Patents by Inventor Makoto Nishimura
Makoto Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8308833Abstract: This invention relates to a nonwoven fabric for filters, in which a melt blown nonwoven fabric formed of polybutylene terephthalate or polypropylene terephthalate fibers with an average fiber diameter of 1 to 8 ?m and a spunbonded nonwoven fabric formed of polyester-based fibers with an average fiber diameter of 10 to 30 ?cm are laminated for integration.Type: GrantFiled: September 27, 2006Date of Patent: November 13, 2012Assignee: Toray Industries, Inc.Inventors: Nobuyuki Takano, Masashi Ito, Makoto Nishimura
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Publication number: 20120280379Abstract: A semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and leads so as to surround the die pad, members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate. A semiconductor chip larger than the die pad is mounted over the die pad and the members. Top surfaces of the die pad and the members in opposition to the back surface of the chip are bonded to the back surface of the chip with silver paste. Heat is conducted from the back surface of the chip to the heat dissipating plate via the silver paste, the die pad, and the members, and dissipated to the outside of the semiconductor device via the leads.Type: ApplicationFiled: May 4, 2012Publication date: November 8, 2012Inventors: JUNICHI ARITA, Kazuko Hanawa, Makoto Nishimura
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Publication number: 20120234755Abstract: To promote mixture of fluids on a plurality of stages, flow channels include a plurality of merging portions which penetrate from a top surface to a back surface of a substrate. An end of each of the sub channels is disposed so as to overlap the main channel at each of positions separated along the direction in which the main channel extends, and each of the merging portions communicates the main channels and the ends of the sub channels with each other, thereby changing a flow direction of the second fluid flowing through the sub channels to the thickness direction of the substrate, and merges the second fluid with the first fluid flowing through the main channels.Type: ApplicationFiled: February 1, 2012Publication date: September 20, 2012Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)Inventors: Koji NOISHIKI, Makoto Nishimura, Takeshi Yamashita, Daisuke Nishikawa
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Publication number: 20120197253Abstract: Scissors (1) for an endoscope includes a treatment section (5) provided with a pair of scissor elements (10, 11) which are pivotably supported by a pivoting shaft (support pin (13)) and are pivotally displaced between an open position and a closed position; an operation wire (3) connected to the treatment section (5), and an operation section for displacing the scissor elements (10, 11) between the open position and the closed position by advancing and retracting the operation wire (3). A stopper (14) is provided to the treatment section (5). In the open position, the stopper (14) restricts the relative movement between the pair of scissor elements (10, 11) in the opening direction, and in the closed position, the stopper (14) restricts the relative movement between the pair of scissor elements (10, 11) in the closing direction, thereby to restrict excessive opening and closure of the scissor elements.Type: ApplicationFiled: October 5, 2010Publication date: August 2, 2012Applicant: RiverSeiko Limited CompanyInventors: Miyuki Nishimura, Makoto Nishimura
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Publication number: 20120138266Abstract: Disclosed is a heat exchanger that can more efficiently transfer heat between a heat-exchange fluid and an object with which heat is to be exchanged. A heat exchanger (1) can transfer heat between a heat-exchange fluid flowing through flow paths (R1) and a fluid with which heat is to be exchanged flowing through other flow paths (R2) by means of the flow path structure member (10) (a first metal sheet (11) and a second metal sheet (12)) in which the flow paths (R1 and R2) are formed. The flow paths (R1 and R2) are formed so that the side surfaces thereof are not straight and so that the depths thereof change along the flow direction.Type: ApplicationFiled: July 9, 2010Publication date: June 7, 2012Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)Inventors: Sayaka Yamada, Yasuo Higashi, Makoto Nishimura, Tatsuo Yoshida, Koji Noishiki
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Publication number: 20120138176Abstract: A flow channel structure that includes a first inlet path for a first fluid, a second inlet path for a second fluid, a merging portion that merges, in the thickness direction of a substrate, the first fluid and the second fluid, a first merged fluid channel in which both fluids merged in the merging portion flow along a top surface of the substrate, a flow direction altering portion that causes the flow direction of the fluid flowing through the first merged fluid channel to change from the top surface side of the substrate towards the back surface side thereof, and a second merged fluid channel for changing the flow direction of this fluid to flow to the downstream side so that the fluid flowing from the first merged fluid channel through the flow direction altering portion flows along the back surface of the substrate.Type: ApplicationFiled: November 15, 2011Publication date: June 7, 2012Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)Inventors: Koji NOISHIKI, Makoto NISHIMURA, Takeshi YAMASHITA, Daisuke NISHIKAWA
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Patent number: 8188583Abstract: To improve the heat dissipation characteristics of a semiconductor device. The semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and a plurality of leads so as to surround the die pad, a plurality of members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate, wherein a semiconductor chip the outer shape of which is larger than the die pad is mounted over the die pad and the members. The top surface of the die pad and the top surface of the members at the part in opposition to the back surface of the semiconductor chip are bonded to the back surface of the semiconductor chip in their entire surfaces with a silver paste.Type: GrantFiled: March 25, 2010Date of Patent: May 29, 2012Assignee: Renesas Electronics CorporationInventors: Junichi Arita, Kazuko Hanawa, Makoto Nishimura
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Patent number: 8187520Abstract: The present invention provides a nonwoven fabric for filters which is excellent in dust collection efficiency and exhibits low pressure drop and excellent mechanical characteristics and rigidity, and a method of producing the nonwoven fabric. A nonwoven fabric for filters of the present invention is a nonwoven fabric for filters which is a long fiber nonwoven fabric, consisting of thermoplastic continuous filaments and formed by partially thermocompression bonding the thermoplastic continuous filaments, wherein the nonwoven fabric has a QF value (Pa?1) of 0.02 to 0.08 and stiffness of 2 to 80 mN.Type: GrantFiled: January 30, 2007Date of Patent: May 29, 2012Assignee: Toray Industries, Inc.Inventors: Nobuyuki Takano, Masashi Ito, Makoto Nishimura
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Publication number: 20120101501Abstract: A hemostatic forceps (20) includes a pair of forceps elements (forceps cups (1)) constituted of a conductive metal and configured to serve as high-frequency electrodes and configured to be able to change into a state where front portions of the pair of forceps cups (1) are open, and a state where the pair of forceps cups (1) are close. A sawtooth portion (15) having a plurality of concavo-convex structures which constitute a sawtooth-shape is provided on at least one of respective closing-side surfaces (17) of the pair of forceps cups (1). The sawtooth portion (15) is provided with an electrically insulative coating over its bottom portion (21), but not on a top portion (22) thereof, and hence the top portion (22) is conductive.Type: ApplicationFiled: November 13, 2009Publication date: April 26, 2012Applicant: SUMITOMO BAKELITE CO., LTD.Inventors: Makoto Nishimura, Miyuki Nishimura
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Publication number: 20120073918Abstract: A piston with a piston rod coupled thereto is inserted in a cylinder, which sealingly contains oil. An oil flow generated by movement of the piston is controlled by a damping force generation mechanism, thereby generating a damping force. A separator tube is disposed around the cylinder, and the oil is transmitted to the damping force generation mechanism through a branch tube integrally formed on a cylindrical sidewall of the separator tube. The branch tube is tapered at the outer circumferential portion thereof with the outer diameter thereof reducing toward the distal end of the branch tube.Type: ApplicationFiled: September 27, 2011Publication date: March 29, 2012Inventors: Makoto Nishimura, Jin Yamasaki, Shinichi Kagawa, Tetsuo Yoshida
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Patent number: 8141227Abstract: An assembly of sheet materials in which a first sheet of material and a second sheet of material are disposed in an overlapping relationship, with a plurality of joint portions being formed therebetween by drawing an overlapping part of the first and second sheets of materials at a plurality of positions. The plurality of joint portions includes at least one first joint portion in which the first sheet of material is laterally extruded into the second sheet of material and at least one second joint portion in which the first sheet of material and the second sheet of material are in contact with each other in a cup-like surface configuration.Type: GrantFiled: September 5, 2008Date of Patent: March 27, 2012Assignee: Kabushiki Kaisha Hitachi SeisakushoInventors: Makoto Nishimura, Chigaya Sekine
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Publication number: 20120024647Abstract: The present invention provides a cylinder apparatus processing method capable of preventing a base shell from bending which otherwise would be caused due to a residual stress generated when the base shell is processed. The cylinder apparatus processing method comprises securely holding an outer diameter of the base shell 1 with a mandrel 5 inserted therethrough with use of a holder die 4, and forming a recess 2 on the base shell 1 by locally applying crush processing (cold working) to an upper position of the base shell 1 with use of a press die 6 and concurrently forming an impression 21 of a bend prevention die 7 at a lower position of the outer diameter of the base shell 1 by a reactive force R to a processing force F applied by the press die 6 and received by the bend prevention die 7.Type: ApplicationFiled: September 23, 2010Publication date: February 2, 2012Inventor: Makoto NISHIMURA
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Publication number: 20110318045Abstract: A cleaning element for an image-forming apparatus, includes: a shaft; a strip-shaped sheet which is disposed helically on an outer circumferential surface of the shaft; and an adhesive layer which is disposed between the shaft and the strip-shaped sheet and binds the shaft and the strip-shaped sheet, the strip-shaped sheet having, on a surface thereof facing the shaft, an unbound region in which the adhesive layer is absent, at an end in a width direction of the strip-shaped sheet which faces a downstream side in a rotation direction of the shaft.Type: ApplicationFiled: October 29, 2010Publication date: December 29, 2011Applicant: FUJI XEROX CO., LTD.Inventors: Yuji TERAI, Makoto NISHIMURA
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Patent number: 7848678Abstract: An image forming apparatus comprising an image holding member that is rotationally driven, the image holding member comprising, on a substrate, a subbing layer and a photosensitive layer, a volume resistance value of the subbing layer decreasing in a rotation axis direction of the image holding member, from one end portion of a light source side of the image holding member towards another end portion of the image holding member, a charging unit, a latent image formation unit, a developing unit, a transfer unit, and a charge removal unit comprising a light source that, after transfer of the toner image, irradiates the surface of the image holding member from one side thereof, in a rotation axis direction of the image holding member, with charge removing light, to remove the charge from the surface of the image holding member.Type: GrantFiled: March 20, 2008Date of Patent: December 7, 2010Assignee: Fuji Xerox Co., Ltd.Inventors: Junichi Shibata, Makoto Nishimura, Takahiro Suzuki
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Patent number: 7810620Abstract: In a monotube type hydraulic shock absorber, a plurality of rectangular recesses that are elongate in a circumferential direction are formed in an outer circumferential surface of a cylinder at a position in the vicinity of an upper limit of a slidable range of a free piston. A support for supporting an external part such as a sensor or a hose is positioned so as to be fitted around a portion of the cylinder at which the recesses are formed. Thereafter, while supporting the rear sides of the recesses by a moving die of a receiving member, a plurality of pairs of punches are moved towards each other, to thereby press flat press portions of the punches against the support, thus drawing the support locally into the recesses of the cylinder without forming projections in an inner surface of the cylinder.Type: GrantFiled: March 21, 2006Date of Patent: October 12, 2010Assignee: Hitachi, Ltd.Inventor: Makoto Nishimura
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Publication number: 20100244214Abstract: To improve the heat dissipation characteristics of a semiconductor device. The semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and a plurality of leads so as to surround the die pad, a plurality of members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate, wherein a semiconductor chip the outer shape of which is larger than the die pad is mounted over the die pad and the members. The top surface of the die pad and the top surface of the members at the part in opposition to the back surface of the semiconductor chip are bonded to the back surface of the semiconductor chip in their entire surfaces with a silver paste.Type: ApplicationFiled: March 25, 2010Publication date: September 30, 2010Inventors: Junichi ARITA, Kazuko Hanawa, Makoto Nishimura
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Patent number: 7784394Abstract: A butt joining method is provided that is capable of joining together two members with high strength and high accuracy by utilizing plastic deformation. A bolt-shaped member having a female part at one end thereof and a piston rod having three annular grooves on a forward end part (male part) fittable to the female part are butted against each other with the female and male parts being fitted to each other. In this state, the side wall of the female part is radially pushed into the annular grooves on the piston rod by mechanical clinching technique. At this time, the pushing process is performed so that clinch portions formed by the pushing process are staggered between mutually adjacent ones of the annular grooves, thereby ensuring the desired joining strength and suppressing the elongation of the material, and thus preventing opening of the butt joint between the bolt-shaped member and the piston rod.Type: GrantFiled: August 23, 2007Date of Patent: August 31, 2010Assignee: Hitachi, Ltd.Inventor: Makoto Nishimura
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Patent number: 7760391Abstract: An image processing system is provided that includes a first-motor control apparatus (40), having a communication interface (42) connected in series with a transmission line, for obtaining a detection position of a control subject and outputting a position-detection signal, an image processing apparatus (30), having a communication interface (32) connected in series with the transmission line and a memory (34) that stores the position-detection signal, for capturing an image of a workpiece (60) and generating an image-processing signal based on image processing, and a master apparatus (10) for implementing communication control of the image processing apparatus (30) and the first-motor control apparatus (40), and in which the image processing apparatus (10) starts the image processing, in accordance with an in-bound start command, stores in the memory (32) the position-detection signal, and outputs to the master apparatus (10) the position-detection signal along with the image-processing signal.Type: GrantFiled: January 11, 2005Date of Patent: July 20, 2010Assignee: Mitsubishi Electric Corp.Inventors: Atsushi Kitamura, Kimio Saitou, Makoto Nishimura
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Publication number: 20100171023Abstract: To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.Type: ApplicationFiled: August 8, 2007Publication date: July 8, 2010Applicant: PANASONIC ELECTRIC WORKS, CO., LTD.Inventors: Nobuyuki Asahi, Makoto Nishimura, Hiroyuki Yagyu, Yutaka Kinugasa, Takuya Matsumoto
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Publication number: 20100146921Abstract: This invention relates to a nonwoven fabric for filters, in which a melt blown nonwoven fabric formed of polybutylene terephthalate or polypropylene terephthalate fibers with an average fiber diameter of 1 to 8 ?m and a spunbonded nonwoven fabric formed of polyester-based fibers with an average fiber diameter of 10 to 30 ?cm are laminated for integration.Type: ApplicationFiled: September 27, 2006Publication date: June 17, 2010Applicant: TORAY INDUSTRIES, INC.Inventors: Nobuyuki Takano, Masashi Ito, Makoto Nishimura