Abstract: Improved semiconductor devices comprising metal gate electrodes are formed with reduced performance variability by reducing the initial high dopant concentration at the top portion of the silicon layer overlying the metal layer. Embodiments include reducing the dopant concentration in the upper portion of the silicon layer, by implanting a counter-dopant into the upper portion of the silicon layer, removing the high dopant concentration portion and replacing it with undoped or lightly doped silicon, and applying a gettering agent to the upper surface of the silicon layer to form a thin layer with the gettered dopant, which layer can be removed or retained.

Abstract: A short channel semiconductor device is formed with halo regions that are separated from the bottom of the gate electrode and from each other. Embodiments include implanting halo regions after forming source/drain regions and source/drain extension regions. An embodiment includes forming source/drain extension regions in a substrate, forming source/drain regions in the substrate, forming halo regions under the source/drain extension regions, after forming the source drain regions, and forming a gate electrode on the substrate between the source/drain regions. By forming the halo regions after the high temperature processing involved informing the source/drain and source/drain extension regions, halo diffusion is minimized, thereby maintaining sufficient distance between halo regions and reducing short channel NMOS Vt roll-off.

Abstract: Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods are provided. In an embodiment, a method for fabricating a semiconductor device comprises forming a gate stack comprising a first gate stack-forming layer overlying a semiconductor substrate and forming first sidewall spacers about sidewalls of the gate stack. After the step of forming the first sidewall spacers, a portion of the first gate stack-forming layer is exposed. The exposed portion is anisotropically etched using the gate stack and the first sidewall spacers as an etch mask. Second sidewall spacers are formed adjacent the first sidewall spacers after the step of anisotropically etching.

Abstract: Apparatus for semiconductor device structures and related fabrication methods are provided. One method for fabricating a semiconductor device structure involves forming a gate structure overlying a region of semiconductor material, wherein the width of the gate structure is aligned with a <100> crystal direction of the semiconductor material. The method continues by forming recesses about the gate structure and forming a stress-inducing semiconductor material in the recesses.

Abstract: A high-k metal gate electrode is formed with reduced gate voids. An embodiment includes forming a replaceable gate electrode, for example of amorphous silicon, having a top surface and a bottom surface, the top surface being larger than the bottom surface, removing the replaceable gate electrode, forming a cavity having a top opening larger than a bottom opening, and filling the cavity with metal. The larger top surface may be formed by etching the bottom portion of the amorphous silicon at greater temperature than the top portion, or by doping the top and bottom portions of the amorphous silicon differently such that the bottom has a greater lateral etch rate than the top.

Abstract: A semiconductor is formed on an SOI substrate, such as an extremely thin SOI (ETSOI) substrate, with increased extension thickness. Embodiments include semiconductor devices having an epitaxially formed silicon-containing layer, such as embedded silicon germanium (eSiGe), on the SOI substrate. An embodiment includes forming an SOI substrate, epitaxially forming a silicon-containing layer on the SOI substrate, and forming a gate electrode on the epitaxially formed silicon-containing layer. After gate spacers and source/drain regions are formed, the gate electrode and underlying silicon-containing layer are removed and replaced with a high-k metal gate. The use of an epitaxially formed silicon-containing layer reduces SOI thickness loss due to fabrication process erosion, thereby increasing extension thickness and lowering extension resistance.

Abstract: Methods and devices are provided for fabricating a semiconductor device having barrier regions within regions of insulating material resulting in outgassing paths from the regions of insulating material. A method comprises forming a barrier region within an insulating material proximate the isolated region of semiconductor material and forming a gate structure overlying the isolated region of semiconductor material. The barrier region is adjacent to the isolated region of semiconductor material, resulting in an outgassing path within the insulating material.

Abstract: An eFUSE is formed with a gate stack including a layer of embedded silicon germanium (eSiGe) on the polysilicon. An embodiment includes forming a shallow trench isolation (STI) region in a substrate, forming a first gate stack on the substrate for a PMOS device, forming a second gate stack on an STI region for an eFUSE, forming first embedded silicon germanium (eSiGe) on the substrate on first and second sides of the first gate stack, and forming second eSiGe on the second gate stack. The addition of eSiGe to the eFUSE gate stack increases the distance between the eFUSE debris zone and an underlying metal gate, thereby preventing potential shorting.

Abstract: Improved semiconductor devices comprising metal gate electrodes are formed with reduced performance variability by reducing the initial high dopant concentration at the top portion of the silicon layer overlying the metal layer. Embodiments include reducing the dopant concentration in the upper portion of the silicon layer, by implanting a counter-dopant into the upper portion of the silicon layer, removing the high dopant concentration portion and replacing it with undoped or lightly doped silicon, and applying a gettering agent to the upper surface of the silicon layer to form a thin layer with the gettered dopant, which layer can be removed or retained.

Abstract: Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods are provided. In an embodiment, a method for fabricating a semiconductor device comprises forming a gate stack comprising a first gate stack-forming layer overlying a semiconductor substrate and forming first sidewall spacers about sidewalls of the gate stack. After the step of forming the first sidewall spacers, a portion of the first gate stack-forming layer is exposed. The exposed portion is anisotropically etched using the gate stack and the first sidewall spacers as an etch mask. Second sidewall spacers are formed adjacent the first sidewall spacers after the step of anisotropically etching.

Abstract: Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods are provided. In an embodiment, a method for fabricating a semiconductor device comprises forming a gate stack comprising a first gate stack-forming layer overlying a semiconductor substrate and forming first sidewall spacers about sidewalls of the gate stack. After the step of forming the first sidewall spacers, a portion of the first gate stack-forming layer is exposed. The exposed portion is anisotropically etched using the gate stack and the first sidewall spacers as an etch mask. Second sidewall spacers are formed adjacent the first sidewall spacers after the step of anisotropically etching.

Abstract: Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods are provided. In an embodiment, a method for fabricating a semiconductor device comprises forming a gate stack comprising a first gate stack-forming layer overlying a semiconductor substrate and forming first sidewall spacers about sidewalls of the gate stack. After the step of forming the first sidewall spacers, a portion of the first gate stack-forming layer is exposed. The exposed portion is anisotropically etched using the gate stack and the first sidewall spacers as an etch mask. Second sidewall spacers are formed adjacent the first sidewall spacers after the step of anisotropically etching.

Abstract: Semiconductor device structures and related fabrication methods are provided herein. One fabrication method relates to the formation of conductive contact plugs for a semiconductor device. The method begins by providing a semiconductor device structure having a conductive contact region, a layer of insulating material overlying the conductive contact region, and a via formed in the layer of insulating material and terminating at the conductive contact region. The fabrication process then deposits a first electrically conductive material on the semiconductor device structure such that the first electrically conductive material at least partially fills the via. Then, the process anisotropically etches a portion of the first electrically conductive material located in the filled via, resulting in a lined via. Thereafter, the process deposits a second electrically conductive material on the semiconductor device structure such that the second electrically conductive material at least partially fills the lined via.

Abstract: The system is comprised of a microcellular underlay to increase the coverage of a macrocellular overlay system. The frequencies are assigned to the microcells by interleaved frequency segregation. Channels are selected from the macrocell frequency groups based on a minimum channel separation from the other channels in the microcell frequency group. The channels in the microcell frequency group that are greater than a minimum channel separation from the channels in the macrocell sector i overlay are assigned to the microcell sector i.