Patents by Inventor Makoto Omori

Makoto Omori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10993607
    Abstract: An endoscope apparatus and a method of operating the endoscope apparatus that perform both illumination light observation and fluorescence observation by a simple configuration. At least a part of a wavelength region of excitation light is included in a first wavelength region where the absorption intensity of a fluorescent material is 10% or more of a first peak value. The wavelength region of the excitation light is included in a second wavelength region where the transmittance of a first spectral transmittance characteristic is 60% or more of a second peak value and a third wavelength region where the transmittance of a second spectral transmittance characteristic is 40% or less of a third peak value. A wavelength at which intensity of fluorescence is a peak is included in a fourth wavelength region where the transmittance of the second spectral transmittance characteristic is 80% or more of the third peak value.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: May 4, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Toshihiko Omori, Makoto Sugizaki
  • Patent number: 9762570
    Abstract: Information processing system includes a first certification device which executes a first temporary certification, creates a first temporary certificate, transmits it to an external device, carries out a first formal certification and creates the first formal certificate, a second certification device which executes a second temporary certification based on the first temporary certification, creates a second temporary certificate, transmits it to the external device, carries out a second formal certification and creates the second formal certificate, and a processing device which verifies a validity of the first formal certificate corresponding to the first temporary certificate and a validity of the second formal certificate corresponding to the second temporary certificate from the user, in response to a information processing request from the user and determines to execute the information processing corresponding to the information processing request based on the verification result.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: September 12, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Makoto Omori, Shinichiro Nishizawa, Yasushi Toriwaki, Takashi Yoshino, Hisashi Sugawara, Masaki Nagao, Kosuke Tao, Keiko Ishii, Tsuyoshi Taneishi, Kenichi Yamashita, Mitsuhiro Sato, Atsushi Wataki
  • Publication number: 20150180861
    Abstract: Information processing system includes a first certification device which executes a first temporary certification, creates a first temporary certificate, transmits it to an external device, carries out a first formal certification and creates the first formal certificate, a second certification device which executes a second temporary certification based on the first temporary certification, creates a second temporary certificate, transmits it to the external device, carries out a second formal certification and creates the second formal certificate, and a processing device which verifies a validity of the first formal certificate corresponding to the first temporary certificate and a validity of the second formal certificate corresponding to the second temporary certificate from the user, in response to a information processing request from the user and determines to execute the information processing corresponding to the information processing request based on the verification result.
    Type: Application
    Filed: March 6, 2015
    Publication date: June 25, 2015
    Applicant: FUJITSU LIMITED
    Inventors: Makoto Omori, SHINICHIRO NISHIZAWA, Yasushi Toriwaki, Takashi YOSHINO, Hisashi Sugawara, Masaki Nagao, Kosuke Tao, KEIKO ISHII, TSUYOSHI TANEISHI, Kenichi Yamashita, Mitsuhiro SATO, Atsushi Wataki
  • Patent number: 8720376
    Abstract: A coral cultivation method includes: an electrodeposited-mineral precipitating procedure for precipitating electrodeposited minerals on a coral-growth substrate for growing coral, which is placed in seawater, by applying an electric current between the coral-growth substrate and a first anode that is electrically connected to the coral-growth substrate and placed in the seawater; a coral-larvae growing procedure for growing coral larvae on the coral-growth substrate precipitated with the electrodeposited minerals; a coral-cultivation-structure configuring procedure for configuring a coral cultivation structure from a plurality of the coral-growth substrates on which the coral larvae are grown; and a coral cultivating procedure for cultivating coral by applying an electric current between the coral-growth substrate on which the coral larvae are grown and a second anode.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: May 13, 2014
    Assignees: Mitsubishi Heavy Industries Bridge & Steel Structures Engineering Co., Ltd., The Nippon Corrosion Engineering Co., Ltd., The University Of Tokyo
    Inventors: Kazuyoshi Kihara, Oki Goto, Yasufumi Kondou, Yukio Koibuchi, Makoto Omori
  • Publication number: 20110192352
    Abstract: A coral cultivation method includes: an electrodeposited-mineral precipitating procedure for precipitating electrodeposited minerals on a coral-growth substrate for growing coral, which is placed in seawater, by applying an electric current between the coral-growth substrate and a first anode that is electrically connected to the coral-growth substrate and placed in the seawater; a coral-larvae growing procedure for growing coral larvae on the coral-growth substrate precipitated with the electrodeposited minerals; a coral-cultivation-structure configuring procedure for configuring a coral cultivation structure from a plurality of the coral-growth substrates on which the coral larvae are grown; and a coral cultivating procedure for cultivating coral by applying an electric current between the coral-growth substrate on which the coral larvae are grown and a second anode.
    Type: Application
    Filed: October 23, 2009
    Publication date: August 11, 2011
    Applicants: THE NIPPON CORROSION ENGINEERING CO., LTD., THE UNIVERSITY OF TOKYO, MITSUBISHI HEAVY INDUSTRIES BRIDGE & STEEL STRUCTURES ENGINEERING CO., LTD.
    Inventors: Kazuyoshi Kihara, Oki Goto, Yasufumi Kondou, Yukio Koibuchi, Makoto Omori
  • Patent number: 7764809
    Abstract: A surveying instrument, comprising an optical system for collimating a measuring point, a driving unit for performing scanning in a measurement range the optical system, a distance-measuring unit comprising a light wave distance measuring system, an image pickup unit for taking an image in the measurement range, an image processing unit for performing image processing to extract edges from the image picked up, and a control arithmetic operation unit for selecting a point near the edge as a measuring point on the image picked up and for controlling the distance-measuring unit to carry out surveying operation of the measuring point.
    Type: Grant
    Filed: March 2, 2005
    Date of Patent: July 27, 2010
    Assignee: Kabushiki Kaisha TOPCON
    Inventors: Fumio Ohtomo, Hitoshi Otani, Makoto Omori
  • Patent number: 7278812
    Abstract: A wafer conveyance system is described for transporting one or more wafers that undergo, while being transported, different processes at a plurality of wafer processing apparatuses inside which one or more wares are processed. A hermetically closed chamber is provided that defines an isolated environment inside which a controlled atmosphere. At least one guide path is provided inside the hermetically closed chamber. At least one mobile element is movable inside the hermetically closed chamber along the at least one guide path to transport one or more wafers from one wafer processing apparatus to another. A plurality of position sensors that detect positions of the at least one mobile element are deployed along each of the at least one guide path in such a manner that they are deployed at intervals close together when near the wafer processing apparatuses and deployed at wider intervals elsewhere. In another aspect, the guide rails may be constructed of a plurality of connectable rail units.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: October 9, 2007
    Assignee: Shinko Electric Co., Ltd.
    Inventors: Takumi Mizokawa, Makoto Omori, Yuzo Takakado, Hitoshi Kawano
  • Publication number: 20050213808
    Abstract: A survey data processing system, comprising processing programs for preparing a 3-dimensional data at two or more points including a control point in a predetermined range by a surveying instrument, for preparing a digital image in a predetermined range including the control point taken by an image pickup device, for preparing TIN data obtained by connecting two or more points including the control point, for matching the control point on the TIN data with the control point on the image, for associating the image with a triangular net which composes the TIN data by texture mapping based on the matching, and for changing a method to display the image prepared through the texture mapping by applying calculation to the TIN data.
    Type: Application
    Filed: March 15, 2005
    Publication date: September 29, 2005
    Inventors: Fumio Ohtomo, Hitoshi Otani, Makoto Omori
  • Publication number: 20050214103
    Abstract: A wafer conveyance system is described for transporting one or more wafers that undergo, while being transported, different processes at a plurality of wafer processing apparatuses inside which one or more wares are processed. A hermetically closed chamber is provided that defines an isolated environment inside which a controlled atmosphere. At least one guide path is provided inside the hermetically closed chamber. At least one mobile element is movable inside the hermetically closed chamber along the at least one guide path to transport one or more wafers from one wafer processing apparatus to another. A plurality of position sensors that detect positions of the at least one mobile element are deployed along each of the at least one guide path in such a manner that they are deployed at intervals close together when near the wafer processing apparatuses and deployed at wider intervals elsewhere. In another aspect, the guide rails may be constructed of a plurality of connectable rail units.
    Type: Application
    Filed: January 28, 2005
    Publication date: September 29, 2005
    Inventors: Takumi Mizokawa, Makoto Omori, Yuzo Takakado, Hitoshi Kawano
  • Publication number: 20050195384
    Abstract: A surveying instrument, comprising an optical system for collimating a measuring point, a driving unit for performing scanning in a measurement range the optical system, a distance-measuring unit comprising a light wave distance measuring system, an image pickup unit for taking an image in the measurement range, an image processing unit for performing image processing to extract edges from the image picked up, and a control arithmetic operation unit for selecting a point near the edge as a measuring point on the image picked up and for controlling the distance-measuring unit to carry out surveying operation of the measuring point.
    Type: Application
    Filed: March 2, 2005
    Publication date: September 8, 2005
    Inventors: Fumio Ohtomo, Hitoshi Otani, Makoto Omori
  • Patent number: 6863485
    Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: March 8, 2005
    Assignee: Shinko Electric Co., Ltd.
    Inventors: Takumi Mizokawa, Makoto Omori, Yuzo Takakado, Hitoshi Kawano
  • Patent number: 6859269
    Abstract: A surveying instrument, comprising a distance measuring unit for measuring a distance to a collimating point, an angle measuring unit for measuring a vertical angle and a horizontal angle of the collimating point, an image pick-up means for acquiring an image in a collimating direction, a driving unit for directing the image pick-up means in a direction of a predetermined object to be measured as selected based on an entire image data acquired by the image pick-up means, and a control arithmetic unit for recording by associating an image of an object to be measured with survey data to the object, wherein the image is picked-up in the direction directed by the driving unit and the survey data is measured by the distance measuring unit and the angle measuring unit.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: February 22, 2005
    Assignee: Kabushiki Kaisha TOPCON
    Inventors: Fumio Ohtomo, Hitoshi Otani, Makoto Omori
  • Publication number: 20030179361
    Abstract: A surveying instrument, comprising a distance measuring unit for measuring a distance to a collimating point, an angle measuring unit for measuring a vertical angle and a horizontal angle of the collimating point, an image pick-up means for acquiring an image in a collimating direction, a driving unit for directing the image pick-up means in a direction of a predetermined object to be measured as selected based on an entire image data acquired by the image pick-up means, and a control arithmetic unit for recording by associating an image of an object to be measured with survey data to the object, wherein the image is picked-up in the direction directed by the driving unit and the survey data is measured by the distance measuring unit and the angle measuring unit.
    Type: Application
    Filed: March 13, 2003
    Publication date: September 25, 2003
    Inventors: Fumio Ohtomo, Hitoshi Otani, Makoto Omori
  • Publication number: 20020150447
    Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.
    Type: Application
    Filed: January 25, 2000
    Publication date: October 17, 2002
    Inventors: Takumi Mizokawa, Makoto Omori, Yuzo Takakado, Hitoshi Kawano
  • Publication number: 20020150448
    Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.
    Type: Application
    Filed: June 11, 2002
    Publication date: October 17, 2002
    Applicant: Shinko Electric Co., Ltd.
    Inventors: Takumi Mizokawa, Makoto Omori, Yuzo Takakado, Hitoshi Kawano
  • Patent number: 6171018
    Abstract: An automatic control system for a construction machine includes the construction machine provided with a ground leveling implement, a target, and a laser sensor; a survey unit that has a coordinate position measuring element and projects a beam of tracking light indicating a finished-plane height toward the target; a storage unit for storing finished-plane height data in correspondence with a horizontal coordinate position in the coordinate position; and a computation unit for computing the finished-plane height data. The survey unit is equipped with a rotation unit for rotating the laser beam in a vertical direction so that a height of the laser beam at the horizontal coordinate position becomes a height from a determined finished plane. The construction machine is provided with a control unit for controlling the ground leveling implement so that it reaches the finished-plane height, based on a position at which the laser beam is received on the laser sensor.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: January 9, 2001
    Assignee: Kabushiki Kaisha Topcon
    Inventors: Fumio Ohtomo, Kazuaki Kimura, Vernon J. Brabec, Satoshi Hirano, Makoto Omori
  • Patent number: 6016455
    Abstract: An automatic control system for a construction machine includes the construction machine provided with a ground leveling implement, a target, and a laser sensor; a survey unit that has a coordinate position measuring element and projects a beam of tracking light indicating a finished-plane height toward the target; a storage unit for storing finished-plane height data in correspondence with a horizontal coordinate position in the coordinate position; a computation unit for computing the finished-plane height data; a modulation unit for modulating the laser beam, based on construction information at the horizontal coordinate position, and for transmitting the construction information to the laser sensor; and a demodulation unit fox demodulating the construction information, based on the laser beam received by the laser sensor.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: January 18, 2000
    Assignee: Kabushiki Kaisha Topcon
    Inventors: Fumio Ohtomo, Kazuaki Kimura, Vernon J. Brabec, Satoshi Hirano, Makoto Omori
  • Patent number: 5994769
    Abstract: An IC card that allows fixing the obverse and reverse metal panels to the plastic frame without using adhesion and allows to make conducting electrically between both the metal panels. The IC card 1 includes an electrical circuit board 3 in which electronic components 4 are incorporated, a connector 5 to be connected to an end portion of the electric circuit board, a frame 2 which constitutes an outer frame of the card and a pair of metal panels 6, 7 which cover an obverse and reverse sides of the card.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: November 30, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeo Onoda, Jun Ohbuchi, Makoto Omori
  • Patent number: 5982624
    Abstract: In an IC card, a frame for connecting a board for mounting electronics components is covered by upper and lower panels. A main connector for connecting the IC card to a computer is provided at one end of the frame. Further, one or more subconnectors to be connected to external systems are provided on the board and the pins of the subconnectors extend towards openings in the upper panel. The subconnectors are supported between the board and the upper panel. Thus, various kinds of subconnectors for various functions can be used with the IC card. In a modified example, a subconnector is provided opposite the main connector on the upper panel, and the pins thereof extend in a direction parallel to the board.
    Type: Grant
    Filed: August 6, 1997
    Date of Patent: November 9, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeo Onoda, Tomomi Morii, Makoto Omori, Jun Ohbuchi, Yasuhiro Murasawa
  • Patent number: 5912806
    Abstract: An IC card (1) has a shape of a substantially flat rectangular parallelepiped. The IC card (1) has electronic devices (2) including integrated circuits, a substrate (3) and a frame (5) for supporting the electronic devices (2), a first panel (6c) covering the upper surface of the frame (5), and a second panel (6d) covering the lower surface of the frame (5). Hereupon, the first panel (6c) is directly mounted to the frame (5) in such a manner that each of the left and right end portions (15) of the first panel (6c) is bent twice in accordance with the outer surface of the frame (5) and further each of edges of the left and right end portions (15) is fastened to the lower surface of the frame (5).
    Type: Grant
    Filed: December 24, 1996
    Date of Patent: June 15, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeo Onoda, Katsunori Ochi, Jun Ohbuchi, Makoto Omori