Abstract: A vehicle power supply system includes a power supply connector having a power supply port which is provided within a trunk room and electrically connected to a DC power source, and an inverter device which is provided separately from a fuel cell automobile (an electrically driven vehicle) and is disposed within the trunk room, wherein the trunk room is provided therein with an inverter installation space where the inverter device may be installed at a position which does not overlap with the power supply port when viewed from a forward and rearward direction of the vehicle, and the invert device is provided with a connection cable which is drawn from a side surface thereof and of which a front end portion has a connector portion connected to the power supply port.

Abstract: A monolithic ceramic electronic component includes a component body and outer electrodes. The component body includes a plurality of stacked ceramic layers and a plurality of inner electrodes which extend between the ceramic layers, which contain Ni, and which include exposed ends exposed on predetermined surfaces of the component body. The outer electrodes are electrically connected to the exposed ends of the inner electrodes and are formed on the predetermined surfaces of the component body by plating. The inner electrodes include Mg—Ni coexistence regions where Mg and Ni coexist.

Abstract: The present invention relates to a catalyst composition for purifying exhaust gas and an exhaust gas purifying catalyst which contain a manganese-containing composite oxide, and an object of the invention is to provide a novel catalyst composition which can sufficiently function as an exhaust gas purifying catalyst even without supporting a precious metal as a catalytically active component. To achieve the object, there is proposed a catalyst composition for purifying exhaust gas including particles containing a manganese-containing composite oxide and particles containing a metal of Group 5 to Group 11 having an electron in the d orbital (however, Mn, Pt, Rh, and Pd are excluded) or an oxide of the metal in a mixed state.

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract: Provided is a catalyst composition using other metals different from noble metals as a catalytic activity component and which has an excellent catalytic activity even after a thermal duration treatment. Provided are an exhaust gas purifying catalyst composition which includes ceria-zirconia particles with a feature in that a peak arising from (111) plane is divided into two peak tops in an XRD pattern and in which a transition metal including at least one of Cu, Cr, Fe, Mn, Co, Ni, and Ag is supported on the ceria-zirconia particles, and a catalyst using the exhaust gas purifying catalyst composition.

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract: A passenger retaining apparatus includes a driver seat airbag and a curtain airbag. The curtain airbag includes first and second inflation portions and a recess portion. The first inflation portion is inflated at a passenger side with respect to the inflated driver seat airbag in a vehicle body longitudinal direction. The second inflation portion is inflated at a wind shield side with respect to the inflated driver seat airbag in the vehicle body longitudinal direction. The recess portion is formed between the first and second inflation portions to engage with the inflated driver seat airbag. The driver seat airbag retains a front surface of a head of the passenger and the first inflation portion retains a side surface of the head of the passenger.

Abstract: An electronic component including an electronic component element with an external electrode, a Ni plating film on the external electrode, and a Sn plating film covering the Ni plating film. The Sn plating film has Sn—Ni alloy flakes therein, the Sn—Ni alloy flakes are present in the range from a surface of the Sn plating film on the Ni plating film to 50% or less of the thickness of the Sn plating film, and when Sn is removed from the Sn plating film to leave only the Sn—Ni alloy flakes, an observed planar view of a region occupied by the Sn—Ni alloy flakes falls within the range from 15% to 60% of the observed planar region.

Abstract: A charging cable support arm includes a support member that is fixed to a wall face, a first arm whose proximal end portion is hinged to the support member and that is rotatable within a horizontal plane, and a second arm that is hinged to a distal end of the first arm and that is rotatable within a horizontal plane. The first arm is provided with a first passage hole through which a charging cable is inserted into the first arm, and the second arm 3 is provided with, at a distal end thereof, a fourth passage hole from which the inserted charging cable is pulled out, and by use of the charging cable pulled out of the fourth passage hole, an electric vehicle is charged.

Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Abstract: A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating E1 and an amount of extension of the second plating E2 satisfy the relationship E1/(E1+E2)?20%, where E1 represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and E2 represents a distance from the edge of the first plating layer to an edge of the second plating layer.

Abstract: A multilayer ceramic capacitor that includes a layered body in which dielectric layers and internal electrode layers are layered alternately, an external electrode on a surface of the layered body and a plating layer on a surface of the external electrode. The external electrode contains Cu, and a protective layer containing Cu2O is provided at a joining portion between the external electrode and the plating layer. When heat is applied to the layered body after the external electrode is removed, a ratio of an arithmetic mean value Xa of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 350° C. with respect to an arithmetic mean value Y of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 230° C. and lower than or equal to 250° C. (Xa/Y) is less than or equal to 0.66.

Abstract: Provided is an image processing apparatus which is connected to and accessible to a database storing a plurality of pieces of previously prepared reference data, and which stores at least one piece of individual data having an image captured by the user in association with the information regarding the food/beverage contained in the captured image. The image processing apparatus compares information of the food/beverage in the captured image with the reference data stored in the database and the individual data, and acquires the food/beverage information included in the reference data together with the reference image similar to the captured image, the food/beverage information associated with the captured image in the individual data, or the food/beverage information in the reference data or the individual data including the food/beverage information relating to the captured image.

Abstract: A multilayer ceramic capacitor that contains at least one kind of a first element that forms a covalent hydride with hydrogen (except for an element generating a hydride having a boiling point of less than 125° C.) and a second element that forms a hydride in a boundary region with hydrogen between an outermost plating layer constituting an external electrode and a dielectric layer constituting a ceramic element body.

Abstract: A passenger retaining apparatus includes a driver seat airbag and a curtain airbag. The curtain airbag includes first and second inflation portions and a recess portion. The first inflation portion is inflated at a passenger side with respect to the inflated driver seat airbag in a vehicle body longitudinal direction. The second inflation portion is inflated at a wind shield side with respect to the inflated driver seat airbag in the vehicle body longitudinal direction. The recess portion is formed between the first and second inflation portions to engage with the inflated driver seat airbag. The driver seat airbag retains a front surface of a head of the passenger and the first inflation portion retains a side surface of the head of the passenger.

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract: In a method of manufacturing a laminate type electronic component, while the distance between adjacent exposed ends of a plurality of internal electrodes is adjusted preferably to be about 50 ?m or less, a plurality of conductive particles composed of Pd, Pt, Cu, Au, or Ag are provided on the surface of a component main body. The conductive particles have an average particle size of about 0.1 nm to about 100 nm, which are distributed in island-shaped configurations over the entire surface of the component main body, while the average distance between the respective conductive particles is adjusted to fall within the range of about 10 nm to about 100 nm. The component main body is subjected to electrolytic plating such that plating growth develops in and around a region including the respective exposed ends of the plurality of internal electrodes.

Abstract: An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.