Abstract: Information processing system includes a first certification device which executes a first temporary certification, creates a first temporary certificate, transmits it to an external device, carries out a first formal certification and creates the first formal certificate, a second certification device which executes a second temporary certification based on the first temporary certification, creates a second temporary certificate, transmits it to the external device, carries out a second formal certification and creates the second formal certificate, and a processing device which verifies a validity of the first formal certificate corresponding to the first temporary certificate and a validity of the second formal certificate corresponding to the second temporary certificate from the user, in response to a information processing request from the user and determines to execute the information processing corresponding to the information processing request based on the verification result.

Abstract: Information processing system includes a first certification device which executes a first temporary certification, creates a first temporary certificate, transmits it to an external device, carries out a first formal certification and creates the first formal certificate, a second certification device which executes a second temporary certification based on the first temporary certification, creates a second temporary certificate, transmits it to the external device, carries out a second formal certification and creates the second formal certificate, and a processing device which verifies a validity of the first formal certificate corresponding to the first temporary certificate and a validity of the second formal certificate corresponding to the second temporary certificate from the user, in response to a information processing request from the user and determines to execute the information processing corresponding to the information processing request based on the verification result.

Abstract: A coral cultivation method includes: an electrodeposited-mineral precipitating procedure for precipitating electrodeposited minerals on a coral-growth substrate for growing coral, which is placed in seawater, by applying an electric current between the coral-growth substrate and a first anode that is electrically connected to the coral-growth substrate and placed in the seawater; a coral-larvae growing procedure for growing coral larvae on the coral-growth substrate precipitated with the electrodeposited minerals; a coral-cultivation-structure configuring procedure for configuring a coral cultivation structure from a plurality of the coral-growth substrates on which the coral larvae are grown; and a coral cultivating procedure for cultivating coral by applying an electric current between the coral-growth substrate on which the coral larvae are grown and a second anode.

Abstract: A coral cultivation method includes: an electrodeposited-mineral precipitating procedure for precipitating electrodeposited minerals on a coral-growth substrate for growing coral, which is placed in seawater, by applying an electric current between the coral-growth substrate and a first anode that is electrically connected to the coral-growth substrate and placed in the seawater; a coral-larvae growing procedure for growing coral larvae on the coral-growth substrate precipitated with the electrodeposited minerals; a coral-cultivation-structure configuring procedure for configuring a coral cultivation structure from a plurality of the coral-growth substrates on which the coral larvae are grown; and a coral cultivating procedure for cultivating coral by applying an electric current between the coral-growth substrate on which the coral larvae are grown and a second anode.

Abstract: A surveying instrument, comprising an optical system for collimating a measuring point, a driving unit for performing scanning in a measurement range the optical system, a distance-measuring unit comprising a light wave distance measuring system, an image pickup unit for taking an image in the measurement range, an image processing unit for performing image processing to extract edges from the image picked up, and a control arithmetic operation unit for selecting a point near the edge as a measuring point on the image picked up and for controlling the distance-measuring unit to carry out surveying operation of the measuring point.

Abstract: A wafer conveyance system is described for transporting one or more wafers that undergo, while being transported, different processes at a plurality of wafer processing apparatuses inside which one or more wares are processed. A hermetically closed chamber is provided that defines an isolated environment inside which a controlled atmosphere. At least one guide path is provided inside the hermetically closed chamber. At least one mobile element is movable inside the hermetically closed chamber along the at least one guide path to transport one or more wafers from one wafer processing apparatus to another. A plurality of position sensors that detect positions of the at least one mobile element are deployed along each of the at least one guide path in such a manner that they are deployed at intervals close together when near the wafer processing apparatuses and deployed at wider intervals elsewhere. In another aspect, the guide rails may be constructed of a plurality of connectable rail units.

Abstract: A survey data processing system, comprising processing programs for preparing a 3-dimensional data at two or more points including a control point in a predetermined range by a surveying instrument, for preparing a digital image in a predetermined range including the control point taken by an image pickup device, for preparing TIN data obtained by connecting two or more points including the control point, for matching the control point on the TIN data with the control point on the image, for associating the image with a triangular net which composes the TIN data by texture mapping based on the matching, and for changing a method to display the image prepared through the texture mapping by applying calculation to the TIN data.

Abstract: A wafer conveyance system is described for transporting one or more wafers that undergo, while being transported, different processes at a plurality of wafer processing apparatuses inside which one or more wares are processed. A hermetically closed chamber is provided that defines an isolated environment inside which a controlled atmosphere. At least one guide path is provided inside the hermetically closed chamber. At least one mobile element is movable inside the hermetically closed chamber along the at least one guide path to transport one or more wafers from one wafer processing apparatus to another. A plurality of position sensors that detect positions of the at least one mobile element are deployed along each of the at least one guide path in such a manner that they are deployed at intervals close together when near the wafer processing apparatuses and deployed at wider intervals elsewhere. In another aspect, the guide rails may be constructed of a plurality of connectable rail units.

Abstract: A surveying instrument, comprising an optical system for collimating a measuring point, a driving unit for performing scanning in a measurement range the optical system, a distance-measuring unit comprising a light wave distance measuring system, an image pickup unit for taking an image in the measurement range, an image processing unit for performing image processing to extract edges from the image picked up, and a control arithmetic operation unit for selecting a point near the edge as a measuring point on the image picked up and for controlling the distance-measuring unit to carry out surveying operation of the measuring point.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: A surveying instrument, comprising a distance measuring unit for measuring a distance to a collimating point, an angle measuring unit for measuring a vertical angle and a horizontal angle of the collimating point, an image pick-up means for acquiring an image in a collimating direction, a driving unit for directing the image pick-up means in a direction of a predetermined object to be measured as selected based on an entire image data acquired by the image pick-up means, and a control arithmetic unit for recording by associating an image of an object to be measured with survey data to the object, wherein the image is picked-up in the direction directed by the driving unit and the survey data is measured by the distance measuring unit and the angle measuring unit.

Abstract: A surveying instrument, comprising a distance measuring unit for measuring a distance to a collimating point, an angle measuring unit for measuring a vertical angle and a horizontal angle of the collimating point, an image pick-up means for acquiring an image in a collimating direction, a driving unit for directing the image pick-up means in a direction of a predetermined object to be measured as selected based on an entire image data acquired by the image pick-up means, and a control arithmetic unit for recording by associating an image of an object to be measured with survey data to the object, wherein the image is picked-up in the direction directed by the driving unit and the survey data is measured by the distance measuring unit and the angle measuring unit.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: An automatic control system for a construction machine includes the construction machine provided with a ground leveling implement, a target, and a laser sensor; a survey unit that has a coordinate position measuring element and projects a beam of tracking light indicating a finished-plane height toward the target; a storage unit for storing finished-plane height data in correspondence with a horizontal coordinate position in the coordinate position; and a computation unit for computing the finished-plane height data. The survey unit is equipped with a rotation unit for rotating the laser beam in a vertical direction so that a height of the laser beam at the horizontal coordinate position becomes a height from a determined finished plane. The construction machine is provided with a control unit for controlling the ground leveling implement so that it reaches the finished-plane height, based on a position at which the laser beam is received on the laser sensor.

Abstract: An automatic control system for a construction machine includes the construction machine provided with a ground leveling implement, a target, and a laser sensor; a survey unit that has a coordinate position measuring element and projects a beam of tracking light indicating a finished-plane height toward the target; a storage unit for storing finished-plane height data in correspondence with a horizontal coordinate position in the coordinate position; a computation unit for computing the finished-plane height data; a modulation unit for modulating the laser beam, based on construction information at the horizontal coordinate position, and for transmitting the construction information to the laser sensor; and a demodulation unit fox demodulating the construction information, based on the laser beam received by the laser sensor.

Abstract: An IC card that allows fixing the obverse and reverse metal panels to the plastic frame without using adhesion and allows to make conducting electrically between both the metal panels. The IC card 1 includes an electrical circuit board 3 in which electronic components 4 are incorporated, a connector 5 to be connected to an end portion of the electric circuit board, a frame 2 which constitutes an outer frame of the card and a pair of metal panels 6, 7 which cover an obverse and reverse sides of the card.

Abstract: In an IC card, a frame for connecting a board for mounting electronics components is covered by upper and lower panels. A main connector for connecting the IC card to a computer is provided at one end of the frame. Further, one or more subconnectors to be connected to external systems are provided on the board and the pins of the subconnectors extend towards openings in the upper panel. The subconnectors are supported between the board and the upper panel. Thus, various kinds of subconnectors for various functions can be used with the IC card. In a modified example, a subconnector is provided opposite the main connector on the upper panel, and the pins thereof extend in a direction parallel to the board.

Abstract: An IC card (1) has a shape of a substantially flat rectangular parallelepiped. The IC card (1) has electronic devices (2) including integrated circuits, a substrate (3) and a frame (5) for supporting the electronic devices (2), a first panel (6c) covering the upper surface of the frame (5), and a second panel (6d) covering the lower surface of the frame (5). Hereupon, the first panel (6c) is directly mounted to the frame (5) in such a manner that each of the left and right end portions (15) of the first panel (6c) is bent twice in accordance with the outer surface of the frame (5) and further each of edges of the left and right end portions (15) is fastened to the lower surface of the frame (5).

Abstract: An IC card adaptor which allows expansion or improvement of the functions of the IC card inexpensively is provided. The IC card adaptor is to be connected with the IC card, in which the IC card is provided with a main-connector for connecting with prescribed electronic equipment on one side and is provided with sub-connectors for connecting with an adaptor on another side. The adaptor is provided with primary connectors to be connected to the sub-connectors of the IC card, a secondary connector to be connected with another piece of electronic equipment or a telecommunication line, and an electric circuit board on which prescribed electronic components are mounted. Both connectors are connected to each other and an adaptor module is constituted on the electric circuit board. The adaptor module is provided with another prescribed function, such as a telephone set, different from functions the IC card primarily possesses.