Patents by Inventor Makoto Miyahara

Makoto Miyahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140014574
    Abstract: The present invention aims to provide a honeycomb-shaped ceramic porous body where the strength reduction upon forming a separation layer is less than conventional porous bodies. The ceramic porous body (9) is provided with a honeycomb-shaped base material (30) and an intermediate layer. At least a part of the ceramic porous body (9) has a structure where aggregate particles are bonded to one another by an inorganic bonding material component. In the ceramic porous body (9), the intermediate layer thickness, which is the thickness of the intermediate layer, is 100 ?m or more and 500 ?m or less, the base material thickness at the shortest portion between the cells, but excluding the intermediate layer and the separation layer is 0.51 mm or more and 1.55 mm or less, and the ratio of the base material thickness to the intermediate layer thickness is 2.5 or more.
    Type: Application
    Filed: September 19, 2013
    Publication date: January 16, 2014
    Applicant: NGK INSULATORS, LTD.
    Inventors: Makoto TERANISHI, Makoto MIYAHARA, Makiko ICHIKAWA, Hideyuki SUZUKI
  • Publication number: 20120183759
    Abstract: A process for producing a zeolite film is provided in which seed crystals thinly adhere to the surface of a support to form a thin and even zeolite film having fewer defects than conventional zeolite films. Also provided is a zeolite film obtained by the producing process. The process for producing the zeolite film comprises: a particle adhesion step of allowing a slurry, where zeolite particles which become seeds are dispersed, to flow down on the surface of a base material by the self-weight of the slurry, so that the zeolite particles adhere to the base material; and a film formation step of immersing the base material, to which the zeolite particles adhere, into a sol to carry out hydrothermal synthesis, thereby forming the zeolite film on the base material.
    Type: Application
    Filed: March 28, 2012
    Publication date: July 19, 2012
    Applicant: NGK Insulators, Ltd.
    Inventors: Shinji NAKAMURA, Makiko Niino, Makoto Miyahara
  • Patent number: 7875999
    Abstract: A PDA, which functions as an electronic unit, includes power supply which includes a fuel cell unit and an auxiliary power supply which is charged by an output of the fuel cell unit. A non-use state of the PDA is detected by non-use detection unit. Upon detection of the non-use state by the non-use detection unit, the output from the fuel cell unit is stopped and an output of the auxiliary power supply is shut off.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: January 25, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hidenori Suzuki, Kiyoshi Senoue, Makoto Miyahara, Kenichi Takahashi, Michiyuki Kitamoto, Yukinori Akamoto, Yoshie Ozeki, Takashi Shimoyamada, Hideaki Yasui, Hiroyuki Hasebe, Koichi Kawamura
  • Publication number: 20090085410
    Abstract: A PDA, which functions as an electronic unit, includes power supply which includes a fuel cell unit and an auxiliary power supply which is charged by an output of the fuel cell unit. A non-use state of the PDA is detected by non-use detection unit. Upon detection of the non-use state by the non-use detection unit, the output from the fuel cell unit is stopped and an output of the auxiliary power supply is shut off.
    Type: Application
    Filed: September 23, 2008
    Publication date: April 2, 2009
    Inventors: Hidenori SUZUKI, Kiyoshi Senoue, Makoto Miyahara, Kenichi Takahashi, Michiyuki Kitamoto, Yukinori Akamoto, Yoshie Ozeki, Takashi Shimoyamada, Hideaki Yasui, Hiroyuki Hasebe, Koichi Kawamura
  • Publication number: 20090057600
    Abstract: A durable vacuum opening/closing valve connectable with a vacuum chamber and a vacuum pump is arranged to control vacuum pressure in the vacuum chamber by changing an opening degree of an O ring serving as a valve element relative to a valve seat. A predetermined clearance between an outer peripheral surface of a piston and an inner peripheral surface of a cylinder is sealed by a bellofram which changes its shape in association with movement of the piston moved to open or close the valve. The bellofram includes an inclined surface with a predetermined inclination angle and the outer periphery of the piston includes an inclined surface with a predetermined inclination angle, so that an inner diameter of the bellofram in contact with the piston and the outer diameter of the piston are equal when the valve element is in contact with the valve seat.
    Type: Application
    Filed: August 1, 2008
    Publication date: March 5, 2009
    Applicant: CKD CORPORATION
    Inventors: Masayuki Watanabe, Makoto Miyahara, Shunsuke Umezawa
  • Publication number: 20080302427
    Abstract: A vacuum pressure control system includes a vacuum chamber, a vacuum pump for sucking gas from the vacuum chamber, a vacuum open/close valve for controlling vacuum pressure in the vacuum chamber by changing a opening degree by driving air supplied from an air supply source serving as a power source, a vacuum pressure control device for controlling the vacuum open/close valve, and a servo valve for controlling the opening degree of the vacuum open/close valve.
    Type: Application
    Filed: May 6, 2008
    Publication date: December 11, 2008
    Applicant: CKD CORPORATION
    Inventors: Masayuki Watanabe, Makoto Miyahara, Shunsuke Umezawa
  • Publication number: 20080272180
    Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 ?m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 ?g/cm2.
    Type: Application
    Filed: July 11, 2008
    Publication date: November 6, 2008
    Applicant: NGK Insulators, Ltd.
    Inventors: Takahiro ISHIKAWA, Masayuki SHINKAI, Makoto MIYAHARA, Shuhei ISHIKAWA, Nobuaki NAKAYAMA, Seji YASUI
  • Patent number: 7433187
    Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 ?m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 ?g/cm2.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: October 7, 2008
    Assignee: NGK Insulators, Ltd.
    Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Seiji Yasui
  • Patent number: 7161807
    Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: January 9, 2007
    Assignee: NGK Insulators, Ltd.
    Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Kazuyoshi Inoue
  • Publication number: 20040207987
    Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.
    Type: Application
    Filed: February 20, 2004
    Publication date: October 21, 2004
    Applicant: NGK Insulators, Ltd.
    Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Kazuyoshi Inoue
  • Publication number: 20040191558
    Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 &mgr;m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 &mgr;g/cm2.
    Type: Application
    Filed: March 24, 2004
    Publication date: September 30, 2004
    Applicant: NGK Insulators, Ltd.
    Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Seiji Yasui