressed against the skin, a robot for riveting gripping a first rivet inserts the first rivet into a first through-hole formed in the skin and a second through-hole formed in the frame. In the step, the robot for riveting changes a position in the gripped first rivet in a direction perpendicular to an axial direction of the first rivet according to a force received by the first rivet from the skin or the frame.

Abstract: A component manufacturing method includes a step of calculating, for a plurality of keyholes formed on a skin and disposed in a row along a first axial direction on the skin, a first imaginary line that passes an average position in a second axial direction perpendicular to the first axial direction and is parallel to the first axial direction, a step of calculating, for a plurality of keyholes formed on a frame and disposed in a row along a third axial direction on the frame, a second imaginary line that passes an average position in a fourth axial direction perpendicular to the third axial direction and is parallel to the third axial direction, and a step of superimposing the skin and the frame such that the first imaginary line and the second imaginary line coincide.

Abstract: A side view type surface mounted light-emitting device includes a submount substrate that includes a mounting surface on one side surface and end through-holes formed at both edges of the mounting surface, a light-emitting element mounted on the submount substrate, first and second flat terminals formed on the mounting surface, and first and second through-hole terminals respectively formed on inner surfaces of the end through-holes at both edges of the mounting surface. At least one of the first flat terminal and the first through-hole terminal is electrically connected to one of n-side and p-side electrodes of the light-emitting element, and at least one of the second flat terminal and the second through-hole terminal is electrically connected to the other of the n-side and p-side electrodes of the light-emitting element.

Abstract: A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.

Abstract: A robot system includes a first robot and a second robot, and the second robot has a base, a shaft provided translationally along an axis direction of a first axis on the base, and an arm provided rotatably with respect to the shaft, and the first robot can perform work on a work object that can be carried by the second robot.

Abstract: A light source includes: a mounting substrate; and a side-view type light-emitting device including: a substrate; through holes; a front electrode; a rear electrode; side electrodes; and a light-emitting element, wherein: land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted “T” shape composed of a narrow region and a wide region; the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

Abstract: A light source includes: a mounting substrate; and a side-view type light-emitting device including: a substrate; through holes; a front electrode; a rear electrode; side electrodes; and a light-emitting element, wherein: land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted “T” shape composed of a narrow region and a wide region; the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

Abstract: Segments are linked in the circumferential direction to assemble a pipe unit, which is linked to another pipe unit in the pipe-length direction to assemble a rehabilitation pipe inside an existing pipe. Before the pipe unit is assembled or after the pipe unit has been assembled, a spacer is attached to the segment using a spacer holder to prevent the spacer from falling down from the segment. The pipe unit having the spacer attached to the segment is linked to the pipe units that have already been linked. The rehabilitation pipe is positioned relative to the existing pipe using the spacer that is attached to the segment. A filler is injected between the positioned rehabilitation pipe and the existing pipe.

Abstract: A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.

Abstract: A spacer is inserted into a space between an existing pipe and a rehabilitating pipe to adjust a position of the rehabilitating pipe with respect to the existing pipe. The spacer has an elongated shape with both end portions in a longitudinal direction thereof cut off at an oblique angle and has a transverse width increasing gradually from an upper surface portion to a bottom surface portion. A space is formed in the bottom surface portion to correspond to a shape of the upper surface portion, thereby allowing a number of the spacers to be stacked on one another in a thickness direction thereof. The upper surface portion has a flat-plate shape with a flat rectangular surface region.

Abstract: A monitoring device includes a filtering section that extracts and outputs at least one of a high frequency component or a low frequency component of a beam current received from a detection output section of an ion implantation device; and a computation section that computes at least one of a value corresponding to a content ratio of the high frequency component in the beam current, or a value corresponding to a content ratio of the low frequency component in the beam current.

Abstract: A side view type surface mounted light-emitting device includes a submount substrate that includes a mounting surface on one side surface and end through-holes formed at both edges of the mounting surface, a light-emitting element mounted on the submount substrate, first and second flat terminals formed on the mounting surface, and first and second through-hole terminals respectively formed on inner surfaces of the end through-holes at both edges of the mounting surface. At least one of the first flat terminal and the first through-hole terminal is electrically connected to one of n-side and p-side electrodes of the light-emitting element, and at least one of the second flat terminal and the second through-hole terminal is electrically connected to the other of the n-side and p-side electrodes of the light-emitting element.

Abstract: Segments are linked in the circumferential direction to assemble a pipe unit, which is linked to another pipe unit in the pipe-length direction to assemble a rehabilitation pipe inside an existing pipe. Before the pipe unit is assembled or after the pipe unit has been assembled, a spacer is attached to the segment using a spacer holder to prevent the spacer from falling down from the segment. The pipe unit having the spacer attached to the segment is linked to the pipe units that have already been linked. The rehabilitation pipe is positioned relative to the existing pipe using the spacer that is attached to the segment. A filler is injected between the positioned rehabilitation pipe and the existing pipe.

Abstract: An existing pipe that is to be rehabilitated has concavely curved portions and straight portions as viewed in cross-section orthogonal to the longitudinal direction of the existing pipe. For pipe rehabilitation at the curved portion of the existing pipe, a plurality of rectangular parallelepiped segments whose inner surface plate, side plates and end plates are all rectangular are used. A spacer is interposed between the end plates of the rectangular parallelepiped segments. The spacer has first and second contact surfaces that are inclined relative to each other and come into contact with the end plates of the rectangular parallelepiped segments when they are linked in the circumferential direction.

Abstract: A piezoelectric element includes a substrate having a first surface with a predetermined orientation; a lower electrode layered on the first surface of the substrate; a piezoelectric thin film layered on the lower electrode and having a piezoelectric body; and an upper electrode layered on the piezoelectric thin film. A voltage is to be impressed between the lower electrode and the upper electrode to deform the piezoelectric thin film. The piezoelectric thin film is epitaxially grown on the lower electrode using a physical vapor deposition or a chemical vapor deposition.