Patents by Inventor Makoto Isozaki

Makoto Isozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210066146
    Abstract: A semiconductor device, including a substrate having an insulating plate and a conductive plate formed on the insulating plate, a semiconductor chip formed on the conductive plate, a contact part arranged on the conductive plate with a bonding member therebetween, a rod-shaped external connection terminal having a lower end portion thereof fitted into the contact part, and a lid plate having a front surface and a back surface facing the substrate. An insertion hole pierces the lid plate, forming an entrance and exit respectively on the back and front surfaces of the lid plate. The external connection terminal is inserted in the insertion hole. The semiconductor device has at least one of a guide portion with an inclined surface, fixed to a portion of the external connection terminal located in the insertion hole, or an inclined inner wall of the insertion hole.
    Type: Application
    Filed: June 23, 2020
    Publication date: March 4, 2021
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Makoto ISOZAKI
  • Publication number: 20200286807
    Abstract: A semiconductor device, including a first conductive portion including a first conducting region and a first wiring region communicating with the first conducting region via a first communicating portion, a second conductive portion including a second conducting region and a second wiring region that communicates with the second conducting region via a second communicating portion and that faces the first wiring region with a prescribed space therebetween, and a wiring member electrically connecting the first wiring region and the second wiring region in a wiring direction. The first communicating portion and the second communicating portion are separate from each other when viewed from the wiring direction.
    Type: Application
    Filed: May 26, 2020
    Publication date: September 10, 2020
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Makoto ISOZAKI, Seiichi TAKAHASHI
  • Patent number: 10199314
    Abstract: A flange on first open end of a tubular contact member is soldered to a conductive plate of an insulating substrate. An external electrode terminal is fitted into a main body tube portion of the tubular contact member. The tubular contact member includes a protrusion that protrudes inwardly from an inner wall of the main body tube portion. The protrusion is disposed along the entire perimeter of inner wall toward the first open end. The protrusion has a thickness deformation of the protrusion by a load applied thereto when the external electrode terminal is pressed into the main body tube portion. The protrusion is disposed at a height that can block solder that climbs the inner wall of the main body tube portion, to form a gap between the protrusion and a lower end of the external electrode terminal inserted to a predetermined depth of the main body tube portion.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: February 5, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Kenshi Kai, Rikihiro Maruyama, Makoto Isozaki
  • Publication number: 20160343647
    Abstract: A flange on first open end of a tubular contact member is soldered to a conductive plate of an insulating substrate. An external electrode terminal is fitted into a main body tube portion of the tubular contact member. The tubular contact member includes a protrusion that protrudes inwardly from an inner wall of the main body tube portion. The protrusion is disposed along the entire perimeter of inner wall toward the first open end. The protrusion has a thickness deformation of the protrusion by a load applied thereto when the external electrode terminal is pressed into the main body tube portion. The protrusion is disposed at a height that can block solder that climbs the inner wall of the main body tube portion, to form a gap between the protrusion and a lower end of the external electrode terminal inserted to a predetermined depth of the main body tube portion.
    Type: Application
    Filed: April 5, 2016
    Publication date: November 24, 2016
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Kenshi KAI, Rikihiro MARUYAMA, Makoto ISOZAKI
  • Patent number: 9406633
    Abstract: A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module includes a cylindrical portion; a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion and having a diameter larger than an external diameter of the cylindrical portion. An end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange. The cylindrical portion includes a cut-out portion at an inner side of a lower end thereof.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: August 2, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Makoto Isozaki
  • Publication number: 20150340333
    Abstract: A contact component adapted to be soldered onto a metal region provided on an insulating substrate of a semiconductor module includes a cylindrical portion; a hollow hole for fitting an external terminal; and a flange formed at a lower end portion of the cylindrical portion and having a diameter larger than an external diameter of the cylindrical portion. An end face of the flange adapted to be soldered includes a flat bottom surface and a concave portion extending from an inner circumference edge of the cylindrical portion in the flat bottom surface to an outer circumference edge of the flange. The cylindrical portion includes a cut-out portion at an inner side of a lower end thereof.
    Type: Application
    Filed: August 4, 2015
    Publication date: November 26, 2015
    Inventor: Makoto ISOZAKI
  • Patent number: D693477
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: November 12, 2013
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D694307
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: November 26, 2013
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D698845
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: February 4, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D698846
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: February 4, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D699278
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: February 11, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D699724
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: February 18, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D709120
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: July 15, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D709543
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: July 22, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D711953
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: August 26, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D740434
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: October 6, 2015
    Assignee: GE HEALTHCARE BIO-SCIENCES AB
    Inventor: Makoto Isozaki
  • Patent number: D747764
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: January 19, 2016
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D798903
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: October 3, 2017
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D807360
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: January 9, 2018
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki
  • Patent number: D915491
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: April 6, 2021
    Assignee: FUJIFILM Corporation
    Inventor: Makoto Isozaki