Patents by Inventor Makoto Ishida
Makoto Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090065894Abstract: An electronic circuit device comprises a silicon substrate having front and rear surfaces, a semiconductor element formed on the front surface, and at least one through-hole penetrating through the front surface and the rear surface. At least one passive element is supported by the silicon substrate. At least one connecting element is disposed in the through-hole of the silicon substrate for electrically connecting the semiconductor element to the passive element.Type: ApplicationFiled: October 23, 2008Publication date: March 12, 2009Inventors: Makoto Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo
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Patent number: 7465915Abstract: A method for measuring incident light employing a simple semiconductor structure provided with a single electron-capturing section corresponding to incident light, and a sensor having a spectroscopic mechanism employing the same are provided. A spectroscopic sensor includes a semiconductor substrate (1), a first diffusion layer (2) provided on the semiconductor substrate (1), a second diffusion layer (3)provided at a part of the first diffusion layer (2), and an electrode (7)film provided on the first diffusion layer (2) with an insulating film (4) provided therebetween, the electrode film (7) transmitting the incident light and being applied with a gate voltage. In the spectroscopic sensor, the gate voltage is varied, the depth (position) for capturing electrons generated in the first diffusion layer (2) by the incident light is varied so as to correspond to the gate voltage, and a current indicating the quantity of the electrons is measured.Type: GrantFiled: March 25, 2004Date of Patent: December 16, 2008Assignee: Japan Science and Technology AgencyInventors: Kazuaki Sawada, Makoto Ishida, Yuki Maruyama, Hideki Muto
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Publication number: 20080113685Abstract: The present invention relates to finger authentication and improves a fingerprint authenticating function by excluding errors caused depending on detection forms. When a fingerprint is detected, form data representing the detection form are captured and, when inputted fingerprint data are compared with registered fingerprint data, authentication is executed referring to the form data. Thereby, the errors caused depending on the detection forms can be excluded and the fingerprint authenticating function is improved. A plurality of different detection form of fingerprint data are registered, a comparison target is selected from the fingerprint data, and the comparison target is compared with the inputted fingerprint data. Thereby, the fingerprint authenticating function is improved.Type: ApplicationFiled: June 21, 2006Publication date: May 15, 2008Applicant: FUJITSU LIMITEDInventors: Makoto Ishida, Toshinori Yoshitsuru
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Publication number: 20080105320Abstract: Integrally formed plastic segments comprising an inner surface plate constituting an inner peripheral surface and lateral plates vertically arranged on an edge part of the inner surface plate extending in a circumferential direction are coupled in a circumferential direction to assemble pipe units 10, 10?. The pipe units are coupled sequentially in the longitudinal direction of a pipe, and a rehabilitating pipe is laid down in an existing pipeline. When an existing pipe 21 is bent, the pipe units are coupled at a bending part 21b in the longitudinal direction of the pipe via coupling members so that central axes X1, X2 of the pipes are angled toward each other to create a bend. A gap formed between the pipe units at the bent part is covered by a cladding. Such a configuration enables a rehabilitating pipe to be watertight and resistant to external forces.Type: ApplicationFiled: October 21, 2005Publication date: May 8, 2008Applicant: SHONAN GOSEI-JUSHI SEISAKUSHO K.K.Inventors: Takao Kamiyama, Koji Kaneta, Kenji Fujii, Katsuyori Miura, Makoto Ishida, Takeshi Hasegawa, Yoichi Nakamura
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Patent number: 7341280Abstract: A rehabilitating pipe is assembled inside an existing pipe using segments to repair the existing pipe. A coupling member is inserted through a segment when it is coupled in the longitudinal direction to another segment coupled already, and the coupling member is joined to the coupling member of another segment already coupled. During joining the segment is clamped against another segment and both the segments are coupled in the longitudinal direction. Such steps are repeated to couple other segments to segments already coupled until the rehabilitating pipe is laid to a predetermined length.Type: GrantFiled: January 7, 2005Date of Patent: March 11, 2008Assignee: Shonan Gosei-Jushi Seisakusho K.K.Inventors: Takao Kamiyama, Koji Kaneta, Kenji Fujii, Takeshi Hasegawa, Makoto Ishida
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Publication number: 20080054625Abstract: A segment (1) is an integrally formed plastic unit comprising an inner-surface plate constituting an inner circumferential surface and lateral plates and end plates that are vertically arranged on a rim of the inner-surface plate. The segments are linked in a circumferential direction and in a pipe length direction to construct the rehabilitating pipe. A pipe unit (10) is made from segments linked in the circumferential direction. A band (30) is attached for encircling the outer circumference of the pipe unit and restraining same. A fastening force is produced on the band by a metal fastener, and the pipe unit is restrained in a fastened state by the band. Therefore, the pipe unit does not readily deform due to external forces, and the strength of the rehabilitating pipe itself can be increased.Type: ApplicationFiled: August 17, 2005Publication date: March 6, 2008Applicant: SHONAN GOSEI-JUSHI SEISAKUSHO K.K.Inventors: Takao Kamiyama, Koji Kaneta, Kenji Fujii, Makoto Ishida, Yoichi Nakamura
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Patent number: 7322382Abstract: A segment for a rehabilitating pipe is coupled to another segment in the circumferential and longitudinal directions of a rehabilitating pipe to rehabilitate an existing pipe. The segment has on one coupling surface a protruding part and a recessed part continuous with the protruding part and on another coupling surface a recessed part and a protruding part whose shapes respectively conform to the protruding part and the recessed part of one coupling surface. The protruding part and the recessed part of one coupling surface of one segment is brought into tight surface contact with the recessed part and protruding part of another coupling surface of another segment and interfitted thereto when one and another segments are mutually coupled in the circumferential and longitudinal directions of the rehabilitating pipe.Type: GrantFiled: February 22, 2005Date of Patent: January 29, 2008Assignee: Shonan Gosei-Jushi Seisakusho K.K.Inventors: Takao Kamiyama, Koji Kaneta, Kenji Fujii, Makoto Ishida
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Publication number: 20070228391Abstract: A light emitting device has an LED (light emitting diode) element, and a power feeding member through which electrical power is fed to the LED element, the power feeding member comprising an electrically conductive material. The power feeding member has a light reflecting layer formed on the surface of the power feeding member, the light reflecting layer being formed of a metal, and a protecting layer formed on the surface of the light reflecting layer, the protecting layer being formed of an organic compound.Type: ApplicationFiled: March 26, 2007Publication date: October 4, 2007Applicant: TOYODA GOSEI CO., LTD.Inventors: Yukimura Minami, Makoto Ishida
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Patent number: 7270875Abstract: A gland packing characterized in that a water swelling mineral is stuck or impregnated into a surface or an inner part of a gland packing base material. The water swelling mineral is preferably water swelling mica. This gland packing substantially eliminates seizing and can exhibit an excellent sealing property even if the amount of leakage of an internal fluid or injected fluid for lubrication on a sliding surface is lessened as compared with a conventional example.Type: GrantFiled: November 20, 2003Date of Patent: September 18, 2007Assignee: Nippon Valqua Industries, Ltd.Inventors: Makoto Ishida, Kazumasa Takiteru
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Publication number: 20060278907Abstract: A semiconductor element, a semiconductor sensor, and a semiconductor memory element are provided, in which an MFMIS structure having a lower electrode and an integrated circuit can be integrated. An epitaxially grown ?-Al2O3 single crystal film (2) is disposed on a semiconductor single crystal substrate (1), and an epitaxial single crystal Pt thin film (3) is disposed on the ?-Al2O3 single crystal film (2).Type: ApplicationFiled: March 5, 2004Publication date: December 14, 2006Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCYInventors: Makoto Ishida, Kazuaki Sawada, Daisuke Akai, Mikako Yokawa, Keisuke Hirabayashi
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Publication number: 20060244089Abstract: A method for measuring incident light employing a simple semiconductor structure provided with a single electron-capturing section corresponding to incident light, and a sensor having a spectroscopic mechanism employing the same are provided. A spectroscopic sensor includes a semiconductor substrate (1), a first diffusion layer (2) provided on the semiconductor substrate (1), a second diffusion layer (3) provided at a part of the first diffusion layer (2), and an electrode film (7) provided on the first diffusion layer (2) with an insulating film (4) provided therebetween, the electrode film (7) transmitting the incident light and being applied with a gate voltage. In the spectroscopic sensor, the gate voltage is varied, the depth (position) for capturing electrons generated in the first diffusion layer (2) by the incident light is varied so as to correspond to the gate voltage, and a current indicating the quantity of the electrons is measured.Type: ApplicationFiled: March 25, 2004Publication date: November 2, 2006Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCYInventors: Kazuaki Sawada, Makoto Ishida, Yuki Maruyama, Hideki Muto
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Patent number: 7026618Abstract: A highly-sensitive, pyroelectric infrared sensing method and apparatus that can detect infrared temperature with high sensitivity throughout the entire electromagnetic wave range including millimeter waves and radioactive rays. The supersensitive infrared sensor is an infrared sensor of a type that emits electrons from a surface of a ferroelectric body having no emitter. Therefore, a gate electrode is not required to be provided in the vicinity of an emitter. Accordingly, since electrons are emitted directly from a PZT thin film, which serves as a ferroelectric body, in proportion to a temperature variation caused by irradiation of an infrared ray, only provision of an anode is required. Further, designation of machining conditions of the surface of the ferroelectric body is unnecessary.Type: GrantFiled: May 16, 2001Date of Patent: April 11, 2006Assignee: Japan Science and Technology CorporationInventors: Kazuaki Sawada, Makoto Ishida
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Patent number: 7017613Abstract: A segment is coupled to additional segments to constitute a rehabilitating pipe for repairing an existing pipe. The segment comprises an inner plate that defines the inner circumferential surface of the rehabilitating pipe and has an opening therein for performing the work of mutually coupling the segments in the circumferential direction of the rehabilitating pipe, and a cover that is fitted into the opening from the bottom surface side of the inner plate. To fix the cover to the inner plate, the cover is provided with a projection and with an engaging member that is movable between non-engaging and engaging positions. The cover is fitted into the opening with the projection into engagement with the inner plate on one side edge of the opening and the engaging member is then brought into engagement with the inner plate on the other side edge thereof, thereby fixing the cover to the inner plate to plug the opening thereof.Type: GrantFiled: February 9, 2005Date of Patent: March 28, 2006Assignee: Shonan Gosei-Jushi Seisakusho K.K.Inventors: Katsuyori Miura, Makoto Ishida, Koji Kaneta, Kenji Fujii, Takao Kamiyama
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Patent number: 7011312Abstract: To provide a novel gland packing and a sealing apparatus comprising this, wherein the gland packing displays high and stable sealability for a stem and an inner wall surface of a stuffing box even for uses further requesting the movability (rotation and reciprocating movement), and further, gives excellent effects, such as decrease of moving resistance of a stem, shape stability, adaptability to a corroded and worn-out stem and stuffing box, function for receiving shafts, easiness of equipment, simplification of sealing structure, and compactness of a sealing apparatus.Type: GrantFiled: September 24, 2002Date of Patent: March 14, 2006Assignee: Nippon Valqua Industries, Ltd.Inventor: Makoto Ishida
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Publication number: 20060012126Abstract: A gland packing characterized in that a water swelling mineral is stuck or impregnated into a surface or an inner part of a gland packing base material. The water swelling mineral is preferably water swelling mica. This gland packing substantially eliminates seizing and can exhibit an excellent sealing property even if the amount of leakage of an internal fluid or injected fluid for a lubrication on a sliding surface is lessened as compared with a conventional example.Type: ApplicationFiled: November 20, 2003Publication date: January 19, 2006Applicant: NIPPON VALQUA INDUSTRIES LTD.Inventors: Makoto Ishida, Kazumasa Takiteru
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Publication number: 20060001258Abstract: A segment for a rehabilitating pipe is coupled to another segment in the circumferential and longitudinal directions of a rehabilitating pipe to rehabilitate an existing pipe. The segment has on one coupling surface a protruding part and a recessed part continuous with the protruding part and on another coupling surface a recessed part and a protruding part whose shapes respectively conform to the protruding part and the recessed part of one coupling surface. The protruding part and the recessed part of one coupling surface of one segment is brought into tight surface contact with the recessed part and protruding part of another coupling surface of another segment and interfitted thereto when one and another segments are mutually coupled in the circumferential and longitudinal directions of the rehabilitating pipe.Type: ApplicationFiled: February 22, 2005Publication date: January 5, 2006Inventors: Takao Kamiyama, Koji Kaneta, Kenji Fujii, Makoto Ishida
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Publication number: 20050233518Abstract: An electronic circuit device having a silicon substrate is provided comprising: a silicon substrate having a semiconductor element and a recess; and at least one passive element which is formed by a process different from a silicon planar process by which the semiconductor element is formed. In the electronic circuit device, the passive element is entrenched in the recess of the silicon substrate, and the semiconductor element formed on the silicon substrate is electrically connected to the passive element.Type: ApplicationFiled: March 30, 2005Publication date: October 20, 2005Inventors: Makoto Ishida, Kazuaki Sawada, Hidekuni Takao, Minoru Sudo
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Publication number: 20050231632Abstract: An image-taking device that takes an image of an object under an external light source comprises: an illuminating section 170 that emits a light to the object; a camera 110 that takes an image of the object and outputs acquired image information; a filter section 130 that extracts a fluctuation component caused by an external light source based on a signal obtained by smoothing the brightness of the image information; a light amount control section 140 that controls the light amount of the illuminating section 170 so that the fluctuation component is corrected, based on a signal obtained by reversing the fluctuation component.Type: ApplicationFiled: June 14, 2005Publication date: October 20, 2005Applicant: FUJITSU LIMITEDInventors: Kenichi Sekikawa, Makoto Ishida
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Publication number: 20050229986Abstract: A segment is coupled to another segment in the circumferential and longitudinal directions to assemble a rehabilitating pipe for rehabilitating an existing pipe. The segment is provided with a recessed part in a coupling surface in the longitudinal direction at a portion that is brought into contact with the bottom surface of the existing pipe when the rehabilitating pipe is laid inside the existing pipe. When the segments are coupled in the longitudinal direction of the rehabilitating pipe, the recessed part forms a gap between the coupling surfaces to provide a space for accommodating waste existing on the bottom surface of the existing pipe, thus enabling the coupling work in the longitudinal direction to be performed simply and in a short period of time because it is unnecessary to remove the waste.Type: ApplicationFiled: February 16, 2005Publication date: October 20, 2005Inventors: Takao Kamiyama, Koji Kaneta, Kenji Fujii, Makoto Ishida
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Publication number: 20050225088Abstract: A rehabilitating pipe is assembled inside an existing pipe using segments to repair the existing pipe. A coupling member is inserted through a segment when it is coupled in the longitudinal direction to another segment coupled already, and the coupling member is joined to the coupling member of another segment already coupled. During joining the segment is clamped against another segment and both the segments are coupled in the longitudinal direction. Such steps are repeated to couple other segments to segments already coupled until the rehabilitating pipe is laid to a predetermined length.Type: ApplicationFiled: January 7, 2005Publication date: October 13, 2005Inventors: Takao Kamiyama, Koji Kaneta, Kenji Fujii, Takeshi Hasegawa, Makoto Ishida