Patents by Inventor Makoto Omori

Makoto Omori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5774339
    Abstract: An IC card includes a first cover including a first flat panel portion and a first upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion, and a second cover including a second flat panel portion and a second upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion. The first upright wall portion defines a chamber in cooperation with a portion of the first flat panel portion. The first and second covers are mated together with the first and second upright wall portions bonded together in a butt fashion.
    Type: Grant
    Filed: December 2, 1996
    Date of Patent: June 30, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Jun Ohbuchi, Hiroshi Miura, Kiyotaka Nishino, Shigeo Onoda, Tetsuro Washida, Makoto Omori
  • Patent number: 5719746
    Abstract: An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: February 17, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Jun Ohbuchi, Shigeo Onoda, Katsunori Ochi, Makoto Omori, Tetsuro Washida, Kiyotaka Nishino
  • Patent number: 5671123
    Abstract: An IC card including an electric circuit board and have face and back metallic panels that include a housing and are attached to a resin frame. The IC card has a discharge pattern formed on the electric circuit board for discharging static electricity applied to the metallic panels, a conductor elastically disposed between one of the metallic panels and the discharge pattern for electrically coupling one of the metallic panels with the discharge pattern, and a ground pattern formed on the electric circuit board with the ground pattern separated by a given distance A from the discharge pattern for routing the static electricity to a card connector. The given distance A is a distance necessary for the static electricity to start discharging at a given voltage. A given distance needed for discharge can be maintained precisely through a simple manufacturing process. A fluctuation in discharge start voltage can therefore be minimized. This results in a highly reliable product.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: September 23, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Makoto Omori, Katsunori Ochi, Jun Ohbuchi, Tetsuro Washida
  • Patent number: 5661636
    Abstract: An IC card with an on-board hard disk unit comprising a frame; a circuit board inside the frame; and a hard disk unit mounted on the circuit board. The IC card also has a metal front panel supported by the frame, and covering the entire IC card, including the hard disk unit. Thus, the outer surface of the IC card is made stronger, and the hard disk is protected from static electricity. The metal front panel includes a first portion where the IC card is relatively thin and a second, bulging portion where the IC card is relatively thick. The bulging portion accommodates the hard disk unit. The front panel may include a vent or mesh.
    Type: Grant
    Filed: October 12, 1995
    Date of Patent: August 26, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeo Onoda, Jun Ohbuchi, Makoto Omori, Takeshi Uenaka, Tomomi Morii
  • Patent number: 5581120
    Abstract: A semiconductor device card system is capable of preventing foreign matter from entering from outside even when a semiconductor device is mounted and to prevent the semiconductor device card from being removed inadvertently. A mounting section of a semiconductor device card is disposed in a semiconductor device card system unit. The mounting section includes an openable mounting section door, and a window for a connector, disposed in the mounting section door, and through which a back-end connector is inserted.
    Type: Grant
    Filed: February 2, 1995
    Date of Patent: December 3, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Makoto Omori, Hajime Maeda
  • Patent number: 5363274
    Abstract: A memory card having no ordinary type circuit board and a reduced thickness. Insulating layers are disposed on reverse surfaces of a pair of metallic panels, and circuit patterns are formed on the insulating layers. A plurality of electronic parts are mounted on the metallic panels by, for example, being soldered to the circuit patterns. The pair of metallic panels on which the electronic parts are mounted are fitted and bonded to openings formed in a frame of the card so that the electronic parts are accommodated inside the frame facing each other.
    Type: Grant
    Filed: February 19, 1992
    Date of Patent: November 8, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Makoto Omori, Jun Ohbuchi, Hajime Maeda, Yasushi Kasatani
  • Patent number: 5327010
    Abstract: An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.
    Type: Grant
    Filed: July 17, 1990
    Date of Patent: July 5, 1994
    Assignees: Ryoden Kasei Co., Ltd., Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takeshi Uenaka, Jun Ohbuchi, Shigeo Onoda, Makoto Omori, Hajime Maeda, Toru Tachikawa
  • Patent number: 5313364
    Abstract: An IC card arranged so that a connector cannot come off a frame during an assembly process in which the connector and a circuit board are accommodated in the frame and panels are thereafter attached to obverse and reverse surfaces of the frame. Projections on sides of the connector and resilient engaging/fixing hooks with oblique surfaces on the frame are engaged. As the connector is forced into the frame, the projections of the connector are brought into engagement with and temporarily deflect the engaging/fixing hooks of the frame. The connector is thereby fixed firmly on the frame.
    Type: Grant
    Filed: December 3, 1992
    Date of Patent: May 17, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Makoto Omori, Jun Ohbuchi, Hajime Maeda, Hiroshi Miura, Tomomi Hamada, Takeshi Uenaka
  • Patent number: 4933540
    Abstract: An IC card has a shutter reciprocatively mounted on a frame in order to protect a plurality of external-element connection terminals which are mounted on the frame. Guide grooves formed in the frame include those which receive corresponding projections formed on spring-mounting portions of the shutter to keep the projections in engagement therewith, thereby enabling both the base portion and the spring-mounting portion of the shutter to be guided. End portions at one end of those guide grooves determine a position of the shutter such that the shutter is prevented from overshooting the frame. Thus, the IC card is capable of ensuring stable opening and closing action of the shutter.
    Type: Grant
    Filed: March 17, 1988
    Date of Patent: June 12, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Makoto Omori, Toshinobu Banjo, Shigeo Onoda
  • Patent number: 4905124
    Abstract: An IC card having a circuit board provided with wiring formed on at least one of two surfaces of the circuit board, a terminal base fixed to one surface of a front portion of the circuit board and having a multiplicity of electrode terminals disposed on its upper surface, a plurality of electronic parts mounted on the two surfaces of the circuit board, and a package in which the circuit board on which the electronic parts are mounted is incorporated while exposing the electrode terminals to the outside of the package.
    Type: Grant
    Filed: March 29, 1988
    Date of Patent: February 27, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshinobu Banjo, Shigeo Onoda, Makoto Omori
  • Patent number: 4868074
    Abstract: A battery holder mechanism comprises lower supporting portions for receiving the peripheral edge of a battery holder body from below and upper supporting portions for receiving the same from above when the battery holder body is inserted into a battery inserting opening of a package of an electronic appliance, such as an IC card. The upper and lower supporting portions are provided alternatingly inside an inserting hole of a package.
    Type: Grant
    Filed: March 29, 1988
    Date of Patent: September 19, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Makoto Omori, Toshinobu Banjo, Shigeo Onoda
  • Patent number: 4842966
    Abstract: A battery holder mechanism for holding a battery in an electronic device having a package has a battery holder body adapted to be received in a receiving hole of the package. The battery holder body has a circular-arc portion extending along the circumferential direction of the battery. First and second supporting projection project from the inner peripheral edges of the circular-arc portion and support the battery from both sides. A supporting projecting portion disposed in the package within the receiving hole at a position corresponding to a circumferential interval between the second supporting projection so as to support the battery from the same side as the second supporting projection when the battery holder body is inserted in the battery receiving hole. Engagement pauls resiliently lock the battery holder body within the battery receiving hole. The battery is held by the projections from both sides, so the vertical displacement of the battery can be restricted.
    Type: Grant
    Filed: February 23, 1988
    Date of Patent: June 27, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Makoto Omori, Toshinobu Banjo, Shigeo Onoda