Abstract: A wireless device includes: a casing having a first face; a display configured to be visible from the first face; a touch sensor formed by a transparent material and mounted in the casing with respect to the display as a part of the first face; a substrate mounted to a side opposite to the first face with respect to the display; and an antenna element including: a first portion built in the casing, connected to a feeding point included in the substrate, and located within a first range occupied by the touch sensor when viewed from a direction perpendicular to the first face; and a second portion located within a second range other than the first range.

Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.

Abstract: A liquid spray apparatus includes a liquid storage part storing a liquid, a vibratory source including a leading end, a recess being formed in a surface of the leading end, and a mesh member including a large number of micropores and arranged to abut on the surface of the leading end of the vibratory source. The liquid is supplied from the outside of the leading end to the surface and the recess of the leading end. The liquid supplied to the surface and the recess of the leading end is discharged in an atomized manner through the micropores by vibrations of the vibratory source. This liquid spray apparatus can stably spray the liquid with the vibratory source and the mesh member.

Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.

Abstract: A method for polishing at least one wafer composed of semiconductor material that has a front side and the rear side includes performing at least one first polishing step including simultaneously polishing both front and rear sides of the at least one wafer at a process temperature between an upper polishing plate and a lower polishing plate. Each of the upper polishing and lower polishing plates is covered with a polishing pad having an inner edge and an outer edge, a hardness of at least 80° Shore A, a compressibility of less than 2.5%, and respective upper and lower surfaces that come into contact with the wafer being polished. The upper and lower surfaces form a polishing gap extending from the inner edge to the outer edge. A height of the polishing gap at the inner edge differs linearly from the height of the polishing gap at the outer edge.

Abstract: A process for polishing a semiconductor wafer includes simultaneous polishing of a front side and of a reverse side of a substrate wafer in the presence of polishing medium so as to achieve material removal from the front side and the reverse side of the substrate wafer. The simultaneous polishing includes a first step and a second step. A speed of material removal in the first step is higher than in the second step. The first step includes the use of a first polishing slurry as a polishing medium and the second step includes a second polishing slurry as the polishing medium. The second polishing slurry differs from the first polishing slurry at least in that the second polishing slurry comprises a polymeric additive.

Abstract: A control apparatus controlling testing of a memory under test that includes one or more row repair memory blocks and column repair memory blocks. The control apparatus comprises a counting section that sequentially receives test results respectively indicating pass/fail of a plurality of test blocks of the memory under test, and sequentially counts, for each first-type memory block, which is a row-oriented memory block or a column-oriented memory block, a fail memory block number among second-type memory blocks; a selecting section that selects memory blocks first-type memory blocks for which the fail memory block number exceeds a reference value, such that the number of selected memory blocks is no greater than the number of first-type repair memory blocks of the memory under test; and a test control section that masks test blocks among the memory blocks selected by the selecting section and causes further testing of the memory under test.

Abstract: In a thin plate member washing apparatus, when a rotary arm member supporting a mesh member holding portion is rotated using a rotary handle, tap water flows over the surface of a mesh member, and medicinal fluid residue deposited on the mesh member is removed.

Abstract: In a thin plate member washing apparatus, when a rotary arm member supporting a mesh member holding portion is rotated using a rotary handle, tap water flows over the surface of a mesh member, and medicinal fluid residue deposited on the mesh member is removed.

Abstract: A wireless device includes: a casing having a first face; a display configured to be visible from the first face; a touch sensor formed by a transparent material and mounted in the casing with respect to the display as a part of the first face; a substrate mounted to a side opposite to the first face with respect to the display; and an antenna element including: a first portion built in the casing, connected to a feeding point included in the substrate, and located within a first range occupied by the touch sensor when viewed from a direction perpendicular to the first face; and a second portion located within a second range other than the first range.

Abstract: In a thin plate member washing apparatus, when a rotary arm member supporting a mesh member holding portion is rotated using a rotary handle, tap water flows over the surface of a mesh member, and medicinal fluid residue deposited on the mesh member is removed.

Abstract: A nebulizer includes a nebulizer body a relay pipe. The nebulizer body includes a connection portion that has an aerosol lead-out port to lead out aerosol, and the relay pipe includes a connection portion that has an aerosol introduction port to introduce the aerosol. The nebulizer body the relay pipe can take a first connection state in which the relay pipe detachably connected to the nebulizer body and a second connection state in which the relay pipe is connected to the nebulizer body so as to be not able to be detached from the nebulizer body. In the first connection state, the aerosol introduction port and the aerosol lead-out port are communicated with each other. In the second connection state, the aerosol lead-out port is blocked by a blocking portion provided in the relay pipe. Therefore, the nebulizer in which reuse of the nebulizer body or relay pipe is simply prohibited after the usage can be provided by the configuration.

Abstract: In a thin plate member washing apparatus, tap water showering down from water flow holes of a water flow plate makes contact with outer rotary blades and inner rotary blades provided in a rotary supporting member, thereby rotating the rotary supporting member. Moreover, the tap water falling on a mesh member held by a mesh member holding portion flows over a front surface and a back surface of the mesh member based on a centrifugal force due to rotation of the mesh member and removes medicinal fluid residue deposited on the mesh member. The medicinal fluid residue removed from the mesh member is directly carried by the tap water and discharged to the outside of the thin plate member washing apparatus through a fluid outlet opening.

Abstract: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.

Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes a housing with the first molded body; a first conductive pattern provided on an outer surface of the first molded body; a second conductive pattern provided in the housing; and a first conductive pin. The first conductive pin passes through the first molded body and connects the first conductive pattern and the second conductive pattern.

Abstract: A control apparatus controlling testing of a memory under test that includes one or more row repair memory blocks and column repair memory blocks. The control apparatus comprises a counting section that sequentially receives test results respectively indicating pass/fail of a plurality of test blocks of the memory under test, and sequentially counts, for each first-type memory block, which is a row-oriented memory block or a column-oriented memory block, a fail memory block number among second-type memory blocks; a selecting section that selects memory blocks first-type memory blocks for which the fail memory block number exceeds a reference value, such that the number of selected memory blocks is no greater than the number of first-type repair memory blocks of the memory under test; and a test control section that masks test blocks among the memory blocks selected by the selecting section and causes further testing of the memory under test.

Abstract: Provided is a test apparatus that tests a device under test having a test function for sequentially outputting, from a single test terminal, signals that would be output from a plurality of terminals, the test apparatus comprising: a test section that supplies the device under test with a test signal and receives signals that are sequentially output from the test terminal in response to the test signal; an identifying section that identifies a correspondence between each signal sequentially received by the test section and a signal that would be output from one of the terminals of the device under test; and a counting section that counts a number of signals judged to be unacceptable from among the signals sequentially received by the test section for each terminal of the device under test, based on the correspondence identified by the identifying section.

Abstract: A nebulizer includes a main body unit, an atomization unit, and a breath detection unit, which is a function unit for realizing an additional function of the nebulizer. The main body unit and the atomization unit are separable. The atomization unit includes a storage section for storing the medicinal solution, and an atomizing section for spraying the medicinal solution by atomizing the medicinal solution in the storage section. The main body unit includes a control circuit for performing control to operate the atomizing section. The breath detection unit is attachable between the main body unit and the atomization unit.

Abstract: An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part.

Abstract: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.