Patents by Inventor Makoto Totani
Makoto Totani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240067763Abstract: The solid titanium catalyst component (I) of the present invention contains titanium, magnesium, halogen, and a cyclic multiple-ester-group-containing compound (a) represented by the following formula (1).Type: ApplicationFiled: August 26, 2021Publication date: February 29, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Takashi KIMURA, Makoto ISOGAI, Yasushi NAKAYAMA, Kenji MICHIUE, Takashi JINNAI, Wataru YAMADA, Shotaro TAKANO, Hiroshi TERAO, Takaaki YANO, Yoshiyuki TOTANI, Sunil Krzysztof MOORTHI, Takashi NAKANO
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Publication number: 20240067764Abstract: A solid titanium catalyst component (I) for olefin polymer production contains titanium, magnesium, halogen, and a cyclic multiple-ester-group-containing compound (a) represented by the formula (1). Preferably, a propylene polymer that is obtained by the olefin polymerization method and has specific thermal properties as determined primarily by differential scanning calorimetry (DSC).Type: ApplicationFiled: December 21, 2021Publication date: February 29, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Takashi KIMURA, Makoto ISOGAI, Yasushi NAKAYAMA, Kenji MICHIUE, Takashi JINNAI, Wataru YAMADA, Shotaro TAKANO, Hiroshi TERAO, Takaaki YANO, Yoshiyuki TOTANI, Sunil Krzysztof MOORTHI, Takashi NAKANO
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Publication number: 20210153348Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.Type: ApplicationFiled: January 25, 2021Publication date: May 20, 2021Inventors: Eisuke TACHIBANA, Taro SUZUKI, Makoto TOTANI, Kouji KONDOH, Eijirou MIYAGAWA, Junya KASAHARA, Takao ARIMA
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Publication number: 20170318670Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.Type: ApplicationFiled: January 12, 2016Publication date: November 2, 2017Inventors: Eisuke TACHIBANA, Taro SUZUKI, Makoto TOTANI, Kouji KONDOH, Eijirou MIYAGAWA, Junya KASAHARA, Takao ARIMA
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Patent number: 7417195Abstract: A printed circuit board 2 and an FPC board 3 to be connected together are each given a multilayer structure wherein insulating films 23, 33 and interconnection patterns 22, 32 are stacked alternately. In the FPC board 3, connecting signal lines are distributed among the multilayered interconnection patterns 22, and in the printed circuit board 2, interconnecting to lands 32a formed on a connection face thereof is carried out using interconnection patterns 32 of inner layers. By this means, it is possible to greatly increase the number of connecting signal lines between the printed circuit board 2 and the FPC board 3.Type: GrantFiled: February 3, 2004Date of Patent: August 26, 2008Assignee: DENSO CorporationInventors: Makoto Totani, Toshihiro Miyake, Fumio Kojima
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Patent number: 7240426Abstract: Equipment for bonding a flexible printed circuit board made of thermoplastic resin on a printed circuit board includes a heater and a jig. The heater head presses and heats the flexible printed circuit board. The jig prevents the thermoplastic resin from flowing out when the flexible printed circuit is bonded on the printed circuit board. The jig is to be disposed between the flexible printed circuit board and the heater head. The jig includes a thin plate having a base plate and a wing plate. The base plate is parallel to a top surface of the heater head to be sandwiched between the flexible printed circuit board and the heater head. The wing plate is disposed on both sides of the base plate to bend from the base plate.Type: GrantFiled: April 22, 2004Date of Patent: July 10, 2007Assignees: DENSO CORPORATION, DENSO WAVE INCORPORATEDInventors: Makoto Totani, Akinari Higashida
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Patent number: 7242065Abstract: A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.Type: GrantFiled: March 17, 2005Date of Patent: July 10, 2007Assignee: DENSO CORPORATIONInventors: Ichiharu Kondo, Hiroaki Tanaka, Inao Toyoda, Makoto Totani
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Patent number: 7176541Abstract: A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.Type: GrantFiled: May 26, 2005Date of Patent: February 13, 2007Assignee: Denso CorporationInventors: Hiroaki Tanaka, Inao Toyoda, Ichiharu Kondo, Makoto Totani
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Patent number: 7168326Abstract: A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.Type: GrantFiled: March 15, 2005Date of Patent: January 30, 2007Assignee: Denso CorporationInventors: Inao Toyoda, Hiroaki Tanaka, Ichiharu Kondo, Makoto Totani
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Patent number: 7080445Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.Type: GrantFiled: October 31, 2002Date of Patent: July 25, 2006Assignee: Denso CorporationInventors: Toshihiro Miyake, Kazuyuki Deguchi, Yoshitaro Yazaki, Hiroaki Maeda, Mitsutoshi Miyazaki, Makoto Totani, Akinari Higashida, Hiroki Miyagawa
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Publication number: 20050269654Abstract: A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.Type: ApplicationFiled: May 26, 2005Publication date: December 8, 2005Inventors: Hiroaki Tanaka, Inao Toyoda, Ichiharu Kondo, Makoto Totani
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Patent number: 6966482Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.Type: GrantFiled: January 13, 2003Date of Patent: November 22, 2005Assignee: Denso CorporationInventors: Makoto Totani, Toshihiro Miyake, Tomohiro Yokochi, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi, Hajime Nakagawa
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Publication number: 20050210993Abstract: A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.Type: ApplicationFiled: March 15, 2005Publication date: September 29, 2005Inventors: Inao Toyoda, Hiroaki Tanaka, Ichiharu Kondo, Makoto Totani
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Publication number: 20050205950Abstract: A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.Type: ApplicationFiled: March 17, 2005Publication date: September 22, 2005Inventors: Ichiharu Kondo, Hiroaki Tanaka, Inao Toyoda, Makoto Totani
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Publication number: 20040211057Abstract: Equipment for bonding a flexible printed circuit board made of thermoplastic resin on a printed circuit board includes a heater and a jig. The heater head presses and heats the flexible printed circuit board. The jig prevents the thermoplastic resin from flowing out when the flexible printed circuit is bonded on the printed circuit board. The jig is to be disposed between the flexible printed circuit board and the heater head. The jig includes a thin plate having a base plate and a wing plate. The base plate is parallel to a top surface of the heater head to be sandwiched between the flexible printed circuit board and the heater head. The wing plate is disposed on both sides of the base plate to bend from the base plate.Type: ApplicationFiled: April 22, 2004Publication date: October 28, 2004Applicants: DENSO CORPORATION, DENSO WAVE INCORPORATEDInventors: Makoto Totani, Akinari Higashida
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Patent number: 6784375Abstract: An interconnection structure has a first printed circuit board including an insulating substrate made of a thermoplastic resin and a first board conductive pattern with a land, a second printed circuit board overlapped with the first printed circuit board, and including a second board conductive pattern with a land that is electrically interconnected with the land of the first printed circuit board to form an interconnection portion between the first board conductive pattern and the second board conductive pattern. A part of the thermoplastic resin constituting the insulating substrate of the first printed circuit board extends to seal the interconnection portion. The insulating substrate of the first printed circuit board is adhered to an insulating substrate of the second printed circuit through an adhesion enhancing layer in which a material for lowering a modulus of elasticity of the insulating substrate of the first printed circuit board is dispersed therein.Type: GrantFiled: July 26, 2002Date of Patent: August 31, 2004Assignee: Denso CorporationInventors: Toshihiro Miyake, Katsuaki Kojima, Makoto Totani, Yoshitaro Yazaki
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Publication number: 20040156583Abstract: A printed circuit board 2 and an FPC board 3 to be connected together are each given a multilayer structure wherein insulating films 23, 33 and interconnection patterns 22, 32 are stacked alternately. In the FPC board 3, connecting signal lines are distributed among the multilayered interconnection patterns 22, and in the printed circuit board 2, interconnecting to lands 32a formed on a connection face thereof is carried out using interconnection patterns 32 of inner layers. By this means, it is possible to greatly increase the number of connecting signal lines between the printed circuit board 2 and the FPC board 3.Type: ApplicationFiled: February 3, 2004Publication date: August 12, 2004Applicant: DENSO CORPORATIONInventors: Makoto Totani, Toshihiro Miyake, Fumio Kojima
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Publication number: 20030098339Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.Type: ApplicationFiled: January 13, 2003Publication date: May 29, 2003Inventors: Makoto Totani, Toshihiro Miyake, Tomohiro Yokochi, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi, Hajime Nakagawa
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Publication number: 20030079341Abstract: A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.Type: ApplicationFiled: October 31, 2002Publication date: May 1, 2003Inventors: Toshihiro Miyake, Kazuyuki Deguchi, Yoshitaro Yazaki, Hiroaki Maeda, Mitsutoshi Miyazaki, Makoto Totani, Akinari Higashida, Hiroki Miyagawa
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Patent number: 6527162Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.Type: GrantFiled: July 19, 2001Date of Patent: March 4, 2003Assignee: Denso CorporationInventors: Makoto Totani, Toshihiro Miyake, Tomohiro Yokochi, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi, Hajime Nakagawa