Patents by Inventor MAN-ZHI PENG
MAN-ZHI PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11917278Abstract: A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.Type: GrantFiled: April 11, 2022Date of Patent: February 27, 2024Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Man-Zhi Peng, Rui-Wu Liu, Jia-He Li
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Patent number: 11665820Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.Type: GrantFiled: November 29, 2021Date of Patent: May 30, 2023Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Man-Zhi Peng, Rui-Wu Liu, Ming-Jaan Ho
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Patent number: 11510319Abstract: A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.Type: GrantFiled: June 1, 2021Date of Patent: November 22, 2022Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Rui-Wu Liu, Ming-Jaan Ho, Man-Zhi Peng
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Patent number: 11483938Abstract: A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.Type: GrantFiled: December 14, 2018Date of Patent: October 25, 2022Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Rui-Wu Liu, Ming-Jaan Ho, Man-Zhi Peng
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Publication number: 20220336230Abstract: An interposer, which is used to connect two circuit boards, includes an inner structure (10), an outer structure (20), and a protective layer (50). The inner structure (10) includes a first base layer (11) and a first wiring layer (131) formed on the first base layer (11). The outer structure (20) includes a second base layer (21) and a second wiring layer (231) formed on the second base layer (21). An end portion of at least wiring line of the first wiring layer (131) and the second wiring layer (231) extends to a sidewall of the interposer (100). An end of another wiring line extends to the other sidewall of the interposer (100). The first wiring layer (131) is electrically connected to the second wiring layer (231) by a conductive blind hole (41).Type: ApplicationFiled: September 27, 2019Publication date: October 20, 2022Inventors: MAN-ZHI PENG, RUI-WU LIU, SI XIONG, LIN-JIE GAO
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Publication number: 20220232152Abstract: A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.Type: ApplicationFiled: April 11, 2022Publication date: July 21, 2022Inventors: MAN-ZHI PENG, RUI-WU LIU, JIA-HE LI
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Patent number: 11310922Abstract: A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.Type: GrantFiled: September 22, 2020Date of Patent: April 19, 2022Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Rui-Wu Liu, Man-Zhi Peng
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Patent number: 11296444Abstract: A board-to-board connection structure includes a first circuit board, a second circuit board, and a connector. The first circuit board includes a first base layer and a first outer circuit layer. The second circuit board includes a second base layer and a second outer circuit layer. The connector electrically couples the first circuit board and the second circuit board. The connector includes a housing, a first electrical connection portion, and a second electrical connection portion. A side surface of the first circuit board includes a first conductive layer electrically coupled to the first outer circuit layer. The connector is coupled to the first conductive layer through the first electrical connection portion. The second circuit board is located in the housing, and the second electrical connection portion is electrically coupled to the second outer circuit layer.Type: GrantFiled: September 27, 2020Date of Patent: April 5, 2022Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Ming-Jaan Ho, Man-Zhi Peng
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Publication number: 20220087020Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.Type: ApplicationFiled: November 29, 2021Publication date: March 17, 2022Inventors: MAN-ZHI PENG, RUI-WU LIU, MING-JAAN HO
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Publication number: 20220061167Abstract: A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.Type: ApplicationFiled: September 22, 2020Publication date: February 24, 2022Inventors: RUI-WU LIU, MAN-ZHI PENG
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Publication number: 20220052471Abstract: A board-to-board connection structure includes a first circuit board, a second circuit board, and a connector. The first circuit board includes a first base layer and a first outer circuit layer. The second circuit board includes a second base layer and a second outer circuit layer. The connector electrically couples the first circuit board and the second circuit board. The connector includes a housing, a first electrical connection portion, and a second electrical connection portion. A side surface of the first circuit board includes a first conductive layer electrically coupled to the first outer circuit layer. The connector is coupled to the first conductive layer through the first electrical connection portion. The second circuit board is located in the housing, and the second electrical connection portion is electrically coupled to the second outer circuit layer.Type: ApplicationFiled: September 27, 2020Publication date: February 17, 2022Inventors: MING-JAAN HO, MAN-ZHI PENG
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Patent number: 11252818Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.Type: GrantFiled: April 23, 2020Date of Patent: February 15, 2022Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Rui-Wu Liu, Ming-Jaan Ho, Lei Zhou, Man-Zhi Peng
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Publication number: 20210289628Abstract: A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.Type: ApplicationFiled: June 1, 2021Publication date: September 16, 2021Inventors: Rui-Wu LIU, Ming-Jaan HO, Man-Zhi PENG
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Publication number: 20210235581Abstract: Disclosure provides an adaptor board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.Type: ApplicationFiled: April 23, 2019Publication date: July 29, 2021Inventors: MAN-ZHI PENG, RUI-WU LIU, MING-JAAN HO
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Patent number: 11051404Abstract: A method for connecting stacked circuit boards provides an insulation base as a hollowed annular plate and which has a first surface, a second surface, and a lateral surface. The insulating base defines stepped first grooves on the first surface, stepped second grooves on the second surface, and third grooves on the lateral surface. Insulating base is plated to deposit first pads in the first grooves, second pads in the second grooves, and wiring portions in the third grooves to connect first and second pads. Conductive ink layer is coated on first and second pads, and protective ink layer is coated on wiring portions and insulating base except for first and second pads. First and second circuit boards are provided for attachment to first and second pads respectively. A connecting structure is also provided.Type: GrantFiled: January 4, 2019Date of Patent: June 29, 2021Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Rui-Wu Liu, Ming-Jaan Ho, Man-Zhi Peng
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Patent number: 10910300Abstract: A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.Type: GrantFiled: August 30, 2019Date of Patent: February 2, 2021Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Man-Zhi Peng, Rui-Wu Liu, Ming-Jaan Ho
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Publication number: 20210028099Abstract: A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.Type: ApplicationFiled: August 30, 2019Publication date: January 28, 2021Inventors: MAN-ZHI PENG, RUI-WU LIU, MING-JAAN HO
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Patent number: 10863620Abstract: A bendable circuit board includes a first rigid wiring board, a first flexible film, a circuit substrate, a second rigid wiring board, a second flexible film, and a third rigid wiring board which are stacked in said order. The circuit substrate is a rigid double-sided circuit board. The first rigid wiring board defines a first window area in which the first flexible film is exposed, and the third rigid wiring board defines a second window area in which the second flexible film is exposed. The present disclosure further provides a method for manufacturing the bendable circuit board.Type: GrantFiled: May 27, 2020Date of Patent: December 8, 2020Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Ming-Jaan Ho, Hao-Wen Zhong, Biao Li, Man-Zhi Peng
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Patent number: 10849229Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.Type: GrantFiled: January 9, 2019Date of Patent: November 24, 2020Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Rui-Wu Liu, Ming-Jaan Ho, Lei Zhou, Man-Zhi Peng
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Publication number: 20200253056Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.Type: ApplicationFiled: April 23, 2020Publication date: August 6, 2020Inventors: RUI-WU LIU, MING-JAAN HO, LEI ZHOU, MAN-ZHI PENG