Abstract: According to an embodiment, an encoder system includes an encoder and an interface. The encoder detects the position and speed of a motor, and generates A-, B- and Z-phase signals. The interface includes an AB waveform recognition circuitry to recognize a waveform of an AB phase, a Z waveform recognition circuitry to recognize a period of an enable state of a Z phase, a starting point storage device to store a value of the AB phase when the Z phase changes and stores an AB-phase change pattern, a starting point recognition circuitry to generate an interrupt signal, and a rotation angle counter to start a new count of the rotation angle of the motor.

Abstract: According to one embodiment, a supervisory circuit includes a trigger determination circuit and a trigger table. The trigger determination circuit receives signal processing signals outputted from a plurality of signal processing circuits as trigger signals, determines whether processing operations by the signal processing circuits are executed in a predetermined order, and outputs an interrupt signal when detecting a trigger signal out of setting. The trigger table is provided with trigger-specific tables corresponding to the respective signal processing circuits, reads a trigger setting to occur next based on a trigger determined as being correct by the trigger determination circuit, and outputs a table read signal to the trigger determination circuit.

Abstract: According to an embodiment, an encoder system includes an encoder and an interface. The encoder detects the position and speed of a motor, and generates A-, B- and Z-phase signals. The interface includes an AB waveform recognition circuitry to recognize a waveform of an AB phase, a Z waveform recognition circuitry to recognize a period of an enable state of a Z phase, a starting point storage device to store a value of the AB phase when the Z phase changes and stores an AB-phase change pattern, a starting point recognition circuitry to generate an interrupt signal, and a rotation angle counter to start a new count of the rotation angle of the motor.

Abstract: According to one embodiment, a shared FIFO device includes a write pointer control circuit, a read pointer control circuit, a write pointer selection circuit, a read pointer selection circuit, a selection circuit, and a memory array. The shared FIFO device performs FIFO access through n transfer routes (where n is an integer of 2 or greater).

Abstract: According to one embodiment, a supervisory circuit includes a trigger determination circuit and a trigger table. The trigger determination circuit receives signal processing signals outputted from a plurality of signal processing circuits as trigger signals, determines whether processing operations by the signal processing circuits are executed in a predetermined order, and outputs an interrupt signal when detecting a trigger signal out of setting. The trigger table is provided with trigger-specific tables corresponding to the respective signal processing circuits, reads a trigger setting to occur next based on a trigger determined as being correct by the trigger determination circuit, and outputs a table read signal to the trigger determination circuit.

Abstract: A method for manufacturing an image display device includes the steps of preparing a plurality of spacers preliminarily, measuring heights of the plurality of spacers prepared by the preparing step individually, and deciding an order of arranging the spacers on the basis of the measured heights obtained in the measuring step. The spacers are arranged in the order decided in the deciding step.

Abstract: To prevent breakage of a membrane probe during a probe test using a probe card having the membrane probe, appearance of a main surface of a wafer as a test object is tested by an appearance tester 51, and results of bad appearance such as adhesion of a foreign substance to the main surface of the wafer and abnormality in shape of bump electrodes over the main surface of the wafer are collected as wafer map data according to arrangement of respective chips in a plane of the wafer, then the wafer map data are transmitted to a probe tester 53 via a server 52, and the probe tester 53 omits the probe test for chips in which bad appearance was detected, and concurrently performs the probe test to other chips in which bad appearance was not detected, based on the wafer map data.

Abstract: A method for manufacturing an image display device includes the steps of preparing a plurality of spacers preliminarily, measuring heights of the plurality of spacers prepared by the preparing step individually, and deciding an order of arranging the spacers on the basis of the measured heights obtained in the measuring step. The spacers are arranged in the order decided in the deciding step.

Abstract: A method manufactures an image display device including a rear plate having a plurality of electron emitting devices arranged thereon, a face plate arranged opposite the rear plate, an outer frame arranged between the rear plate and the face plate and supporting peripherals of the rear plate and the face plate, and a plurality of spacers arranged between the face plate and the rear plate. The method includes the steps of preparing the plurality of spacers preliminarily, measuring heights of the plurality of spacers prepared by the preparing step individually, deciding an order of arranging the spacers on the basis of the measured heights obtained in the measuring step, and arranging the spacers in the order decided in the deciding step.

Abstract: To prevent breakage of a membrane probe during a probe test using a probe card having the membrane probe, appearance of a main surface of a wafer as a test object is tested by an appearance tester 51, and results of bad appearance such as adhesion of a foreign substance to the main surface of the wafer and abnormality in shape of bump electrodes over the main surface of the wafer are collected as wafer map data according to arrangement of respective chips in a plane of the wafer, then the wafer map data are transmitted to a probe tester 53 via a server 52, and the probe tester 53 omits the probe test for chips in which bad appearance was detected, and concurrently performs the probe test to other chips in which bad appearance was not detected, based on the wafer map data.

Abstract: An image display device of a high quality, in which the variation of heights between adjoining spacers is reduced by measuring the heights of spacers to arrange the spacers from the end in the sequential order of heights so that the mechanical precision of the spacers need not be strictly managed.

Abstract: An image display device of a high quality, in which the variation of heights between adjoining spacers is reduced by measuring the heights of spacers to arrange the spacers from the end in the sequential order of heights so that the mechanical precision of the spacers need not be strictly managed.

Abstract: A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

Abstract: A small ball is formed at an end of a second gold wire that is held and guided by a second capillary. The small ball has a diameter approximately equal to that of a first gold wire. The small ball is bonded to an electrode on an optical device. The second gold wire is separated from the small ball. A large ball is formed at the lower end of the first gold wire, which is held and guided by a first capillary. The large ball is bonded to a wiring pattern on a external wiring substrate. The first capillary is moved upward, and then moved toward the small ball in the horizontal direction. The first gold wire is connected to the large ball. The first gold wire is bonded to the small ball by stitch bonding, and then separated from the small ball.

Abstract: A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

Abstract: A semiconductor laser apparatus includes a base, a block, and a semiconductor laser element. The base has a recess on a main plane thereof. The block is perpendicularly elongating on the main plane. The block is neighboring the recess. The semiconductor laser element is mounted on a side of the block. A first end of the semiconductor element is located on outer side of the recess, and a second end of the semiconductor element is located on inner side of the recess.

Abstract: An image display device of a high quality, in which the variation of heights between adjoining spacers is reduced by measuring the heights of spacers to arrange the spacers from the end in the sequential order of heights so that the mechanical precision of the spacers need not be strictly managed.

Abstract: The present application discloses a characteristic adjusting method of executing a step of changing the characteristics of display devices in an image display apparatus. In particular, the present invention discloses a configuration in which target values for changes in characteristics are obtained by reducing the high-frequency components of the spatial distribution of the characteristics of the display devices.

Abstract: A small ball is formed at the lower end of a second gold wire that is held and guided by a second capillary. The small ball has a diameter approximately equal to that of a first gold wire. The small ball is bonded to an electrode on an optical device. The second gold wire is separated from the small ball. A large ball is formed at the lower end of the first gold wire that is held and guided by a first capillary. The large ball is bonded to a wiring pattern on an external wiring substrate. The first capillary is moved upward, and then, moved toward the small ball in the horizontal direction. A bonding wire is formed with the first gold wire connecting with the large ball. The first gold wire is bonded to the small ball by stitch bonding, and then, separated from the small ball.

Abstract: A semiconductor laser apparatus includes a base, a block, and a semiconductor laser element. The base has a recess on a main plane thereof. The block is perpendicularly elongating on the main plane. The block is neighboring the recess. The semiconductor laser element is mounted on a side of the block. A first end of the semiconductor element is located on outer side of the recess, and a second end of the semiconductor element is located on inner side of the recess.