Patents by Inventor Mamoru NISHIZAKI
Mamoru NISHIZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250069647Abstract: An example apparatus includes: first and second sense amplifier regions arranged such that the memory mat is sandwiched between the first and second sense amplifier regions in a first direction, the first and second sense amplifier regions including first and second sense amplifiers, respectively; and first and second array control circuit regions arranged in the first direction, the first and second array control circuit regions including first and second array control circuits configured to control the first and second sense amplifiers, respectively. Each of the first and second array control circuit regions includes a first well region in which a first circuit part of each of the first and second array control circuits are arranged, respectively. The first well region of the first array control circuit region and the first well region of the second array control circuit region are integrated.Type: ApplicationFiled: June 20, 2024Publication date: February 27, 2025Applicant: MICRON TECHNOLOGY, INC.Inventors: Hirokazu Ato, Mamoru Nishizaki
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Publication number: 20250037754Abstract: An example apparatus includes first and second memory cell arrays arranged in a first direction; and a plurality of first and second sub word line drivers, a plurality of main word line drivers, and a plurality of level shift circuits each arranged on an intermediate region between the first and second memory cell arrays. The first and second sub word line drivers are arranged in a second direction and along the first and second memory cell array, respectively. The main word line drivers are arranged in the second direction and adjacently along the plurality of second sub word line drivers. The level shift circuits are arranged in the second direction and adjacently along the plurality of first sub word line drivers. The level shift circuits are configured to provide voltage-level-shifted signals to the plurality of main word line drivers, respectively.Type: ApplicationFiled: June 20, 2024Publication date: January 30, 2025Applicant: MICRON TECHNOLOGY, INC.Inventors: Katsunari Murayama, Mamoru Nishizaki, Manami Mizukane, Hidekazu Noguchi
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Publication number: 20250029650Abstract: An example apparatus includes: a plurality of first regions each including second and third regions; a plurality of main word driver circuits each configured to activate an associated one of a plurality of main word lines responsive to a row address signal; and a voltage control circuit configured to supply a first power voltage to the plurality of main word driver circuits in a first operation mode and a second power voltage different from the first power voltage to the plurality of main word driver circuits in a second operation mode. One or ones of the plurality of main word driver circuits is arranged in the second region included in each of the plurality of first regions. The voltage control circuit is divided into multiple circuit portions arranged in two or more third regions in two or more of the plurality of first regions, respectively.Type: ApplicationFiled: June 20, 2024Publication date: January 23, 2025Applicant: MICRON TECHNOLOGY, INC.Inventors: KEIYA ANDO, Mamoru Nishizaki, KENJI ASAKI
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Patent number: 12094522Abstract: An apparatus that includes: a plurality of first data amplifiers arranged in line in a first direction; a plurality of first read data buses each coupled to a corresponding one of the plurality of first data amplifiers, the plurality of first read data buses having different lengths one another; and a plurality of first write data buses each coupled to the corresponding one of the plurality of first data amplifiers, the plurality of first write data buses having different lengths one another. The plurality of first read data buses and the plurality of first write data buses are alternately arranged in parallel in a second direction vertical to the first direction. The plurality of first read data buses are arranged in longest order and the plurality of first write data buses are arranged in shortest order.Type: GrantFiled: September 29, 2022Date of Patent: September 17, 2024Assignee: MICRON TECHNOLOGY, INC.Inventors: Akeno Ito, Mamoru Nishizaki
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Patent number: 11984188Abstract: Disclosed herein is an apparatus that includes a first wiring layer including a first bit line extending in a first direction, a first sense amplifier configured to amplify a potential of the first bit line, and a first transistor configured to supply an operation voltage to the first sense amplifier when a first control signal supplied to a gate electrode of the first transistor is activated. The first wiring layer further includes a first pattern coupled to the gate electrode of the first transistor and a second pattern having a first section arranged between the first bit line and the first pattern in a second direction perpendicular to the first direction.Type: GrantFiled: April 29, 2022Date of Patent: May 14, 2024Assignee: Micron Technology, Inc.Inventor: Mamoru Nishizaki
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Publication number: 20240112725Abstract: An apparatus that includes: a plurality of first data amplifiers arranged in line in a first direction; a plurality of first read data buses each coupled to a corresponding one of the plurality of first data amplifiers, the plurality of first read data buses having different lengths one another; and a plurality of first write data buses each coupled to the corresponding one of the plurality of first data amplifiers, the plurality of first write data buses having different lengths one another. The plurality of first read data buses and the plurality of first write data buses are alternately arranged in parallel in a second direction vertical to the first direction. The plurality of first read data buses are arranged in longest order and the plurality of first write data buses are arranged in shortest order.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Applicant: MICRON TECHNOLOGY, INC.Inventors: AKENO ITO, MAMORU NISHIZAKI
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Patent number: 11935584Abstract: Drivers for sense amplifiers are disclosed. A driver may include two or more drain areas extending in a first direction and two or more source areas extending in the first direction. The driver may also include a drain interconnection including two or more first drain-interconnection portions which extend in the first direction above the two of more drain areas and one or more second drain-interconnection portions extending in a second direction between the two or more first drain-interconnection portions. The driver may also include a source interconnection including two or more first source-interconnection portions extending in the first direction above the two or more source areas and one or more second source-interconnection portions extending in the second direction between the two or more first source-interconnection portions. Associated systems are also disclosed.Type: GrantFiled: September 27, 2022Date of Patent: March 19, 2024Assignee: Micron Technology, Inc.Inventor: Mamoru Nishizaki
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Publication number: 20230352061Abstract: Disclosed herein is an apparatus that includes a first wiring layer including a first bit line extending in a first direction, a first sense amplifier configured to amplify a potential of the first bit line, and a first transistor configured to supply an operation voltage to the first sense amplifier when a first control signal supplied to a gate electrode of the first transistor is activated. The first wiring layer further includes a first pattern coupled to the gate electrode of the first transistor and a second pattern having a first section arranged between the first bit line and the first pattern in a second direction perpendicular to the first direction.Type: ApplicationFiled: April 29, 2022Publication date: November 2, 2023Applicant: MICRON TECHNOLOGY, INC.Inventor: Mamoru Nishizaki
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Patent number: 11715522Abstract: Disclosed herein is an apparatus that includes a driver circuit including a plurality of first transistors arranged in a first direction; a control circuit including a plurality of second transistors arranged in parallel to the plurality of first transistors, each of the plurality of second transistors being coupled to control an associated one of the first transistors; and a power gating circuit arranged between the driver circuit and the control circuit, the power gating circuit being configured to supply a first power potential to each of the plurality of first transistors.Type: GrantFiled: June 25, 2021Date of Patent: August 1, 2023Assignee: Micron Technology, Inc.Inventors: Akeno Ito, Takayori Hamada, Mamoru Nishizaki
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Publication number: 20230014197Abstract: Drivers for sense amplifiers are disclosed. A driver may include two or more drain areas extending in a first direction and two or more source areas extending in the first direction. The driver may also include a drain interconnection including two or more first drain-interconnection portions which extend in the first direction above the two of more drain areas and one or more second drain-interconnection portions extending in a second direction between the two or more first drain-interconnection portions. The driver may also include a source interconnection including two or more first source-interconnection portions extending in the first direction above the two or more source areas and one or more second source-interconnection portions extending in the second direction between the two or more first source-interconnection portions. Associated systems are also disclosed.Type: ApplicationFiled: September 27, 2022Publication date: January 19, 2023Inventor: Mamoru Nishizaki
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Publication number: 20220415397Abstract: Disclosed herein is an apparatus that includes a driver circuit including a plurality of first transistors arranged in a first direction; a control circuit including a plurality of second transistors arranged in parallel to the plurality of first transistors, each of the plurality of second transistors being coupled to control an associated one of the first transistors; and a power gating circuit arranged between the driver circuit and the control circuit, the power gating circuit being configured to supply a first power potential to each of the plurality of first transistors.Type: ApplicationFiled: June 25, 2021Publication date: December 29, 2022Applicant: MICRON TECHNOLOGY, INC.Inventors: Akeno Ito, Takayori Hamada, Mamoru Nishizaki
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Patent number: 11495282Abstract: Drivers for sense amplifiers are disclosed. A driver may include two or more drain areas extending in a first direction and two or more source areas extending in the first direction. The driver may also include a drain interconnection including two or more first drain-interconnection portions which extend in the first direction above the two of more drain areas and one or more second drain-interconnection portions extending in a second direction between the two or more first drain-interconnection portions. The driver may also include a source interconnection including two or more first source-interconnection portions extending in the first direction above the two or more source areas and one or more second source-interconnection portions extending in the second direction between the two or more first source-interconnection portions. Associated systems are also disclosed.Type: GrantFiled: August 12, 2020Date of Patent: November 8, 2022Assignee: Micron Technology, Inc.Inventor: Mamoru Nishizaki
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Publication number: 20220051712Abstract: Drivers for sense amplifiers are disclosed. A driver may include two or more drain areas extending in a first direction and two or more source areas extending in the first direction. The driver may also include a drain interconnection including two or more first drain-interconnection portions which extend in the first direction above the two of more drain areas and one or more second drain-interconnection portions extending in a second direction between the two or more first drain-interconnection portions. The driver may also include a source interconnection including two or more first source-interconnection portions extending in the first direction above the two or more source areas and one or more second source-interconnection portions extending in the second direction between the two or more first source-interconnection portions. Associated systems are also disclosed.Type: ApplicationFiled: August 12, 2020Publication date: February 17, 2022Inventor: Mamoru Nishizaki
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Patent number: 10896718Abstract: Disclosed herein is an apparatus that includes a first wiring layer including a first power line extending in a first direction, a second wiring layer including second and third power lines extending in a second direction, a third wiring layer including power electrode patterns arranged in the second direction, and a fourth wiring layer including a fourth power line extending in the second direction. The first and second power lines are connected by a first via electrode. The first and third power lines are connected by a second via electrode. The second power line and each of the power electrode patterns are connected by a third via electrode. The third power line and each of the power electrode patterns are connected by a fourth via electrode. The fourth power line and each of the power electrode patterns are connected by a fifth via electrode.Type: GrantFiled: October 18, 2019Date of Patent: January 19, 2021Assignee: Micron Technology, Inc.Inventor: Mamoru Nishizaki
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Publication number: 20200082868Abstract: Disclosed herein is an apparatus that includes a first wiring layer including a first power line extending in a first direction, a second wiring layer including second and third power lines extending in a second direction, a third wiring layer including power electrode patterns arranged in the second direction, and a fourth wiring layer including a fourth power line extending in the second direction. The first and second power lines are connected by a first via electrode. The first and third power lines are connected by a second via electrode. The second power line and each of the power electrode patterns are connected by a third via electrode. The third power line and each of the power electrode patterns are connected by a fourth via electrode. The fourth power line and each of the power electrode patterns are connected by a fifth via electrode.Type: ApplicationFiled: October 18, 2019Publication date: March 12, 2020Applicant: MICRON TECHNOLOGY, INC.Inventor: Mamoru Nishizaki
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Patent number: 10580463Abstract: The present disclosure relates generally to the field of power supply wiring in a semiconductor device. In one embodiment, a semiconductor device is disclosed that includes, an uppermost metal layer including a power supply enhancing wiring, power supply wiring coupled to the power supply enhancing wiring through a via between the uppermost metal layer and a metal layer underlying the uppermost metal layer, and at least one memory device component disposed in vertical alignment with the via between the uppermost metal layer and the metal layer underlying the uppermost metal layer.Type: GrantFiled: April 10, 2019Date of Patent: March 3, 2020Assignee: Micron Technology, Inc.Inventor: Mamoru Nishizaki
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Patent number: 10468090Abstract: Disclosed herein is an apparatus that includes a first wiring layer including a first power line extending in a first direction, a second wiring layer including second and third power lines extending in a second direction, a third wiring layer including power electrode patterns arranged in the second direction, and a fourth wiring layer including a fourth power line extending in the second direction. The first and second power lines are connected by a first via electrode. The first and third power lines are connected by a second via electrode. The second power line and each of the power electrode patterns are connected by a third via electrode. The third power line and each of the power electrode patterns are connected by a fourth via electrode. The fourth power line and each of the power electrode patterns are connected by a fifth via electrode.Type: GrantFiled: September 10, 2018Date of Patent: November 5, 2019Assignee: Micron Technology, Inc.Inventor: Mamoru Nishizaki
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Publication number: 20190295605Abstract: The present disclosure relates generally to the field of power supply wiring in a semiconductor device. In one embodiment, a semiconductor device is disclosed that includes, an uppermost metal layer including a power supply enhancing wiring, power supply wiring coupled to the power supply enhancing wiring through a via between the uppermost metal layer and a metal layer underlying the uppermost metal layer, and at least one memory device component disposed in vertical alignment with the via between the uppermost metal layer and the metal layer underlying the uppermost metal layer.Type: ApplicationFiled: April 10, 2019Publication date: September 26, 2019Applicant: MICRON TECHNOLOGY, INC.Inventor: Mamoru Nishizaki
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Patent number: 10339980Abstract: Apparatuses for controlling defective bit lines in a semiconductor device are described. An example apparatus includes: a first region including a plurality of bit lines, a plurality of word lines and a plurality of memory cells, each memory cell is coupled to an associated bit line and an associated word line; a second region including a plurality of sense amplifiers, each sense amplifier includes a sense node and a column selection switch coupled to the sense node; a third region including a plurality of bleeder circuits, and disposed between the first and second regions; and a plurality of column selection lines. Each bit line from the first region to the second region is coupled to the sense node of an associated one of the plurality of sense amplifiers, and each column selection line from the column selection switch is coupled to an associated bleeder circuit.Type: GrantFiled: July 6, 2018Date of Patent: July 2, 2019Assignee: Micron Technology, Inc.Inventor: Mamoru Nishizaki
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Patent number: 10304497Abstract: The present disclosure relates generally to the field of power supply wiring in a semiconductor device. In one embodiment, a semiconductor device is disclosed that includes, an uppermost metal layer including a power supply enhancing wiring, power supply wiring coupled to the power supply enhancing wiring through a via between the uppermost metal layer and a metal layer underlying the uppermost metal layer, and at least one memory device component disposed in vertical alignment with the via between the uppermost metal layer and the metal layer underlying the uppermost metal layer.Type: GrantFiled: September 19, 2017Date of Patent: May 28, 2019Assignee: Micron Technology, Inc.Inventor: Mamoru Nishizaki