Abstract: A core substrate is a core substrate with a built-in inductor for constructing an interposer to which a semiconductor element is mounted. The core substrate includes: a ceramic substrate; a conductor portion; and a magnetic material portion. The ceramic substrate has a first surface, a second surface opposite the first surface in a thickness direction, and a through hole between the first surface and the second surface. The conductor portion extends through the through hole. The magnetic material portion surrounds the conductor portion within the through hole, and is made of ceramics. The conductor portion is made of sintered metal.

Abstract: A fish counting system has: an image acquisition unit for acquiring a plurality of images wherein a fluid containing fish is imaged over time; a counting unit for counting the fish on the basis of the plurality of images; a fish count change display provision unit for providing a fish count change display, wherein a display corresponding to the number of fish counted per unit time is arranged in a time-series manner; a result provision unit for providing a counting result display wherein an image to which count completion marks indicating a counted fish have been added; and a correction unit for receiving a correction operation and correcting the number of fish.

Abstract: This fish counting system comprises: an image acquisition unit configured to acquire a plurality of images obtained by capturing, over time, images of a photographing area in which a fluid including a fish flows; an extraction unit configured to extract a fish in each image; and a counting unit configured to count the number of fish. The photographing area has a first area and a second area. The counting unit is configured to count the fish when the fish in the first area moves to the second area.

Abstract: Provided is a bonded substrate mainly for mounting a power semiconductor in which the reliability to a thermal cycle has been enhanced as compared with a conventional one. In a bonded substrate in which a copper plate is bonded to one or both main surface(s) of a nitride ceramic substrate, a bonding layer consisting of TiN intervenes between the nitride ceramic substrate and the copper plate and is adjacent at least to the copper plate, and an Ag distribution region in which Ag atoms are distributed is set to be present in the copper plate. Preferably, an Ag-rich phase is set to be present discretely at an interface between the bonding layer and the copper plate.

Abstract: A ceramic circuit board includes a ceramic substrate, a first metal plate bonded to a front surface of the ceramic substrate, and a member bonded to a front surface side of the metal plate. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the first metal plate, and which exhibits a higher Young's modulus than that of the first metal plate.

Abstract: Provided is a bonded substrate mainly for mounting a power semiconductor in which the reliability to a thermal cycle has been enhanced as compared with a conventional one. In a bonded substrate in which a copper plate is bonded to one or both main surface(s) of a nitride ceramic substrate, a bonding layer consisting of TiN intervenes between the nitride ceramic substrate and the copper plate and is adjacent at least to the copper plate, and an Ag distribution region in which Ag atoms are distributed is set to be present in the copper plate. Preferably, an Ag-rich phase is set to be present discretely at an interface between the bonding layer and the copper plate.

Abstract: A heat dissipating circuit board for a power semiconductor includes an electrode material on which a power semiconductor is mounted on a front surface thereof, and a member bonded to a front surface side of the electrode material. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.

Abstract: A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided.

Abstract: A heat dissipating circuit board for a power semiconductor includes an electrode material on which a power semiconductor is mounted on a front surface thereof, and a member bonded to a front surface side of the electrode material. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.

Abstract: A ceramic circuit board includes a ceramic substrate, a first metal plate bonded to a front surface of the ceramic substrate, and a member bonded to a front surface side of the metal plate. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the first metal plate, and which exhibits a higher Young's modulus than that of the first metal plate.

Abstract: There is provided an image forming apparatus including: an image data acquiring unit that acquires image data of an image formed on a sheet; an identification information acquiring unit that acquires identification information that identifies the sheet on which the image is formed; an image forming unit that forms an image based on the image data on the sheet with a decolorable colorant which becomes colorless by a predetermined chemical reaction and that forms an identification information image based on the identification information on the sheet with a non-decolorable colorant which does not become colorless by the chemical reaction; and a storage control unit that stores the identification information and the image data of the image to be formed on the sheet, on which the identification information image corresponding to the identification information is formed, in a predetermined storage region in a correlated manner.

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided.

Abstract: A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.

Abstract: There is provided an image forming apparatus including: an image data acquiring unit that acquires image data of an image formed on a sheet; an identification information acquiring unit that acquires identification information that identifies the sheet on which the image is formed; an image forming unit that forms an image based on the image data on the sheet with a decolorable colorant which becomes colorless by a predetermined chemical reaction and that forms an identification information image based on the identification information on the sheet with a non-decolorable colorant which does not become colorless by the chemical reaction; and a storage control unit that stores the identification information and the image data of the image to be formed on the sheet, on which the identification information image corresponding to the identification information is formed, in a predetermined storage region in a correlated manner.

Abstract: An aspect of a piezoelectric actuator according to the present invention comprises: a plate-like piezoelectric element (20); a sheet (30); and a movable body (50). The piezoelectric element is provided to the sheet (30) in such a manner that the upper surface of the plate-like piezoelectric element is parallel to the upper surface of the sheet. The sheet includes a movable body driving section (40) formed on one of the upper and the lower surfaces of the sheet. A movable body includes a contact section (51) contacting with the sheet at the movable body driving section. The actuator moves the movable body driving section in a direction parallel to the upper surface of the sheet by using expansion and contraction of the piezoelectric element in a direction parallel to the upper surface of the piezoelectric element to move the movable body.

Abstract: There is provided an image forming apparatus including: an image data acquiring unit that acquires image data of an image formed on a sheet; an identification information image reading unit that reads an identification information image formed on the sheet, the identification information image corresponding to identification information that identifies the sheet on which the image is formed; an image forming unit that forms a first image based on the image data acquired by the image data acquiring unit on the sheet with a decolorable colorant which becomes colorless by a predetermined chemical reaction; and a storage control unit that stores the identification information and the image data of the image to be formed on the sheet, on which the identification information image corresponding to the identification information is formed, in a predetermined storage region in a correlated manner.

Abstract: A piezoelectric actuator 10 according to each embodiment of the present invention comprises: a column-like piezoelectric body 31, whose bottom face is fixed to a base portion 20, and which stands from the base portion; and a driving power supply section for applying a driving voltage to the piezoelectric body. The piezoelectric body includes two sets (32, 33) of a pair of electrodes for providing electrical fields to the piezoelectric body. The two sets are formed so that each of the two sets is provided to each of two regions into which the piezoelectric body is divided by a virtual plane VPL1 parallel to the center axis CL of the piezoelectric body. The driving power supply section applies the driving voltage Vin having a “frequency between the second-order bending resonant frequency and the first-order expansion-contraction resonant frequency” to either one of the two sets, selectively.