Patents by Inventor Makoto Ogawa
Makoto Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8456796Abstract: A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.Type: GrantFiled: August 25, 2009Date of Patent: June 4, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Akihiro Yoshida, Makoto Ogawa
-
Publication number: 20130095233Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.Type: ApplicationFiled: April 5, 2012Publication date: April 18, 2013Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI, Shunsuke TAKEUCHI, Shigeyuki KURODA
-
Patent number: 8411409Abstract: When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.Type: GrantFiled: June 16, 2011Date of Patent: April 2, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Masahito Saruban, Toshiyuki Iwanaga, Syunsuke Takeuchi, Kiyoyasu Sakurada
-
Patent number: 8400754Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.Type: GrantFiled: December 7, 2009Date of Patent: March 19, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Seiichi Matsumoto, Akihiro Motoki, Toshiyuki Iwanaga, Tatsuo Kunishi
-
Publication number: 20130062994Abstract: A method for manufacturing a laminated ceramic electronic component enables formation of a plating film as at least a portion of an external electrode which connects exposed ends of internal electrodes. A component main body including a plurality of ceramic layers and a plurality of internal electrodes partially exposed from the component main body is prepared such that the component main body has a conductive region formed by diffusion of a conductive component included in the internal electrodes at the end surfaces of the ceramic layers located between adjacent exposed ends of the plurality of internal electrodes. The ceramic layers are preferably composed of a glass ceramic containing a glass component of about 10 weight % or more. A plating film is formed directly on the component main body by growing the exposed ends of the internal electrodes and the conductive region as nucleuses for plating deposition.Type: ApplicationFiled: March 5, 2012Publication date: March 14, 2013Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto OGAWA, Akihiro MOTOKI, Masahito SARUBAN, Wataru OGAWA
-
Patent number: 8355241Abstract: A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 ?m or less.Type: GrantFiled: November 10, 2010Date of Patent: January 15, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Syunsuke Takeuchi, Kenichi Kawasaki
-
Patent number: 8334748Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.Type: GrantFiled: January 25, 2012Date of Patent: December 18, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Syunsuke Takeuchi, Teruyo Katayama, Toshiyuki Iwanaga, Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki
-
Publication number: 20120314336Abstract: An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.Type: ApplicationFiled: May 24, 2012Publication date: December 13, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto OGAWA, Akihiro MOTOKI, Atsuko SAITO, Kenji MASUKO, Toshinobu FUJIWARA
-
Patent number: 8319594Abstract: A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1?t/d?0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.Type: GrantFiled: January 20, 2012Date of Patent: November 27, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Koji Sato, Yukio Sanada, Makoto Ogawa, Yasuhiro Nishisaka
-
Patent number: 8320101Abstract: In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 ?m to about 1.9 ?m.Type: GrantFiled: June 17, 2010Date of Patent: November 27, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Shunsuke Takeuchi, Kenichi Kawasaki, Akihiro Motoki, Makoto Ogawa
-
Patent number: 8315036Abstract: A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.Type: GrantFiled: March 17, 2009Date of Patent: November 20, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Junichi Saito, Shunsuke Takeuchi, Kenichi Kawasaki
-
Publication number: 20120288724Abstract: An electronic component that prevents or minimizes whiskers or has good solder wettability includes a rectangular solid-shaped electronic component element and external electrodes of terminal electrodes provided at opposed end surfaces of the electronic component element. First plated films including Ni are provided on the surfaces of the external electrodes. Second plated films including Sn defining an outermost layer are arranged so as to cover the first plated films. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are provided at a Sn crystal grain boundary. Intermetallic compound layers including Ni3Sn4 are provided at interfaces between the first plated films and the second plated films.Type: ApplicationFiled: April 26, 2012Publication date: November 15, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto OGAWA, Akihiro MOTOKI, Atsuko SAITO, Kenji MASUKO, Toshinobu FUJIWARA
-
Publication number: 20120288731Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.Type: ApplicationFiled: April 12, 2012Publication date: November 15, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA, Atsuko SAITO, Toshinobu FUJIWARA, Kenji MASUKO
-
Patent number: 8308191Abstract: An airbag apparatus includes a gas generator that generates gas, and an airbag inflated and deployed by the gas supplied from the gas generator. The airbag restrains an occupant in a first state in which the occupant's chin is positioned on the airbag apparatus or the occupant in a second state in which the occupant's chin is positioned on a steering wheel. The airbag includes one main exhaust port, a vent cover provided to cover the one main exhaust port, and at least one sub exhaust port without a vent cover. The sub exhaust port exhausts the gas without using the main exhaust port in a state in which the vent cover blocks the main exhaust port due to a folded state of the airbag in an initial stage of an inflating and deploying operation performed to restrain the occupant in the first state or in the second state.Type: GrantFiled: November 1, 2010Date of Patent: November 13, 2012Assignee: Takata CorporationInventors: Teruhiko Hiruta, Makoto Ogawa
-
Publication number: 20120243143Abstract: An electronic component that is prevented from being inclined with respect to a circuit board during and after mounting includes a laminated body that is preferably configured by stacking a plurality of insulator layers, and includes a lower surface with depressions provided thereon. The lower surface includes a series of outer edges of the insulator layers. Capacitor electrodes are defined by internal conductors incorporated in the laminated body, which respectively have exposed sections that are exposed from between the insulator layers in the depressions on the lower surface. External electrodes, which are preferably formed directly by plating, are provided in the depressions to cover the exposed sections.Type: ApplicationFiled: March 5, 2012Publication date: September 27, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Toshiyuki Iwanaga, Makoto Ogawa, Masahito Saruban
-
Publication number: 20120236461Abstract: A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.Type: ApplicationFiled: March 14, 2012Publication date: September 20, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Yoji YAMAMOTO, Akihiro MOTOKI, Syunsuke TAKEUCHI, Makoto OGAWA, Toshiyuki IWANAGA
-
Patent number: 8254081Abstract: In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.Type: GrantFiled: November 13, 2009Date of Patent: August 28, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Seiichi Nishihara, Shuji Matsumoto, Akihiro Motoki, Makoto Ogawa
-
Patent number: 8240016Abstract: A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 ?m or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.Type: GrantFiled: April 30, 2010Date of Patent: August 14, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi
-
Publication number: 20120194031Abstract: In a method of forming an external electrode by growing plated depositions on exposed ends of a plurality of internal electrodes in a component main body, the component main body is polished to increase exposure of the internal electrodes. To prevent decreased external electrode fixing strength, a radius of curvature is reduced to about 0.01 mm or less for an R chamfered section formed in a ridge section of the component main body during polishing by ion milling, and exposed ends of the internal electrodes are recessed from end surfaces of the component main body with a recess length of about 1 ?m or less. Plating films to serve as external electrodes are formed to extend from the end surfaces of the component main body across the R chamfered section, and include end edges located on at least one of the principal surfaces and the side surfaces.Type: ApplicationFiled: January 27, 2012Publication date: August 2, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Wataru OGAWA, Makoto OGAWA, Masahito SARUBAN, Toshiyuki IWANAGA, Akihiro MOTOKI
-
Publication number: 20120188683Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.Type: ApplicationFiled: January 25, 2012Publication date: July 26, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Syunsuke TAKEUCHI, Teruyo KATAYAMA, Toshiyuki IWANAGA, Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI